Display device
A display device and a method of manufacturing a display device are provided. A display device includes a substrate; a display area on the substrate and configured to display an image; a pad portion on at least one edge of the substrate, the pad portion including at least one sink portion; an anisotropic conductive film on the pad portion and filling the at least one sink portion, the anisotropic conductive film spaced apart from an end of the substrate; and a flexible printed circuit board on the anisotropic conductive film and electrically connected to the pad portion.
1. A method of manufacturing a display device, comprising:
providing a substrate, the substrate defining a display area on the substrate and configured to display an image, and a pad portion on at least one edge of the substrate, the pad portion including at least one sink portion;
forming an anisotropic conductive film on the pad portion and filling the at least one sink portion, the anisotropic conductive film spaced apart from an end of the substrate; and
providing a flexible printed circuit board on the anisotropic conductive film and electrically connected to the pad portion,
wherein the pad portion further includes:
a first buffer layer on the substrate;
a second buffer layer on the first buffer layer;
a gate insulating layer on the second buffer layer;
a first line on the gate insulating layer;
an interlayer dielectric layer on the first line;
a second line on the interlayer dielectric layer;
a passivation layer on the second line; and
a pad electrode on the passivation layer.
2. The method of claim 1 , wherein the pad portion includes a plurality of lines extended from the end of the substrate, and wherein the at least one sink portion intersects the plurality of lines.
3. The method of claim 1 , wherein the sink portion includes holes in the second buffer layer, the gate insulating layer, and the first line.
4. The method of claim 1 , wherein the sink portion includes holes in the second buffer layer, the gate insulating layer, and the interlayer dielectric layer.
5. The method of claim 1 , wherein the sink portion includes holes in the gate insulating layer and the first line.
6. The method of claim 1 , wherein the pad portion includes a gate pad portion and a data pad portion, and wherein the sink portion is continuously disposed in each of the gate pad portion and the data pad portion.
7. The method of claim 1 , wherein the pad portion includes a gate pad portion and a data pad portion, and wherein the sink portion is discontinuously disposed in each of the gate pad portion and the data pad portion.
8. The method of claim 1 , wherein the sink portion includes a plurality of sink portions disposed in parallel with the end of the substrate.
9. The method of claim 1 , wherein a width of the sink portion is equal to or greater than 70 μm.
10. A method of manufacturing a display device, comprising:
providing a substrate, the substrate defining a display area on the substrate and configured to display an image, and a pad portion on at least one edge of the substrate, the pad portion including a pad electrode and a sink portion; and
forming an anisotropic conductive film on the pad portion and filling the sink portion,
wherein the sink portion is disposed between the pad electrode and an end of the substrate.
11. The method of claim 10 , wherein the anisotropic conductive film spaced apart from the end of the substrate.
12. The method of claim 10 , further providing a flexible printed circuit board on the anisotropic conductive film and electrically connected to the pad portion.
13. The method of claim 10 , wherein the sink portion disposed in parallel with the end of the substrate.