Systems and methods for thermal location of cooling holes
Systems and methods are disclosed herein for repairing components. A material layer may be deposited on a surface of a component. The material layer may cover a cooling hole. A pulsed heat source may heat the component and the material layer. An infrared camera may take a series of images of the component. A location of the cooling hole may be identified based on thermal properties of the component. A removal tool may remove a portion of the material layer in order to expose the cooling hole.
1. A method of repairing a component comprising:
depositing a material layer on a surface of the component;
heating the component using a pulsed heat source;
measuring, by an infrared camera, thermal properties of the component;
locating, by the infrared camera, a cavity in the component based on the thermal properties;
comparing the cavity with a known specification for the component;
identifying an angle of the cavity relative to the surface of the component based on the known specification;
centering a removal tool on the cavity at the angle in response to the infrared camera locating the cavity; and
removing, by the removal tool, a portion of the material layer to expose the cavity, wherein the heating of the component further comprises emitting light pulses for between 1 millisecond and 40 milliseconds.
2. The method of claim 1 , wherein the material layer comprises a thermal barrier layer.
3. The method of claim 1 , wherein the measuring the thermal properties comprises capturing a series of infrared images of the component.
4. The method of claim 1 , wherein the cavity comprises a cooling hole.
5. The method of claim 1 , wherein the locating the cavity comprises locating a center of the cavity.
6. The method of claim 1 , wherein the component comprises an aircraft component.
7. The method of claim 1 , further comprising creating a 2-dimensional thermal image of the component.
8. The method of claim 1 , further comprising setting a power of a laser drill such that the removing the portion of the material layer removes a portion of the material layer without damaging the component.
9. The method of claim 1 , wherein the removal tool is co-axial with the infrared camera.
10. A method of repairing a component comprising:
depositing a material layer on a surface of the component;
heating the component using a pulsed heat source, wherein the pulsed heat source is at least one of a xenon flash lamp array, a quartz flash source or an LED flash source;
measuring, by an infrared camera, thermal properties of the component;
locating, by the infrared camera, a cavity in the component based on the thermal properties;
comparing the cavity with a known specification for the component
identifying an angle of the cavity relative to the surface of the component based on the known specification;
centering a removal tool on the cavity at the angle in response to the infrared camera locating the cavity; and
removing, by the removal tool, a portion of the material layer to expose the cavity.
11. A method of repairing a component comprising:
depositing a material layer on a surface of the component;
heating the component using a pulsed heat source;
measuring, by an infrared camera, thermal properties of the component, wherein the measuring includes capturing a series of infrared images based on the pulsed heat source;
locating, by the infrared camera, a cavity in the component based on the thermal properties;
comparing the cavity with a known specification for the component;
identifying an angle of the cavity relative to the surface of the component based on the known specification;
centering a removal tool on the cavity at the angle in response to the infrared camera locating the cavity; and
removing, by the removal tool, a portion of the material layer to expose the cavity.