Semiconductor device and method for fabricating the same
A semiconductor device and a method for fabricating the same are provided. The semiconductor device includes: a substrate, a bonding metal layer, a reflective layer, a first conductive layer, an active layer, a second conductive layer, first electrode(s) and second electrode(s). The first electrode(s) extends, from one side of the bonding metal layer away from the substrate, to the first conductive layer, to be connected with the bonding metal layer and the first conductive layer. The second electrode(s) penetrates through the substrate and the bonding metal layer to be in contact with the reflective layer. The semiconductor device, forming a structure sharing the first conductive layer, has more uniform illumination and a higher light extraction rate, and eliminates interferences between pixel units, achieves better uniformity of emitted light wavelength and makes distribution of electric current flowing through different pixel units more even.
1. A fabricating method for a semiconductor device, comprising steps of:
successively growing a first conductive layer, an active layer, a second conductive layer and a reflective layer on a base;
forming at least one first filling slot on one side, which is away from said second conductive layer, of said reflective layer, wherein said first filling slot is configured to completely run through said second conductive layer and said active layer and to partially run through said first conductive layer;
growing a layer of an insulation material on one side, which is away from said second conductive layer, of said reflective layer;
fabricating a first electrode in each first filling slot, in such a way that said first electrode is insulated from said reflective layer, said second conductive layer and said active layer, and that said first electrode is connected with said first conductive layer;
forming a bonding metal layer and a substrate at the side, which is away from said second conductive layer, of said reflective layer, wherein said first electrode is configured to successively penetrate through said reflective layer, said second conductive layer and said active layer from one side of said bonding metal layer away from said substrate, and to extend to said first conductive layer, so as to be connected with said bonding metal layer and said first conductive layer;
forming at least one second filling slot from one side, which is away from said reflective layer, of said substrate, with the at least one second filling slot successively running through said substrate and said bonding metal layer; and
fabricating a second electrode in each second filling slot, in such a way that said second electrode is in contact with said reflective layer and insulated from said bonding metal layer and said substrate;
removing said base, and forming at least one groove configured to at least run through said first conductive layer, said active layer, said second conductive layer and said reflective layer, from one side of said first conductive layer away from said active layer, wherein said at least one groove is configured to divide said semiconductor device into different pixel units;
growing an insulation material at the side of said first conductive layer away from said active layer, and forming an insulation layer grown on said first conductive layer and a bottom and sidewalls of said at least one groove; and
etching the insulation material grown on said first conductive layer, and forming a fluorescence powder layer on said first conductive layer.
2. The fabricating method as claimed in claim 1 , wherein the step of fabricating a first electrode in each first filling slot comprises:
filling an insulation material in said first filling slot;
etching the insulation material in said first filling slot to form an accommodation space for accommodating an electrode material; and
filling the electrode material in said accommodation space to form said first electrode, wherein said first electrode is insulated from said reflective layer, said second conductive layer and said active layer by the insulation material remaining in said first filling slot.
3. The fabricating method as claimed in claim 1 , wherein the step of fabricating a second electrode in each second filling slot comprises:
filling an insulation material in said second filling slot;
etching the insulation material in said second filling slot to form an accommodation space for accommodating an electrode material; and
filling the electrode material in said accommodation space to form said second electrode, wherein said second electrode is insulated from said bonding metal layer and said substrate by the insulation material remaining in said second filling slot.