Gallium nitride cross-gap light emitters based on unipolar-doped tunneling structures
Gallium nitride based devices and, more particularly to the generation of holes in gallium nitride based devices lacking p-type doping, and their use in light emitting diodes and lasers, both edge emitting and vertical emitting. By tailoring the intrinsic design, a wide range of wavelengths can be emitted from near-infrared to mid ultraviolet, depending upon the design of the adjacent cross-gap recombination zone. The innovation also provides for novel circuits and unique applications, particularly for water sterilization.
1. A solid-state device, comprising:
a unipolar doped light emitting diode or laser diode comprising:
a bottom n-type layer;
a top n-type layer;
an undoped or n-type doped middle layer inserted between the top layer and bottom layer, where the middle layer comprises at least two materials which serve as one or more heterojunction tunnel barriers;
and where the top layer and the middle layer, the bottom layer and the middle layer, or both form an interband tunnel barrier for electrons that generate holes by interband Zener tunneling through the forbidden energy gap, and where the middle layer forms at least one intraband tunnel barrier to control the interband Zener tunneling within the active region of the light emitting diode or the laser diode.
2. The device of claim 1 , wherein the top, middle and bottom layers are comprised of gallium nitride, aluminum nitride, indium nitride or alloys and combinations of III-nitride semiconductors or III-nitride compatible semiconductors.
3. The device of claim 2 , wherein the interband Zener tunneling through the active region is enhanced by the polarization effects of III-nitride heterojunctions.
4. The device of claim 1 , wherein the middle layer forms at least two intraband electron tunnel barriers, wherein the at least two intraband tunnel barriers form a quantum well between them, wherein the at least two intraband tunnel barriers and the quantum well are configured to act as a resonant tunneling diode.
5. The device of claim 1 , wherein the middle layer forms a single intraband electron tunnel barrier.
6. The device of claim 1 , wherein the middle layer is either undoped or doped less than the top and bottom n-type layers.
7. The device of claim 6 , wherein the middle layer also includes an undoped spacer layer between the interband tunnel barrier and the bottom n-type layer, between the interband tunnel barrier and the top n-type layer, or both.
8. A unipolar doped light emitting diode, comprising:
a bottom n-type layer;
a top n-type layer;
an undoped or n-type-doped middle layer inserted between the top layer and the bottom layer, where the middle layer comprises at least two materials which serve as heterojunction tunnel barriers;
and where the top layer and the middle layer, or middle layer and bottom layer, or both form an interband tunnel barrier for electrons that generate holes by Zener tunneling through the forbidden energy gap, and where the middle layer forms a least one intraband tunnel barrier to control electron flow;
and where the radiative cross-bandgap recombination of Zener-tunneling-created holes from the top or bottom layer occurs directly with electrons residing in the top or the bottom layer, respectively.
9. The light emitting diode of claim 8 , wherein the top, middle and bottom layers are comprised of gallium nitride, aluminum nitride, indium nitride or alloys and combinations of III-nitride semiconductors or III-nitride compatible semiconductors.
10. The light emitting diode of claim 9 , wherein the Zener tunneling is enhanced by the polarization effects at III-nitride heterojunctions.
11. The light emitting diode of claim 8 , wherein the middle layer comprises at least two intraband electron tunnel barriers that form a quantum well between them, behaving as a double barrier resonant tunneling diode within the middle layer.
12. The light emitting diode of claim 8 , wherein the middle layer is either undoped or doped less than the top and bottom n-type layers.
13. The light emitting diode of claim 12 , wherein the middle layer also includes a spacer layer between the interband tunnel barrier and the bottom n-type layer, between the interband tunnel barrier and the top n-type layer, or both.
14. The light emitting diode of claim 13 , where a region between the spacer layer and the bottom n-type layer, or between the spacer layer and the top n-type layer, comprises at least one quantum well.
15. The light emitting diode of claim 14 , where the at least one quantum well is comprised of undoped or n-type doped gallium, aluminum-gallium nitride, or indium-gallium nitride alloys.
16. The light emitting diode of claim 8 , where the middle layer includes an n-type delta-doped layer.
17. The light emitting diode of claim 8 where a portion of the radiatively emitted photons are converted to longer wavelengths by the addition of phosphorescent downconverting materials above the top layer, below the bottom layer, or both.
18. A unipolar doped laser diode, comprising:
a bottom n-type layer;
a top n-type layer;
an undoped or n-type doped middle layer inserted between the top layer and bottom layer, where the middle layer comprises at least two materials which serve as heterojunction electron tunnel barriers;
and wherein the top layer and the middle layer, or the bottom layer and middle layer, form an interband tunnel barrier for electrons that generate holes by Zener tunneling through the forbidden energy gap, and wherein the middle layer forms at least one intraband tunnel barrier to control electron flow;
and wherein the radiative cross-bandgap recombination of Zener-tunneling-created holes from the top or bottom layers occurs directly with electrons residing in the top or bottom layers, respectively;
and wherein a Fabry-Perot etalon is added external to the radiative recombination zone to form a laser diode.
19. The light emitting diode of claim 1 where a portion of the radiatively emitted photons are converted to longer wavelengths by the addition of phosphorescent downconverting materials above the top layer, below the bottom layer, or both.