Wafer lift ring system for wafer transfer
A substrate support includes an inner portion arranged to support a substrate, a lift ring surrounding the inner portion, the lift ring arranged to support an outer edge of the substrate, and a controller configured to control an actuator to adjust a height of the lift ring relative to the inner portion by selectively raising and lowering at least one of the lift ring and the inner portion of the substrate support. To adjust the height of the lift ring, the controller selectively adjusts the height of the lift ring to a transfer height for transfer of the substrate to the lift ring and retrieval of the substrate from the lift ring, and adjusts the height of the lift ring to a processing height for processing of the substrate.
1. A substrate support, comprising:
an inner portion arranged to support a substrate;
a lift ring surrounding the inner portion, the lift ring arranged to support an outer edge of the substrate wherein
the lift ring includes a C-shaped portion and a bridge portion,
the C-shaped portion is moveable with respect to the inner portion and the bridge portion is stationary with respect to the inner portion,
the C-shaped portion includes an opening when the bridge portion is separated from the C-shaped portion, and
ends of the C-shaped portion overlap respective ends of the bridge portion; and
a controller configured to control an actuator to adjust a height of the lift ring relative to the inner portion by selectively raising and lowering at least one of (i) the lift ring and (ii) the inner portion of the substrate support,
wherein, to adjust the height of the lift ring, the controller selectively
adjusts the height of the lift ring to a transfer height for transfer of the substrate to the lift ring and retrieval of the substrate from the lift ring, and
adjusts the height of the lift ring to a processing height for processing of the substrate, wherein the processing height is lower than the transfer height.
2. The substrate support of claim 1 , wherein the substrate support includes an outer ring surrounding the inner portion, wherein the outer ring houses at least one lift pin arranged to engage a bottom surface of the lift ring.
3. The substrate support of claim 1 , wherein an inner edge of the lift ring includes a lip arranged to support the substrate.
4. The substrate support of claim 1 , wherein an inner edge of the lift ring includes a recess arranged to receive the substrate.
5. The substrate support of claim 1 , wherein a bottom surface of the lift ring includes at least one recess arranged to receive a lift pin housed in the substrate support.
6. The substrate support of claim 1 , wherein joints between the C-shaped portion and the bridge portion form right angles with respective inner and outer edges of the C-shaped portion and the bridge portion.
7. A method of operating a substrate support, the method comprising:
providing a lift ring, wherein the lift ring is arranged to surround an inner portion of the substrate support and to support an outer edge of a substrate, wherein
the lift ring includes a C-shaped portion and a bridge portion,
the C-shaped portion is moveable with respect to the inner portion and the bridge portion is stationary with respect to the inner portion,
the C-shaped portion includes an opening when the bridge portion is separated from the C-shaped portion, and
ends of the C-shaped portion overlap respective ends of the bridge portion; and
controlling an actuator to adjust a height of the lift ring relative to the inner portion by selectively raising and lowering at least one of (i) the lift ring and (ii) the inner portion of the substrate support,
wherein adjusting the height of the lift ring includes selectively
adjusting the height of the lift ring to a transfer height for transfer of the substrate to the lift ring and retrieval of the substrate from the lift ring, and
adjusting the height of the lift ring to a processing height for processing of the substrate, wherein the processing height is lower than the transfer height.
8. The method of claim 7 , further comprising providing an outer ring surrounding the inner portion, wherein the outer ring houses at least one lift pin arranged to engage a bottom surface of the lift ring.
9. The method of claim 7 , wherein an inner edge of the lift ring includes a lip arranged to support the substrate.
10. The method of claim 7 , wherein an inner edge of the lift ring includes a recess arranged to receive the substrate.
11. The method of claim 7 , wherein a bottom surface of the lift ring includes at least one recess arranged to receive a lift pin housed in the substrate support.
12. The method of claim 7 , wherein joints between the C-shaped portion and the bridge portion form right angles with respective inner and outer edges of the C-shaped portion and the bridge portion.