Printed circuit board, printed wiring board, and differential transmission circuit

1. A printed circuit board, comprising:

a first semiconductor device configured to input and output a signal;

a second semiconductor device configured to input and output a signal; and

a printed wiring board having the first semiconductor device and the second semiconductor device mounted thereon, the printed wiring board comprising:

a first differential signal wiring formed of a pair of signal transmission lines, the first differential signal wiring connecting the first semiconductor device and the second semiconductor device to each other, wherein the pair of signal transmission lines forming the first differential signal wiring comprises a first signal transmission line and a second signal transmission line; and

a second differential signal wiring formed of a pair of signal transmission lines, the second differential signal wiring connecting the first semiconductor device and the second semiconductor device to each other and being arranged in parallel to the first differential signal wiring, the first differential signal wiring and the second differential signal wiring being arranged without any other differential wirings therebetween, wherein the pair of signal transmission lines forming the second differential signal wiring comprises a third signal transmission line and a fourth signal transmission line,

wherein the pair of signal transmission lines forming the first differential signal wiring are wired to have a relative arrangement in which, when viewed in plan from a direction perpendicular to a surface of the printed wiring board, the first signal transmission line and the second signal transmission line cross with each other at least once in the first differential signal wiring in a wiring direction thereof,

wherein the pair of signal transmission lines forming the second differential signal wiring are wired to have a relative arrangement in which, when viewed in plan from the direction perpendicular to the surface of the printed wiring board, the third signal transmission line and the fourth signal transmission line cross with each other at least once in the second differential signal wiring in a wiring direction thereof,

wherein the number of crossings of the pair of signal transmission lines forming the first differential signal wiring is equal to the number of crossings of the pair of signal transmission lines forming the second differential signal wiring, and

wherein each of the crossings of the pair of signal transmission lines forming the first differential signal wiring and corresponding one of the crossings of the pair of signal transmission lines forming the second differential signal wiring are arranged side by side.

2. The printed circuit board according to claim 1 , wherein signals flowing through one of the first or second signal transmission lines included in the first differential signal wiring and one of the third or fourth signal transmission lines included in the second differential signal wiring, which are adjacent to each other without any other differential wirings therebetween when viewed in plan from the direction perpendicular to the surface of the printed wiring board, are in phase.

3. The printed circuit board according to claim 1 ,

wherein the second signal transmission line and the third signal transmission line are connected to the first semiconductor device in a state in which the second signal transmission line and the third signal transmission line are arranged without any other differential wirings therebetween,

wherein signals flowing through the first signal transmission line and the fourth signal transmission line are in phase, and

wherein signals flowing through the second signal transmission line and the third signal transmission line are in phase.

4. The printed circuit board according to claim 1 ,

wherein, when viewed in plan from the direction perpendicular to the surface of the printed wiring board, a distance between the crossings of the pair of signal transmission lines forming the first differential signal wiring and the first semiconductor device and a distance between the crossings of the pair of signal transmission lines forming the second differential signal wiring and the first semiconductor device are substantially the same, and

wherein, when viewed in plan from the direction perpendicular to the surface of the printed wiring board, a wiring length along which the first signal transmission line and the third signal transmission line are arranged adjacent to each other and a wiring length along which the second signal transmission line and the fourth signal transmission line are arranged adjacent to each other are substantially equal to each other.

5. The printed circuit board according to claim 1 ,

wherein the first signal transmission line comprises a first wiring pattern formed on the first semiconductor device side and a second wiring pattern formed on the second semiconductor device side when viewed from a region in which the first signal transmission line and the second signal transmission line cross with each other,

wherein the second signal transmission line comprises a third wiring pattern formed on the first semiconductor device side and a fourth wiring pattern formed on the second semiconductor device side when viewed from the region in which the first signal transmission line and the second signal transmission line cross with each other,

wherein the third signal transmission line comprises a fifth wiring pattern formed on the first semiconductor device side and a sixth wiring pattern formed on the second semiconductor device side when viewed from a region in which the third signal transmission line and the fourth signal transmission line cross with each other,

wherein the fourth signal transmission line comprises a seventh wiring pattern formed on the first semiconductor device side and an eighth wiring pattern formed on the second semiconductor device side when viewed from the region in which the third signal transmission line and the fourth signal transmission line cross with each other, and

wherein, when viewed in plan from the direction perpendicular to the surface of the printed wiring board, the third wiring pattern and the fifth wiring pattern are adjacent to each other, the second wiring pattern and the eighth wiring pattern are adjacent to each other, and a wiring length along which the third wiring pattern and the fifth wiring pattern are adjacent to each other and a wiring length along which the second wiring pattern and the eighth wiring pattern are adjacent to each other are substantially equal to each other.

6. The printed circuit board according to claim 1 ,

wherein, when viewed in plan from the direction perpendicular to the surface of the printed wiring board, the first signal transmission line and the second signal transmission line are wired to cross with each other twice in the first differential signal wiring in the wiring direction thereof,

wherein, when viewed in plan from the direction perpendicular to the surface of the printed wiring board, the third signal transmission line and the fourth signal transmission line are wired to cross with each other twice in the second differential signal wiring in the wiring direction thereof,

wherein the first signal transmission line comprises:

a first wiring pattern formed on the first semiconductor device side when viewed from a region in which the first signal transmission line positioned on the first semiconductor device side and the second signal transmission line cross with each other;

a second wiring pattern formed between the region in which the first signal transmission line positioned on the first semiconductor device side and the second signal transmission line cross with each other and a region in which the first signal transmission line positioned on the second semiconductor device side and the second signal transmission line cross with each other; and

a third wiring pattern formed on the second semiconductor device side when viewed from the region in which the first signal transmission line positioned on the second semiconductor device side and the second signal transmission line cross with each other,

wherein the second signal transmission line comprises:

a fourth wiring pattern formed on the first semiconductor device side when viewed from the region in which the first signal transmission line positioned on the first semiconductor device side and the second signal transmission line cross with each other;

a fifth wiring pattern formed between the region in which the first signal transmission line positioned on the first semiconductor device side and the second signal transmission line cross with each other and the region in which the first signal transmission line positioned on the second semiconductor device side and the second signal transmission line cross with each other; and

a sixth wiring pattern formed on the second semiconductor device side when viewed from the region in which the first signal transmission line positioned on the second semiconductor device side and the second signal transmission line cross with each other,

wherein the third signal transmission line comprises:

a seventh wiring pattern formed on the first semiconductor device side when viewed from a region in which a third signal transmission line positioned on the first semiconductor device side and a fourth signal transmission line cross with each other;

an eighth wiring pattern formed between the region in which the third signal transmission line positioned on the first semiconductor device side and the fourth signal transmission line cross with each other and a region in which the third signal transmission line positioned on the second semiconductor device side and the fourth signal transmission line cross with each other; and

a ninth wiring pattern formed on the second semiconductor device side when viewed from the region in which the third signal transmission line positioned on the second semiconductor device side and the fourth signal transmission line cross with each other,

wherein the fourth signal transmission line comprises:

a tenth wiring pattern formed on the first semiconductor device side when viewed from the region in which the third signal transmission line positioned on the first semiconductor device side and the fourth signal transmission line cross with each other;

an eleventh wiring pattern formed between the region in which the third signal transmission line positioned on the first semiconductor device side and the fourth signal transmission line and the region in which the third signal transmission line positioned on the second semiconductor device side and the fourth signal transmission line cross with each other; and

a twelfth wiring pattern formed on the second semiconductor device side when viewed from the region in which the third signal transmission line positioned on the second semiconductor device side and the fourth signal transmission line cross with each other,

wherein, when viewed in plan from the direction perpendicular to the surface of the printed wiring board, the fourth wiring pattern and the seventh wiring pattern are adjacent to each other, the second wiring pattern and the eleventh wiring pattern are adjacent to each other, and the sixth wiring pattern and the ninth wiring pattern are adjacent to each other, and

wherein, when viewed in plan from the direction perpendicular to the surface of the printed wiring board, a sum of a wiring length along which the fourth wiring pattern and the seventh wiring pattern are adjacent to each other and a wiring length along which the sixth wiring pattern and the ninth wiring pattern are adjacent to each other is substantially equal to a wiring length along which the second wiring pattern and the eleventh wiring pattern are adjacent to each other.

7. The printed circuit board according to claim 1 , wherein the crossing of the pair of signal transmission lines forming the first differential signal wiring and the crossing of the pair of signal transmission lines forming the second differential signal wiring are achieved by signal vias formed in the printed wiring board.

8. The printed circuit board according to claim 1 ,

wherein the first semiconductor device and the second semiconductor device are formed on one surface of the printed wiring board, and

wherein the crossing of the pair of signal transmission lines forming the first differential signal wiring and the crossing of the pair of signal transmission lines forming the second differential signal wiring are achieved so that one differential signal line in the pair of differential signal lines is wired to straddle another differential signal line in the pair of differential signal lines with use of an electronic element mounted on the one surface of the printed wiring board.

9. The printed circuit board according to claim 7 ,

wherein the printed wiring board comprises a multilayer printed wiring board including at least three layers in which a power supply pattern and a ground pattern are formed as internal layers, and

wherein the printed wiring board has a capacitor element mounted on one of one surface and another surface thereof,

wherein the capacitor element is connected to the power supply pattern through a power supply via and is connected to the ground pattern through a ground via, and

wherein the power supply via and the ground via are formed adjacent to the signal vias.

10. The printed circuit board according to claim 8 , wherein the electronic element comprises one of a resistor element and a capacitor element.

11. A printed circuit board, comprising:

a first semiconductor device comprising a first signal input/output circuit and a second signal input/output circuit;

a second semiconductor device comprising:

a third signal input/output circuit;

a first internal differential signal wiring formed of a pair of signal transmission lines, the first internal differential signal wiring being connected to the third signal input/output circuit;

a fourth signal input/output circuit; and

a second internal differential signal wiring formed of a pair of signal transmission lines, the second internal differential signal wiring being connected to the fourth signal input/output circuit and arranged in parallel to the first internal differential signal wiring; and

a printed wiring board having the first semiconductor device and the second semiconductor device mounted thereon, the printed wiring board comprising:

a first differential signal wiring formed of a pair of signal transmission lines, the first differential signal wiring connecting the first semiconductor device and the second semiconductor device to each other; and

a second differential signal wiring formed of a pair of signal transmission lines, the second differential signal wiring connecting the first semiconductor device and the second semiconductor device to each other and being arranged in parallel to the first differential signal wiring,

wherein the first differential signal wiring and the first internal differential signal wiring are connected to each other, to thereby form a pair of first differential signal transmission lines that are continuous,

wherein the second differential signal wiring and the second internal differential signal wiring are connected to each other, to thereby form a pair of second differential signal transmission lines that are continuous,

wherein the pair of first differential signal transmission lines are wired to have a relative arrangement in which one signal transmission line and another signal transmission line cross with each other in a region in which the first differential signal wiring and the first internal differential signal wiring are connected to each other, and

wherein the pair of second differential signal transmission lines are wired to have a relative arrangement in which one signal transmission line and another signal transmission line cross with each other in a region in which the second differential signal wiring and the second internal differential signal wiring are connected to each other.

12. The printed circuit board according to claim 11 , wherein signals flowing through signal transmission lines adjacent to each other when viewed in plan from the direction perpendicular to the surface of the printed wiring board are in phase, one of the signal transmission lines being included in the first differential signal wiring and the other of the signal transmission lines being included in the second differential signal wiring.

13. The printed circuit board according to claim 11 , wherein a length of the first differential signal wiring and the first internal differential signal wiring that are arranged in parallel to each other is longer than a length of the second differential signal wiring and the second internal differential signal wiring that are arranged in parallel to each other.

14. The printed circuit board according to claim 11 , wherein the crossing of the pair of signal transmission lines forming the first differential signal transmission lines and the crossing of the pair of signal transmission lines forming the second differential signal transmission lines are achieved by signal pads formed in the second semiconductor device.