IP Library › Granted Patent US 10,468,274
Granted Patent B2
US 10,468,274 · App. 15/076,265 · Granted Nov 5, 2019

Substrate processing apparatus

Inventors: Keiichi Kurashina (Tokyo, JP); Toshio Yokoyama (Tokyo, JP)
Assignee: EBARA CORPORATION
H01L21/6708H01L21/67057H01L21/68707H01L21/67086H01L21/67751
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Quick Facts
Patent No.
US 10,468,274
App. No.
15/076,265
Granted
Nov 5, 2019
Kind
B2
Abstract

The substrate processing apparatus includes a processing chamber including an outer chamber configured to hold a processing liquid and an inner chamber capable of surrounding the substrate held by the substrate holder; a liquid delivery pipe having one end coupled to a bottom of the inner chamber and other end coupled to the outer chamber; a pump configured to suck the processing liquid from the inner chamber through the liquid delivery pipe and to deliver the processing liquid to the outer chamber through the liquid delivery pipe; and a guide cover having a through-hole in which the substrate holder can be inserted. The guide cover is located below an upper end of the outer chamber and above the inner chamber.

Claims (10)

1. A substrate processing apparatus comprising:

a substrate holder for holding a substrate, the substrate holder having two holding arms;

a processing chamber including an outer chamber configured to hold a processing liquid for processing the substrate, and an inner chamber housed in the outer chamber and capable of surrounding the substrate held by the substrate holder;

a liquid delivery pipe having one end coupled to a bottom of the inner chamber and other end coupled to the outer chamber;

a pump coupled to the liquid delivery pipe and configured to suck the processing liquid from the inner chamber through the liquid delivery pipe and to deliver the processing liquid to the outer chamber through the liquid delivery pipe; and

a guide cover having a through-hole in which the substrate holder can be inserted, the guide cover being located below an upper end of the outer chamber and above the inner chamber, the guide cover being arranged to change a direction of an ascending flow formed in the outer chamber, the guide cover being secured to an inner surface of the outer chamber and guiding the processing liquid impinged on a lower surface of the guide cover into the inner chamber,

the substrate holder having a flange which closes the through-hole, and

the flange being secured to the two holding arms, the flange having a size smaller than the outer chamber and larger than the through-hole.

2. The substrate processing apparatus according to claim 1 , wherein the guide cover has a lower surface on which the processing liquid impinges.

3. The substrate processing apparatus according to claim 1 , wherein the guide cover extends parallel to the flange.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 20, 2016
From: KURASHINA, KEIICHI; YOKOYAMA, TOSHIO
To: EBARA CORPORATION
Reel/Frame 039198/0869 →
Priority Claims (1)
JP 2015-060284 · Mar 24, 2015 · national
Continuity (1)
Related Publication 20160284571A1 · Sep 29, 2016