Ceramic electronic component and method of producing the same
A ceramic electronic component includes a ceramic body and an external electrode. The external electrode is formed along a surface of the ceramic body and includes a tin layer as an outermost layer. The tin layer includes dispersed pores.
1. A ceramic electronic component, comprising:
a ceramic body; and
an external electrode that is formed along a surface of the ceramic body and includes a tin layer as an outermost layer and an internal layer that is adjacent to the inside of the tin layer, the tin layer and the internal layer including dispersed pores, and the tin layer and the internal layer being formed of a columnar crystal.
2. The ceramic electronic component according to claim 1 , wherein
the internal layer is a copper layer.
3. The ceramic electronic component according to claim 1 , wherein
the tin layer is formed by sputtering.
4. The ceramic electronic component according to claim 1 , wherein the pores are recessed in a concave manner from a surface of the outermost layer.
5. The ceramic electronic component according to claim 1 , wherein the pores penetrate in a thickness direction of the tin layer.