Facile route to templated growth of two-dimensional layered materials
The present invention relates to methods for fabricating a laterally-limited two-dimensional structure through template synthesis. The methods of the invention are useful in forming homogenous and heterogeneous layered materials. The invention also provides structures and devices formed by the method of the present invention and uses thereof.
1. A method of fabricating a two-dimensional structure, comprising the steps of:
coating a portion of a substrate with a resist material to define a coated region and an uncoated region of the substrate surface;
positioning the substrate in a growth chamber;
transforming the resist material into a carbonaceous mask on the coated region of the substrate surface;
adding a chalcogen-based material to the growth chamber; and
growing a two-dimensional structure on the substrate, wherein the growth of the two dimensional structure is limited to the uncoated region of the substrate surface; and
wherein the carbonaceous mask is left on the substrate surface after growth of the two-dimensional structure.
2. The method of claim 1 , wherein coating a portion of a substrate further comprises:
coating the substrate with a resist material; and
patterning the resist material to expose the uncoated region of the substrate surface.
3. The method of claim 1 , wherein the substrate is selected from the group consisting of sapphire, silicon, silicon carbide, silicon dioxide, graphene, graphite, non-alkali glass, poly-silicon carbide, quartz, and poly-silicon.
4. The method of claim 1 , wherein the resist material is selected from the group consisting of an optical photoresist, a lift-off bilayer resist stack, and an e-beam resist.
5. The method of claim 1 , wherein the chalcogen-based material comprises a chalcogen element and a second element selected from the group consisting of a transition metal, a group-III element, a group IV element and any combination thereof.
6. The method of claim 5 , wherein the chalcogen-based material is selected from the group consisting of WSe 2 , WS 2 , MoSe 2 , and MoS 2 .
7. The method of claim 1 , wherein growing a two-dimensional structure on a substrate further comprises using a process selected from the group consisting of powder vaporization and metal-organic chemical vapor deposition.
8. A two-dimensional structure produced by the method of claim 1 .
9. The two-dimensional structure of claim 8 , where in the two-dimensional structure is heterogeneous.
10. A device comprising a two-dimensional structure produced by the method of claim 1 .
11. A method of controlling lateral growth of a two-dimensional structure on a substrate surface, the method comprising:
coating a portion of a substrate surface with a resist material to define a coated region and an uncoated region of the substrate surface;
transforming the resist material into a carbonaceous mask that is left on the coated region of the substrate surface; and
growing a two-dimensional structure on the uncoated region of the substrate surface, wherein lateral growth of the two dimensional structure is prohibited by the carbonaceous mask at the interface of the uncoated and coated substrate surface; and
wherein the carbonaceous mask is left on the substrate surface after growth of the two-dimensional structure.
12. The method of claim 11 , wherein coating a portion of a substrate further comprises:
coating the substrate with a resist material; and
patterning the resist material to expose the uncoated region of the substrate surface.
13. The method of claim 11 , wherein the two dimensional structure comprises a chalcogen based material.
14. The method of claim 13 , wherein the chalcogen-based material comprises a chalcogen element and a second element selected from the group consisting of a transition metal, a group-III element, a group IV element and any combination thereof.
15. The method of claim 14 , wherein the chalcogen-based material is selected from the group consisting of WSe 2 , WS 2 , MoSe 2 , and MoS 2 .
16. The method of claim 11 , wherein the substrate is selected from the group consisting of sapphire, silicon, silicon carbide, silicon dioxide, graphene, graphite, non-alkali glass, poly-silicon carbide, and poly-silicon.
17. The method of claim 11 , wherein the resist material is selected from the group consisting of an optical photoresist, a lift-off bilayer resist stack, and an e-beam photoresist.
18. The method of claim 11 , wherein growing a two-dimensional structure on a substrate further comprises using a process selected from the group consisting of powder vaporization and metal-organic chemical vapor deposition.
19. A two-dimensional structure produced by the method of claim 11 .
20. A device comprising a two-dimensional structure produced by the method of claim 11 .