Symmetric plasma process chamber
Embodiments of the present invention provide a plasma chamber design that allows extremely symmetrical electrical, thermal, and gas flow conductance through the chamber. By providing such symmetry, plasma formed within the chamber naturally has improved uniformity across the surface of a substrate disposed in a processing region of the chamber. Further, other chamber additions, such as providing the ability to manipulate the gap between upper and lower electrodes as well as between a gas inlet and a substrate being processed, allows better control of plasma processing and uniformity as compared to conventional systems.
1. A plasma processing apparatus, comprising:
a lid assembly and a chamber body enclosing a processing region;
a substrate support assembly disposed in the chamber body, wherein the lid assembly comprises:
an upper electrode having a central manifold configured to distribute processing gas received from a first gas inlet tube into the processing region and one or more annular outer manifolds configured to separately distribute processing gas into the processing region; and
an annular ring manifold that is symmetric about a central axis and configured to distribute processing gas received from a second gas inlet tube, and coupled to the one or more annular outer manifolds via a plurality of separate electrically conductive gas tubes that extend between the ring manifold and the upper electrode and are arranged radially and symmetrically outward from the annular ring manifold, the annular ring manifold disposed concentrically around the first gas inlet tube, with the first gas inlet tube passing through the center of the annular ring manifold, and the first gas inlet tube is configured to conduct RF power to the upper electrode,
wherein the annular ring manifold is disposed above and spaced apart from the upper electrode.
2. The plasma processing apparatus of claim 1 , wherein the annular ring manifold is comprised of a conductive material.
3. The plasma processing apparatus of claim 1 , wherein the first gas inlet tube is coaxial with a central axis of the substrate support assembly.
4. The plasma processing apparatus of claim 3 , wherein the annular ring manifold circumscribes the first gas inlet tube.
5. The plasma processing apparatus of claim 4 , wherein the annular ring manifold has a recursive gas path so that gas flows equally from the annular ring manifold into the plurality of separate electrically conductive gas tubes.
6. The plasma processing apparatus of claim 1 , wherein the one or more annular outer manifolds circumscribe the central manifold.
7. The plasma processing apparatus of claim 1 , further comprising:
a first actuation device coupled to the substrate support assembly and configured to vertically move the substrate support assembly; and
a second actuation device coupled to the substrate support assembly and configured to move a plurality of substrate support pins disposed within the substrate support assembly.
8. A lid assembly for a plasma processing apparatus, comprising:
an upper electrode having a central manifold configured to distribute processing gas received from a first gas inlet tube therethrough and one or more outer manifolds configured to separately distribute processing gas therethrough; and
an annular ring manifold that is symmetric about a central axis and configured to distribute processing gas received from a second gas inlet, and coupled to the one or more outer manifolds via a plurality of separate electrically conductive gas tubes that extend between the ring manifold and the upper electrode and are arranged radially and symmetrically outward from the annular ring manifold, the annular ring manifold disposed concentrically around the first gas inlet tube, with the first gas inlet tube passing through the center of the annular ring manifold, and the first gas inlet tube configured to conduct RF power to the upper electrode,
wherein the annular ring manifold is disposed above and spaced apart from the upper electrode.
9. The lid assembly of claim 8 , wherein the annular ring manifold is comprised of a conductive material.
10. The lid assembly of claim 8 , wherein the first gas inlet tube is coaxial with a central axis of the upper electrode.
11. The lid assembly of claim 10 , wherein the annular ring manifold circumscribes the gas inlet tube.
12. The lid assembly of claim 11 , wherein the annular ring manifold has a recursive gas path so that gas flows equally from the annular ring manifold into the plurality of separate electrically conductive gas tubes.
13. The lid assembly of claim 8 , wherein the one or more outer manifolds circumscribe the central manifold.
14. A plasma processing apparatus, comprising:
a lid assembly and a chamber body enclosing a processing region;
a substrate support assembly disposed in the chamber body, wherein the lid assembly comprises:
an upper electrode having a central manifold configured to distribute processing gas received from a first gas inlet tube into the processing region and one or more outer manifolds configured to separately distribute processing gas into the processing region; and
an annular ring manifold that is symmetric about a central axis and configured to distribute processing gas received from a second gas inlet tube, and coupled to the one or more outer manifolds via a plurality of separate electrically conductive gas tubes that extend between the ring manifold and the upper electrode and are arranged radially and symmetrically outward from the annular ring manifold, the annular ring manifold disposed concentrically around the first gas inlet tube, with the first gas inlet tube passing through the center of the annular ring manifold, and the first gas inlet tube is configured to conduct RF power to the upper electrode; and
an exhaust assembly defining an evacuation region within the chamber body, wherein the chamber body includes a plurality of passages symmetrically disposed about the central axis fluidly connecting the processing region with the evacuation region,
wherein the annular ring manifold is disposed above and spaced apart from the upper electrode.
15. The plasma processing apparatus of claim 14 , wherein the chamber body has an exhaust port formed therethrough that is symmetric about the central axis of the substrate support assembly.