Circuit board and method for manufacturing the same

1. A circuit board, comprising:

a substrate;

a first dielectric layer disposed on the substrate;

an adhesive layer bonded to the first dielectric layer and having a top surface opposite to the substrate;

a second dielectric layer disposed on the adhesive layer and having at least one first through hole;

a first conductive line located in the first through hole of the second dielectric layer, wherein a lowermost surface of the first conductive line is in contact with the top surface of the adhesive layer and the first conductive line is above an entirety of the adhesive layer; and

a plurality of second conductive lines penetrating through the adhesive layer and the second dielectric layer and being in contact with the first dielectric layer, wherein the first conductive line is located between adjacent two of the second conductive lines.

2. The circuit board of claim 1 , further comprising at least one conductive contact and a conductive line layer between the substrate and the first dielectric layer, wherein the conductive contact penetrates the first dielectric layers and is in contact with the conductive line layer, the adhesive layer has a second through hole, and an inner wall of the second through hole is in contact with the conductive contact.

3. The circuit board of claim 1 , wherein the first conductive line has a first line width along a direction parallel to the substrate, the first conductive line is spaced from the second conductive line by a distance, and the distance is greater than the first line width.