Semiconductor apparatus
According to the present invention, a semiconductor apparatus includes a semiconductor device, a case surrounding the semiconductor device, a spring terminal including a first connection portion extending to a top surface of the case, and a second connection portion provided on the top surface of the case and a control substrate provided on the second connection portion, wherein the first connection portion is connected to the semiconductor device, the second connection portion includes a first end connected to an end of the first connection portion, and a second end opposite to the first end, the second connection portion being a flat plate and having an elastic force using the first end as a supporting point, the second end contacts the control substrate with an elastic force, and the second connection portion has a constriction structure having a notch formed in a side surface along a longitudinal direction.
1. A semiconductor apparatus comprising:
a semiconductor device;
a case surrounding the semiconductor device;
a spring terminal including a first connection portion extending to a top surface of the case along a side surface of the case in contact with the side surface of the case, and a second connection portion provided to directly contact the top surface of the case; and
a control substrate provided to directly contact a top surface of the second connection portion, wherein
the first connection portion is fixed to the case and connected to the semiconductor device,
the second connection portion includes a first end connected to an end of the first connection portion on a side of the top surface of the case, and a second end opposite to the first end, the second connection portion being a flat plate and having an elastic force using the first end as a supporting point,
the second end contacts the control substrate with an elastic force, and
the second connection portion has a constriction structure having a notch formed in a side surface along a longitudinal direction.
2. The semiconductor apparatus according to claim 1 , wherein the second end and the control substrate are not joined together.
3. The semiconductor apparatus according to claim 1 , wherein
the second end is provided with a convex portion projecting in a direction opposite to the top surface of the case, a tip end of the convex portion being curved, and
the convex portion and the control substrate are in contact with each other.
4. The semiconductor apparatus according to any one of claim 1 , wherein the constriction structure is provided with a plurality of notches formed in both side surfaces of the second connection portion along the longitudinal direction.
5. The semiconductor apparatus according to claim 4 , wherein one of the plurality of notches that is provided in one of the both side surfaces and another of the plurality of notches that is provided in the other one of the both side surfaces are deviated from each other in the longitudinal direction.
6. The semiconductor apparatus according to claim 4 , wherein each of the plurality of notches has a curved surface.
7. The semiconductor apparatus according to claim 4 , wherein each of the plurality of notches has a curved surface formed over an area between the first end and the second end.
8. The semiconductor apparatus according to claim 1 , further comprising a lid provided above the control substrate, wherein
the lid presses the control substrate and the second connection portion toward the top surface of the case from above, thereby bringing the second end into contact with the control substrate with an elastic force.
9. The semiconductor apparatus according to claim 1 , wherein
a first surface of the second end contacts the control substrate with the elastic force and a second surface of the second end that is opposite to the first surface of the second end directly contacts the top surface of the case.
10. The semiconductor apparatus according to claim 1 , wherein
a width in a transverse direction of the second connection portion as viewed along a direction vertical to the top surface of the case is narrowed in the constriction structure.
11. A semiconductor apparatus comprising:
a semiconductor device;
a case surrounding the semiconductor device;
a spring terminal including a first connection portion extending toward a top surface of the case along a side surface of the case in contact with the side surface of the case, a second connection portion provided to directly contact the top surface of the case, and an elastic portion provided between the first connection portion and the second connection portion; and
a control substrate provided to directly contact a top surface of the second connection portion, wherein
the first connection portion is fixed to the case and connected to the semiconductor device,
the second connection portion includes a first end connected to the elastic portion, and a second end opposite to the first end, the second connection portion having a flat plate shape,
the second end contacts the control substrate by an elastic force of the elastic portion, and
a width of the second connection portion as viewed along a direction vertical to the top surface of the case is smaller than a width of the second connection portion in the direction of the top surface of the case.
12. The semiconductor apparatus according to claim 11 , wherein the second end and the control substrate are not joined together.
13. The semiconductor apparatus according to claim 11 , wherein a width of the elastic portion in a direction vertical to the top surface of the case is smaller than a width of the second connection portion in the direction vertical to the top surface of the case.
14. The semiconductor apparatus according to claim 11 , wherein the elastic portion is curved in a U-shape to project in a direction opposite to the second connection portion.
15. The semiconductor apparatus according to claim 11 , wherein
the second end is provided with a convex portion projecting in a direction opposite to the top surface of the case, and
the convex portion and the control substrate are in contact with each other.
16. The semiconductor apparatus according to claim 11 , wherein
a first surface of the second end contacts the control substrate by the elastic force of the elastic portion and a second surface of the second end that is opposite to the first surface of the second end directly contacts the top surface of the case.