Direct diode laser processing apparatus and sheet metal processing method using the same
A direct diode laser processing apparatus includes a laser oscillator that emits a multiple-wavelength laser beam, a transmission fiber that transmits the multiple-wavelength laser beam emitted from the laser oscillator, and a laser processing machine that condenses the multiple-wavelength laser beam transmitted through the transmission fiber and processes a workpiece. According to chromatic aberrations of the multiple-wavelength laser beam and the wavelength dependence of emissivity of the workpiece, a light intensity distribution of the multiple-wavelength laser beam in a thickness direction of the workpiece is provided with a plurality of peaks.
1. A direct diode laser processing apparatus comprising:
a laser oscillator emitting a multiple-wavelength laser beam that has been spectral-beam-combined;
a transmission fiber transmitting the multiple-wavelength laser beam emitted from the laser oscillator; and
a laser processing machine condensing the multiple-wavelength laser beam transmitted through the transmission fiber and processing a workpiece, wherein
a light intensity distribution of the multiple-wavelength laser beam in a thickness direction of the workpiece is provided with a plurality of peaks due to chromatic aberrations of the multiple-wavelength laser beam and the wavelength dependence of emissivity of the workpiece.
2. The direct diode laser processing apparatus according to claim 1 , wherein
there are two peaks within the range of a thickness of the workpiece.
3. The direct diode laser processing apparatus according to claim 1 , wherein
a peak on the surface side of the workpiece is positioned in the vicinity of the surface of the workpiece and a peak on the bottom surface side of the workpiece is positioned in the vicinity of the bottom surface of the workpiece.
4. The direct diode laser processing apparatus according to claim 1 , wherein
the peak on the surface side of the workpiece is greater than the peak on the bottom surface side of the workpiece.
5. The direct diode laser processing apparatus according to claim 1 , wherein
the multiple-wavelength laser beam includes wavelengths in the range of 400 nm to 1000 nm.
6. The direct diode laser processing apparatus according to claim 1 , wherein
the multiple-wavelength laser beam is formed by combining a laser beam having at least one wavelength in the range of 400 nm to 500 nm with a laser beam having at least one wavelength in the range of 800 nm to 1000 nm.
7. The direct diode laser processing apparatus according to claim 1 , wherein
the workpiece has a plate thickness of 15 mm to 20 mm.
8. The direct diode laser processing apparatus according to claim 1 , wherein
the laser oscillator controls output of the multiple-wavelength laser beam wavelength by wavelength, or wavelength band by wavelength band.
9. The direct diode laser processing apparatus according to claim 1 , wherein
the higher the reflectance of the workpiece on the longer wavelength side compared to that on the shorter wavelength side, the higher the output of the multiple-wavelength laser beam is increased on the shorter wavelength side.
10. The direct diode laser processing apparatus according to claim 1 , wherein
a distance from the top of a Rayleigh region at the focal length of a shortest wavelength of the multiple-wavelength laser beam to the bottom of a Rayleigh region at the focal length of a longest wavelength of the multiple-wavelength laser beam is substantially equal to the thickness of the workpiece.
11. A method of processing sheet metal of 15 mm to 20 mm thick with the use of the direct diode laser processing apparatus according claim 1 , the method including:
simultaneously emitting a multiple-wavelength laser beam having different focusing positions in a thickness direction of the sheet metal toward a predetermined processing position of the sheet metal; and
blowing an assist gas toward the processing position.
12. A method of processing a workpiece with the use of a direct diode laser processing apparatus that includes a laser oscillator that emits a multiple-wavelength laser beam that has been spectral-beam-combined, a transmission fiber that transmits the multiple-wavelength laser beam emitted from the laser oscillator, and a laser processing machine that condenses the multiple-wavelength laser beam transmitted through the transmission fiber and processes the workpiece, the workpiece being sheet metal having a thickness of 15 mm or more, the method comprising:
to prevent dross production, concentrating a shorter-wavelength beam contained in the multiple-wavelength laser beam onto the surface of the sheet metal and a longer-wavelength beam contained in the multiple-wavelength laser beam onto the inside of the sheet metal.
13. The method of processing sheet metal according to claim 12 , wherein
the longer-wavelength laser beam is concentrated onto the vicinity of the bottom surface of the sheet metal.
14. A method of processing sheet metal with the use of a direct diode laser processing apparatus that includes a laser oscillator that emits a multiple-wavelength laser beam which has been spectral-beam-combined, a transmission fiber that transmits the multiple-wavelength laser beam emitted from the laser oscillator, and a laser processing machine that condenses the multiple-wavelength laser beam transmitted through the transmission fiber and processes a workpiece, wherein:
controlling relative outputs of the multiple-wavelength laser beam so that a light intensity distribution of the multiple-wavelength laser beam in a thickness direction of the workpiece is provided with a plurality of peaks due to chromatic aberrations of the multiple-wavelength laser beam and the wavelength dependence of emissivity of the workpiece.
15. The method of processing sheet metal according to claim 12 , wherein
the thickness of the sheet metal of the workpiece is less than 20 mm.