Multilayer electronic component
The present invention relates to a multilayer electronic component which includes an element body where a plurality of internal electrode layers and dielectric layers are alternately laminated. Insulating layers are disposed on a pair of side surfaces of the element body, facing each other. The insulating layers contain a glass composition and a ceramic composition.
1. A multilayer electronic component comprising an element body where a plurality of internal electrode layers and dielectric layers are alternately laminated, wherein
the dielectric layers are comprised of dielectric material having a perovskite structure as a main composition,
an insulating layer is disposed on at least one side surface of the element body, wherein the at least one side surface is a surface parallel to a lamination direction of the plurality of internal electrode layers and dielectric layers, and a width from an end surface of an element body of the component to an external surface of the insulating layer in a direction perpendicular to the lamination direction is from 0.5 to 30 μm, and
the insulating layer comprises a glass composition and a ceramic composition wherein when the whole insulating layer is 100 wt %, a content of the ceramic composition is 10-70 wt %.
2. The multilayer electronic component according to claim 1 , wherein the ceramic composition comprises oxides containing at least one element from a group of Al, Zr, Ti, Ce, Fe, Mn, Cu, Co and Zn.
3. The multilayer electronic component according to claim 2 , wherein when the whole glass composition is 100 wt %, the glass composition comprises 35-75 wt % of SiO 2 .
4. The multilayer electronic component according to claim 3 , wherein when the whole glass composition is 100 wt %, the glass composition comprises 10-35 wt % of an alkali metal.
5. The multilayer electronic component according to claim 2 , wherein when the whole glass composition is 100 wt %, the glass composition comprises 10-35 wt % of an alkali metal.
6. The multilayer electronic component according to claim 1 , wherein when the whole glass composition is 100 wt %, the glass composition comprises 35-75 wt % of SiO 2 .
7. The multilayer electronic component according to claim 6 , wherein when the whole glass composition is 100 wt %, the glass composition comprises 10-35 wt % of an alkali metal.
8. The multilayer electronic component according to claim 1 , wherein when the whole glass composition is 100 wt %, the glass composition comprises 10-35 wt % of an alkali metal.
9. The multilayer electronic component according to claim 1 , wherein when the whole glass composition is 100 wt %, the glass composition comprises 10-50 wt % of BaO.
10. The multilayer electronic component according to claim 1 , wherein when the whole glass composition is 100 wt %, the glass composition comprises 1-10 wt % of Al 2 O 3 .
11. The multilayer electronic component according to claim 1 , wherein the dielectric material having a perovskite structure is represented by chemical formula ABO 3 , wherein A is at least one element chosen from a group consisting of Ca, Ba and Sr, and B is at least one element chosen from a group consisting of Ti and Zr.
12. The multilayer electronic component according to claim 1 , wherein when the whole insulating layer is 100 wt %, a content of the ceramic composition is 11-62 wt %.
13. The multilayer electronic component according to claim 1 , wherein when the whole insulating layer is 100 wt %, a content of the ceramic composition is 30-60 wt %.
14. The multilayer electronic component according to claim 1 , wherein when the whole insulating layer is 100 wt %, a content of the ceramic composition is 40-56 wt %.