IP Library › Granted Patent US 10,465,288
Granted Patent B2
US 10,465,288 · App. 14/461,318 · Granted Nov 5, 2019

Nozzle for uniform plasma processing

Inventors: Rohit Mishra (Santa Clara, CA); Siva Suri Chandra Rao Bhesetti (Singapore, SG); Eng Sheng Peh (Singapore, SG); Sriskantharajah Thirunavukarasu (Singapore, SG); Shoju Vayyapron (Bangalore, IN); Cheng Sun (Singapore, SG)
Assignee: Applied Materials, Inc.
C23C16/50C23C16/45565H01J37/3244
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Quick Facts
Patent No.
US 10,465,288
App. No.
14/461,318
Granted
Nov 5, 2019
Kind
B2
Abstract

A nozzle for uniform plasma processing comprises an inlet portion and an outlet portion. The inlet portion has a side surface substantially parallel to a vertical axis. The inlet portion comprises a plurality of gas channels. The outlet portion is coupled to the inlet portion. The outlet portion comprises a plurality of outlets. At least one of the outlets is at an angle other than a right angle relative to the vertical axis.

Claims (10)

1. An apparatus for uniform plasma processing comprising: a nozzle comprising: an inlet portion comprising a plurality of gas channels, the inlet portion having a side surface substantially parallel to a vertical axis; a cavity below the plurality of gas channels; and an outlet portion below the cavity, wherein the outlet portion comprises a plurality of outlets, wherein at least one of the outlets is at an angle other than a right angle relative to the vertical axis, and wherein the outlet portion comprises a lowermost surface; and a support feature in the cavity between the inlet portion and the outlet portion, wherein the support feature is centrally located within the plurality of outlets of the outlet portion, and wherein the support feature has a curved surface that extends downwardly to the surface of the outlet portion.

2. The apparatus of claim 1 , wherein at least one of the gas channels extends at an angle relative to the vertical axis.

3. The apparatus of claim 1 , wherein the number of outlets is greater than the number of gas channels.

4. The apparatus of claim 1 , wherein the outlet portion comprises at least one step.

5. The apparatus of claim 1 , wherein the outlet portion comprises a side surface that extends at an angle to the vertical axis.

6. A plasma processing system comprising: a processing chamber comprising a pedestal to hold a workpiece comprising a substrate; a plasma source; a nozzle coupled to the plasma source to receive a gas to generate plasma in the processing chamber, wherein the nozzle comprises an inlet portion comprising a plurality of gas channels, the inlet portion comprises a side surface substantially parallel to a vertical axis, a cavity below the plurality of gas channels; an outlet portion below the cavity, the outlet portion comprising a plurality of outlets, wherein at least one of the outlets is at an angle other than a right angle relative to the vertical axis, and wherein the outlet portion comprises a lowermost surface; and a support feature in the cavity between the inlet portion and the outlet portion, wherein the support feature is centrally located within the plurality of outlets of the outlet portion, and wherein the support feature has a curved surface that extends downwardly to the lowermost surface of the outlet portion.

7. The system of claim 6 , wherein at least one of the gas channels extends at an angle relative to the vertical axis.

8. The system of claim 6 , wherein the number of outlets is greater than the number of gas channels.

9. The system of claim 6 , wherein the outlet portion comprises at least one step.

10. The system of claim 6 , wherein the outlet portion comprises a side surface that extends at an angle to the vertical axis.

Assignments (5)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 6, 2015
From: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
To: APPLIED MATERIALS, INC.
Reel/Frame 035580/0355 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 2, 2015
From: BHESETTI, SIVA SURI CHANDRA RAO; PEH, ENG SHENG; THIRUNAVUKARASU, SRISKANTHARAJAH; SUN, CHENG
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 034869/0396 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 2, 2015
From: VAYYAPRON, SHOJU
To: APPLIED MATERIALS, INC.
Reel/Frame 034869/0403 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 2, 2015
From: MISHRA, ROHIT
To: APPLIED MATERIALS, INC.
Reel/Frame 034869/0414 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 2, 2015
From: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
To: APPLIED MATERIALS, INC.
Reel/Frame 034869/0421 →
Continuity (1)
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