Heat sink and electronic component device
A heat sink may include: a flat plate portion; a first protruding portion which is formed on an outer peripheral portion of the flat plate portion so as to surround a central portion of the flat plate portion and which protrudes in a thickness direction of the flat plate portion; an extending portion which extends outward from the flat plate portion; and a second protruding portion which is formed on the extending portion such that the first protruding portion is positioned between the second protruding portion and the central portion of the flat plate and which protrudes in the thickness direction of the flat plate portion.
1. A heat sink comprising:
a flat plate portion;
a first protruding portion which is formed on an outer peripheral portion of the flat plate portion so as to surround a central portion of the flat plate portion and which protrudes in a thickness direction of the flat plate portion, and the first protruding portion is formed into a frame shape in a plan view;
an extending portion which extends outward from the flat plate portion; and
a second protruding portion which is formed on the extending portion such that the first protruding portion is positioned between the second protruding portion and the central portion of the flat plate portion and which protrudes in the thickness direction of the flat plate portion, the second protruding portion is formed on the extending portion such that the second protruding portion discontinuously surrounds the first protruding portion such that the second protruding portion is not opposed to the first protruding portion at four corners of the first protruding portion,
wherein the flat portion, the extending portion, the first protruding portion, and the second protruding portion are integrally formed as a unitary piece.
2. The heat sink according to claim 1 , wherein
the second protruding portion protrudes in the same direction as a protruding direction of the first protruding portion, and
a gap is provided between the first protruding portion and the second protruding portion.
3. The heat sink according to claim 1 , wherein
the second protruding portion includes segments which extend along sides of the frame shape of the first protruding portion between adjacent corners of the frame shape of the first protruding portion.
4. The heat sink according to claim 1 , wherein the extending portion is thinner in thickness than the flat plate portion.
5. The heat sink according to claim 1 , wherein
the second protruding portion protrudes in the same direction as a protruding direction of the first protruding portion, and
a level of a front end surface of the first protruding portion is substantially equal to that of a front end surface of the second protruding portion in the protruding direction of the first protruding portion and the second protruding portion.
6. The heat sink according to claim 1 , wherein
the second protruding portion protrudes in the same direction as a protruding direction of the first protruding portion, and
a level of a front end surface of the first protruding portion is lower than the level of a front end surface of the second protruding portion in the protruding direction of the first protruding portion and the second protruding portion.
7. The heat sink according to claim 1 , wherein the second protruding portion protrudes in a direction opposite to a protruding direction of the first protruding portion.
8. An electronic component device comprising:
a wiring board;
an electronic component which is mounted on the wiring board; and
a heat sink which is mounted on the wiring board so as to be thermally connected to the electronic component,
wherein the heat sink comprises:
a flat plate portion;
a first protruding portion which is formed on an outer peripheral portion of the flat plate portion so as to surround the electronic component and which protrudes in a thickness direction of the flat plate portion;
an extending portion which extends outward from the flat plate portion; and
a second protruding portion which is formed on the extending portion such that the first protruding portion is positioned between the second protruding portion and the electronic component and which protrudes in a thickness direction of the flat plate portion in a same direction as a protruding direction of the first protruding portion, and
wherein the first protruding portion and the second protruding portion are i& mounted on the wiring board and the flat plate portion is connected to the electronic component through a heat conductive material,
an adhesive agent is provided between the first protruding portion and the wiring board, between the second protruding portion and the wiring board, and in a pap formed between the first protruding portion and the second protruding portion, and
the flat portion, the extending portion, the first protruding portion, and the second protruding portion are integrally formed as a unitary piece.