Memory module including battery
A memory module may include a module substrate having first and second surfaces facing away from each other, a plurality of first memories mounted over one or more of the first and second surfaces, one or more second memories and a controller each mounted over one of the first and second surfaces of the module substrate, and a plurality of batteries mounted over one or more of the first and second surfaces of the module substrate.
1. A memory module comprising:
a module substrate;
a plurality of first memories mounted over the module substrate, wherein each of the first memories has first surface facing the module substrate and second surface opposite to the first surface;
a second memory mounted over the module substrate;
a controller mounted over the module substrate for enabling data transmission between the first memories and the second memory;
a battery mounted on the first memories, wherein the battery has a bottom surface facing the first memories, a top surface opposite to the bottom surface, and side surfaces connecting between the bottom surface and the top surface; and
a heat sink interposed between the second surface of the first memories and the bottom surface of the battery leaving expose the top and side surfaces of the battery.
2. The memory module according to claim 1 , further comprising:
a thermal interface material interposed between the heat sink and the battery.
3. The memory module according to claim 1 , further comprising:
a switch mounted over the module substrate for turning on the first memories in response to a control signal from the controller.
4. The memory module according to claim 1 , wherein the battery has characteristic of a super capacitor structure.
5. The memory module according to claim 1 , wherein the first memories comprise DRAM, the second memory comprises a NAND Flash memory, and the controller comprises an NVDIMM controller.
6. A memory module comprising:
a module substrate having first and second surfaces facing away from each other;
a plurality of first memories mounted over both the first and second surfaces of the module substrate;
a second memory mounted over one of the first and second surfaces of the module substrate;
a controller mounted over one of the first and second surfaces of the module substrate for enabling data transmission between the first memories and the second memory;
a plurality of batteries mounted over both the first and second surfaces of the module substrate for providing power to the memory module; and
a heat sink interposed between the plurality of first memories and the plurality of batteries.
7. The memory module according to claim 6 , wherein the first memories are mounted over the first and second surfaces of the module substrate other than a center portion thereof on both sides of the center portion of the module substrate.
8. The memory module according to claim 7 , wherein the second memory is mounted over the center portion of the second surface of the module substrate,
the controller is mounted over the center portion of the first surface of the module substrate.
9. The memory module according to claim 8 , further comprising:
a register clock driver mounted over the first surface of the module substrate, wherein the register clock driver is spaced apart from the controller.
10. The memory module according to claim 6 , further comprising:
switches mounted over both the first and second surfaces of the module substrate for turning on the first memories in response to a control signal from the controller.
11. The memory module according to claim 6 , wherein the plurality of batteries are mounted over the first memories mounted on the first and second surfaces of the module substrate.
12. The memory module according to claim 6 , wherein the heat sink includes a front surface portion disposed on the first surface of the module substrate, a rear surface portion disposed on the second surface of the module substrate, and a connection portion disposed on an edge of the module substrate to connect the front surface portion and the rear surface portion to each other.
13. The memory module according to claim 6 , further comprising:
a thermal interface material interposed between the heat sink and the batteries.
14. The memory module according to claim 6 , wherein the module substrate comprises short sides along a first direction and long sides along a second direction.
15. The memory module according to claim 14 , wherein the module substrate comprises a plurality of electrode pads arranged on both sides of the module substrate along an edge in the second direction, and wherein the plurality of electrode pads fits into a socket of a main system board.
16. The memory module according to claim 6 , wherein the first memories comprise DRAM, the second memory comprises a NAND Flash memory, and the controller comprises an NVDIMM controller.
17. An electronic system including a memory module,
the memory module comprising:
a module substrate;
a plurality of first memories mounted over the module substrate, wherein each of the first memories has first surface facing the module substrate and second surface opposite to the first surface;
a second memory mounted over the module substrate;
a controller mounted over the module substrate for enabling data transmission between the first memories and the second memory;
a battery mounted on the first memories, wherein the battery has a bottom surface facing the first memories, a top surface opposite to the bottom surface, and side surfaces connecting between the bottom surface and the top surface; and
a heat sink interposed between the second surface of the first memories and the bottom surface of the battery leaving expose the top and side surfaces of the battery.