IP Library Granted Patent US 10,460,916
Granted Patent B2
US 10,460,916 · App. 15/979,787 · Granted Oct 29, 2019

Real time monitoring with closed loop chucking force control

Inventors: Wendell Glenn Boyd, Jr. (Morgan Hill, CA); Vijay D. Parkhe (San Jose, CA); Matthew James Busche (Santa Clara, CA); Konstantin Makhratchev (Fremont, CA); Masanori Ono (Chiba, JP); Senh Thach (Union City, CA)
Assignee: APPLIED MATERIALS, INC.
H01J37/32697H01L21/67248H01L21/67253H01L21/67259H01L21/6831H01L21/6833H01L22/20H01J37/32724H01J2237/002H01J2237/2007H01J2237/24585H01J2237/332H01J2237/334H01L21/67069H01L21/68742
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Quick Facts
Patent No.
US 10,460,916
App. No.
15/979,787
Granted
Oct 29, 2019
Kind
B2
Abstract

Embodiments disclosed herein include a method for minimizing chucking forces on a workpiece disposed on a electrostatic chuck within a plasma processing chamber. The method begins by placing a workpiece on an electrostatic chuck in a processing chamber. A plasma is struck within the processing chamber. A deflection force is monitored on the workpiece. A chucking voltage is applied at a minimum value. A backside gas pressure is applied at a minimum pressure. The chucking voltage and or backside gas pressure is adjusted such that the deflection force is less than a threshold value. And the chucking voltage and the backside gas pressure are simultaneously ramped up.

Claims (24)

1. A method for minimizing chucking forces on a workpiece disposed on a electrostatic chuck within a plasma processing chamber, the method comprising:

placing a workpiece on an electrostatic chuck in a processing chamber;

striking a plasma within the processing chamber;

monitoring a deflection force on the workpiece;

applying a chucking voltage at a minimum value;

applying a backside gas pressure at a minimum pressure;

adjusting the chucking voltage and or backside gas pressure such that the deflection force is less than a threshold value; and

simultaneously ramping up the chucking voltage and the backside gas pressure.

2. The method of claim 1 , further comprising:

reversing the process for de-chucking.

3. The method of claim 1 , wherein a minimum value of the chucking voltage force is less than a minimum value of the backside gas pressure.

4. The method of claim 1 , wherein the value of the backside gas pressure is less than the value of the chucking voltage force when the workpiece is chucked.

5. The method of claim 1 , wherein the deflection force is between about 50 mTorr and about 50 Torr.

6. The method of claim 5 , wherein the deflection force is about 1 Torr or less.

7. The method of claim 1 , further comprising:

Introducing a small time delay between the striking of the plasma and the chucking the workpiece.

8. The method of claim 7 , wherein the small time delay is between about 200 milliseconds and about 10 seconds.

9. The method of claim 1 , further comprising:

providing a closed loop control of the chucking force and backside gas pressure; and

minimizing the chucking force in response to the closed loop control.

10. The method of claim 1 , further comprising:

adjusting the clamping voltage to the ESC so that the clamping force reaches and maintains a target total clamping force.

11. The method of claim 1 , wherein applying the chucking voltage at the minimum value, further comprises:

selecting the chucking voltage to achieve a minimum force.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 17, 2018
From: BOYD, WENDELL GLENN, JR.; PARKHE, VIJAY D.; BUSCHE, MATTHEW JAMES; MAKHRATCHEV, KONSTANTIN; THACH, SENH; ONO, MASANORI
To: APPLIED MATERIALS, INC.
Reel/Frame 045836/0738 →
Continuity (2)
Provisional Application 62506313 · May 15, 2017
Related Publication 20180330926A1 · Nov 15, 2018
Cited By (18)
US 12,191,185 US 12,198,966 US 12,237,148 US 12,261,019 US 12,272,524 US 12,315,732 US 12,347,647 US 12,368,020 US 12,394,596 US 12,482,633 US 12,525,433 US 12,525,441 US 12,586,768 US 12,663,456 US 12,683,123 US 12,706,275 US 12,724,401 US 12,731,767