Apparatus and methods for oscillation suppression of cascode power amplifiers

1. A power amplifier system comprising:

an input terminal configured to receive a radio frequency input signal;

an output terminal;

a cascode power amplifier including a plurality of transconductance devices each electrically coupled to the input terminal, and a plurality of cascode devices each electrically coupled to the output terminal, the plurality of transconductance devices configured to operate in combination with the plurality of cascode devices to amplify the radio frequency input signal;

a bias circuit configured to bias the plurality of cascode devices with two or more bias signals that are decoupled from one another at radio frequency so as to provide oscillation suppression to the cascode power amplifier, the two or more bias signals including a first bias voltage configured to bias a first portion of the plurality of cascode devices and a second bias voltage configured to bias a second portion of the plurality of cascode devices; and

a radio frequency isolation circuit electrically coupled between the first bias voltage and the second bias voltage.

2. The power amplifier system of claim 1 wherein the plurality of transconductance devices include a plurality of common emitter bipolar transistors, and the plurality of cascode devices include a plurality of common base bipolar transistors.

3. The power amplifier system of claim 1 further comprising a plurality of degeneration circuits electrically coupled between the plurality of transconductance devices and ground.

4. The power amplifier system of claim 1 wherein the bias circuit is further configured to bias the plurality of transconductance devices with a common bias signal.

5. The power amplifier system of claim 1 wherein the bias circuit includes a first emitter follower bipolar transistor configured to generate the first bias voltage, and a second emitter follower bipolar transistor configured to generate the second bias voltage.

6. A power amplifier system comprising:

an input terminal configured to receive a radio frequency input signal;

an output terminal;

a cascode power amplifier including a plurality of transconductance devices each electrically coupled to the input terminal, and a plurality of cascode devices each electrically coupled to the output terminal, the plurality of transconductance devices configured to operate in combination with the plurality of cascode devices to amplify the radio frequency input signal; and

a bias circuit configured to bias the plurality of cascode devices with a plurality of bias voltages that are decoupled from one another at radio frequency so as to provide oscillation suppression to the cascode power amplifier, the bias circuit including a plurality of emitter follower bipolar transistors configured to bias the plurality of cascode devices with the plurality of bias voltages that are decoupled from one another at radio frequency.

7. The power amplifier system of claim 6 wherein the plurality of bias voltages each separately bias a corresponding one of the plurality of cascode devices.

8. The power amplifier system of claim 7 further comprising a plurality of biasing conductors configured to separately route a corresponding one of the plurality of bias voltages to a corresponding one of the plurality of cascode devices, each of the plurality of biasing conductors disconnected from one another.

9. The power amplifier system of claim 6 wherein the bias circuit is further configured to bias the plurality of transconductance devices with a common bias signal.

10. The power amplifier system of claim 6 further comprising a plurality of degeneration circuits electrically coupled between the plurality of transconductance devices and ground.

11. The power amplifier system of claim 6 wherein the plurality of transconductance devices include a plurality of common emitter bipolar transistors, and the plurality of cascode devices include a plurality of common base bipolar transistors.

12. A packaged module comprising:

a package substrate; and

a semiconductor die attached to the package substrate, the semiconductor die including an input terminal configured to receive a radio frequency input signal, an output terminal, and a cascode power amplifier including a bias circuit, a plurality of transconductance devices each electrically coupled to the input terminal, and a plurality of cascode devices each electrically coupled to the output terminal, the plurality of transconductance devices configured to operate in combination with the plurality of cascode devices to amplify the radio frequency input signal, and the bias circuit configured to bias the plurality of cascode devices with two or more bias signals that are decoupled from one another at radio frequency so as to provide oscillation suppression to the cascode power amplifier, the two or more bias signals including a first bias voltage configured to bias a first portion of the plurality of cascode devices and a second bias voltage configured to bias a second portion of the plurality of cascode devices, the cascode power amplifier further including a radio frequency isolation circuit electrically coupled between the first bias voltage and the second bias voltage.

13. The packaged module of claim 12 wherein the plurality of transconductance devices include a plurality of common emitter bipolar transistors, and the plurality of cascode devices include a plurality of common base bipolar transistors.

14. The packaged module of claim 12 wherein the bias circuit is further configured to bias the plurality of transconductance devices with a common bias signal.

15. The packaged module of claim 12 wherein the cascode power amplifier further includes a plurality of degeneration circuits electrically coupled between the plurality of transconductance devices and ground.

16. The packaged module of claim 12 wherein the bias circuit includes a first emitter follower bipolar transistor configured to generate the first bias voltage, and a second emitter follower bipolar transistor configured to generate the second bias voltage.

17. A packaged module comprising:

a package substrate; and

a semiconductor die attached to the package substrate, the semiconductor die including an input terminal configured to receive a radio frequency input signal, an output terminal, and a cascode power amplifier including a bias circuit, a plurality of transconductance devices each electrically coupled to the input terminal, and a plurality of cascode devices each electrically coupled to the output terminal, the plurality of transconductance devices configured to operate in combination with the plurality of cascode devices to amplify the radio frequency input signal, and the bias circuit configured to bias the plurality of cascode devices with a plurality of bias voltages that are decoupled from one another at radio frequency so as to provide oscillation suppression to the cascode power amplifier, the bias circuit including a plurality of emitter follower bipolar transistors configured to bias the plurality of cascode devices with the plurality of bias voltages that are decoupled from one another at radio frequency.

18. The packaged module of claim 17 wherein the plurality of bias voltages each separately bias a corresponding one of the plurality of cascode devices.

19. The packaged module of claim 18 wherein the semiconductor die further includes a plurality of biasing conductors configured to separately route a corresponding one of the plurality of bias voltages to a corresponding one of the plurality of cascode devices, each of the plurality of biasing conductors disconnected from one another.

20. The packaged module of claim 17 wherein the bias circuit is further configured to bias the plurality of transconductance devices with a common bias signal.