IP Library › Granted Patent US 10,446,192
Granted Patent B2
US 10,446,192 · App. 16/058,040 · Granted Oct 15, 2019

Electronic apparatus with air duct and fan

Inventors: Kenji Hirose (Tokyo, JP); Kazuto Nakagawa (Kanagawa, JP); Shinya Tsuchida (Tokyo, JP); Yasuhiro Ootori (Kanagawa, JP)
Assignee: Sony Interactive Entertainment Inc.
G11B33/142G06F1/1616G06F1/181G06F1/184G06F1/188G06F1/20H05K7/1422H05K7/20136H01L23/467
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Quick Facts
Patent No.
US 10,446,192
App. No.
16/058,040
Granted
Oct 15, 2019
Kind
B2
Abstract

An electronic apparatus includes a plurality of parts, a frame having an outer periphery surrounding the plurality of parts and formed from resin, a circuit board disposed at one side in a first direction with respect to the plurality of parts, a chassis disposed at the one side in the first direction with respect to the plurality of parts, and formed from metal, and a metal plate disposed at the other side in the first direction with respect to at least one of the plurality of parts and attached to the frame.

Claims (14)

1. An electronic apparatus, comprising:

a cover defining an internal volume therein;

an electronic circuit disposed within the internal volume of the cover;

an air inlet through the cover permitting air flow to enter the internal volume of the cover;

an air duct including a plurality of sides defining an air flow channel from the air inlet to the electronic circuit, wherein at least one of the sides of the air duct is formed from metal and at least one of the sides of the air duct is formed from a resin material;

an air exhaust through the cover, such that an air flow path of cooling air is drawn into the air inlet, through the air duct, at least one of over and through the electronic circuit, and out of the air exhaust; and

a fan urging the cooling air through the air duct and at least one of over and through the electronic circuit,

wherein two opposing sides of the air duct are formed from metal and at least partially cover the fan.

2. The electronic apparatus of claim 1 , wherein opposing sides of the air duct are formed from metal.

3. The electronic apparatus of claim 1 , wherein opposing sides of the air duct are formed from resin.

4. The electronic apparatus of claim 1 , wherein two opposing sides of the air duct are formed from metal and an adjacent two opposing sides of the air duct are formed from resin.

5. The electronic apparatus of claim 1 , wherein the electronic circuit includes a power supply for the electronic apparatus.

6. The electronic apparatus of claim 1 , wherein two adjacent opposing sides of the air duct are formed from resin.

7. The electronic apparatus according to claim 1 , further comprising a heatsink in thermal communication with the electronic circuit and being disposed in the air flow path, such that the cooling air flows over the heatsink.

Priority Claims (1)
JP 2016-073336 · Mar 31, 2016 · national
Continuity (3)
Continuation 15827046 · Nov 30, 2017
Continuation 15458556 · Mar 14, 2017
Related Publication 20180350408A1 · Dec 6, 2018
Cited By (2)
US 12,253,890 US 12,298,823