Epitaxial substrate and method for forming the same
An epitaxial substrate and a method for forming the same are disclosed. The epitaxial substrate includes a substrate, a deposition layer, a buffer layer and an epitaxial layer. The deposition layer is directly formed on the substrate, wherein the deposition layer includes a gradient doping concentration, and has a first surface and a second surface which are opposite to each other; the gradient doping concentration has a minimum value at the first surface. The buffer layer is formed on the deposition layer, and an epitaxial layer is formed on the buffer layer. The epitaxial layer is mainly formed of group III-V nitride. The substrate and the deposition layer are formed of homogeneous material. Since the deposition layer is directly formed on the substrate, and the deposition layer and the substrate are formed of a homogeneous material, the epitaxial substrate includes a good heat dissipation efficiency and low leakage current.
1. An epitaxial substrate, comprising:
a substrate;
a deposition layer formed on the substrate directly, wherein the deposition layer includes a gradient doping concentration, and has a first surface and a second surface which are opposite to each other; the gradient doping concentration has a minimum value at the first surface;
a buffer layer formed on the deposition layer; and
an epitaxial layer formed on the buffer layer, and the epitaxial layer is mainly formed of group III-V nitride; wherein, the substrate and the deposition layer are formed of homogeneous material; the deposition layer includes a gradient resistivity which includes a high impedance layer region which has a resistivity at least greater than 1500 ohm-cm;
wherein the high impedance layer region is a part of the deposition layer, and the doping concentration of the deposition layer is less than 10 12 atom/cm 3 .
2. The epitaxial substrate of claim 1 , wherein the gradient resistivity has a maximum value at the first surface of the deposition layer.
3. The epitaxial substrate of claim 1 , wherein a thickness of the high impedance layer region is smaller than or equal to 6 μm.
4. The epitaxial substrate of claim 1 , wherein a thickness of the high impedance layer region is smaller than or equal to 2 μm.
5. The epitaxial substrate of claim 1 , wherein a resistivity of the high impedance layer region is greater than 7000 ohm-cm.
6. The epitaxial substrate of claim 1 , wherein the gradient doping concentration of the deposition layer decreases from the second surface to the first surface.
7. The epitaxial substrate of claim 1 , wherein the dopants of the deposition layer and the substrate are the same.
8. The epitaxial substrate of claim 1 , wherein the deposition layer at least includes a first stacked layer and a second stacked layer, wherein the first stacked layer is disposed on the substrate and between the substrate and the second stacked layer; the second stacked layer is disposed on the first stacked layer.
9. The epitaxial substrate of claim 8 , wherein a doping concentration of the first stacked layer is smaller than or equal to that of the substrate.
10. The epitaxial substrate of claim 8 , wherein the dopants of the first stacked layer and the substrate are different.
11. The epitaxial substrate of claim 8 , wherein the dopants of the first stacked layer and the second stacked layer are different.
12. The epitaxial substrate of claim 8 , wherein the gradient resistivity has a maximum at the first surface of the deposition layer which contacts with the buffer layer.
13. The epitaxial substrate of claim 1 , wherein the substrate is a heavily doped substrate and the doping concentration is equal to or greater than 1×10 18 atom/cm 3 .
14. The epitaxial substrate of claim 8 , wherein the substrate is a heavily doped substrate and the doping concentration is equal to or greater than 1×10 18 atom/cm 3 .
15. A method for forming an epitaxial substrate, comprising:
A. providing a substrate;
B. forming a deposition layer on the substrate, wherein the deposition layer and the substrate are formed of homogeneous material; the deposition layer includes a gradient doping concentration and has a first surface and a second surface which are opposite to each other; the gradient doping concentration has a minimum value at the first surface; the deposition layer includes a gradient resistivity which includes a high impedance layer region having a resistivity at least greater than 1500 ohm-cm; the doping concentration of the deposition layer is less than 10 12 atom/cm 3 ;
C. forming a buffer layer on the deposition layer; and
D. forming an epitaxial layer on the buffer layer, wherein the epitaxial layer is mainly formed of group III-V nitride.
16. The method of claim 15 , wherein the gradient doping concentration of the deposition layer decreases toward the first surface.
17. The method of claim 15 , wherein the dopants of the deposition layer and the substrate are the same.
18. The method of claim 15 , wherein the deposition layer at least includes a first stacked layer and a second stacked layer; the first stacked layer is formed on the substrate first, and the second stacked layer is formed on the first stacked layer in step B.
19. The method of claim 18 , wherein a doping concentration of the first stacked layer is smaller than or equal to that of the substrate.
20. The method of claim 18 , wherein the dopants of the first stacked layer and the substrate are different.
21. The method of claim 18 , wherein the dopants of the first stacked layer and the second stacked layer are different.
22. The method of claim 15 , wherein the substrate is a heavily doped substrate having a doping concentration which is equal to or greater than 1×10 18 atom/cm 3 .
23. The method of claim 18 , wherein the substrate is a heavily doped substrate having a doping concentration which is equal to or greater than 1×10 18 atom/cm 3 .