Printing apparatus, liquid absorbing apparatus, control method
A liquid absorbing apparatus for absorbing a liquid component from a formed ink image includes an endless liquid absorbing sheet, a mechanism configured to move the liquid absorbing sheet cyclically, an absorption mechanism configured to absorb the liquid component from the ink image by making the liquid absorbing sheet contact the ink image, a removing mechanism configured to squeeze and remove a liquid with a nipping pressure by nipping the liquid absorbing sheet, and at least one nipping portion, different from the absorption mechanism and the removing mechanism, configured to nip the liquid absorbing sheet. In the apparatus, the nipping pressure of the removing mechanism is set higher than a nipping pressure of the nipping unit.
1. A printing apparatus comprising:
a transfer member configured to be moved cyclically;
a print unit configured to form an ink image on the transfer member by discharging ink to the transfer member;
a transfer unit configured to perform a transfer operation of transferring, to a print medium, the ink image formed on the transfer member; and
a liquid absorbing unit configured to absorb a liquid component from the ink image on the transfer member before the transfer operation,
the liquid absorbing unit including:
an endless liquid absorbing sheet,
a driving unit configured to move the liquid absorbing sheet cyclically,
an absorption unit configured to absorb the liquid component from the ink image by making the liquid absorbing sheet contact the ink image,
a removing unit configured to squeeze and remove a liquid with a nipping pressure by nipping the liquid absorbing sheet, and
at least one nipping unit, different from the absorption unit and the removing unit, configured to nip the liquid absorbing sheet,
wherein the nipping pressure of the removing unit is set higher than a nipping pressure of the nipping unit.
2. The apparatus according to claim 1 , wherein the nipping unit includes a cleaning unit configured to clean the liquid absorbing sheet.
3. The apparatus according to claim 1 , wherein the nipping unit includes an application unit configured to apply a recovery liquid that is lower in viscosity than the liquid component.
4. The apparatus according to claim 1 , wherein the absorption unit and the nipping unit include rollers configured to nip the liquid absorbing sheet.
5. The apparatus according to claim 1 , wherein the nipping unit includes the driving unit.
6. The apparatus according to claim 1 , wherein the nipping pressure of the removing unit is not lower than 0.15 MPa.
7. The apparatus according to claim 1 , wherein the nipping pressure of the nipping unit is not higher than 0.15 MPa.
8. The apparatus according to claim 1 , wherein the liquid absorbing sheet is made of a porous material including at least two layers of an obverse layer contacting the ink image and a reverse layer not contacting the ink image.
9. The apparatus according to claim 8 , wherein an average pore size of the reverse layer is larger than an average pore size of the obverse layer.
10. The apparatus according to claim 8 , wherein in the nipping unit, an area where the nipping unit contacts the obverse layer is smaller than an area where the nipping unit contacts the reverse layer.
11. The apparatus according to claim 8 , wherein a compressive modulus of the obverse layer is higher than a compressive modulus of the reverse layer.
12. The apparatus according to claim 1 , wherein the nipping pressure of the nipping unit is not higher than 10% of a compressive modulus of a porous material forming the liquid absorbing sheet.
13. The apparatus according to claim 1 , wherein the liquid absorbing sheet is made of a porous material whose average pore size changes in a thickness direction.
14. The apparatus according to claim 1 , wherein the removing unit nips the liquid absorbing sheet with a highest nipping pressure, other than a nipping pressure of the absorption unit.
15. A liquid absorbing apparatus for absorbing a liquid component from a formed ink image, the liquid absorbing apparatus comprising:
an endless liquid absorbing sheet;
a driving unit configured to move the liquid absorbing sheet cyclically;
an absorption unit configured to absorb the liquid component from the ink image by making the liquid absorbing sheet contact the ink image;
a removing unit configured to squeeze and remove a liquid with a nipping pressure by nipping the liquid absorbing sheet; and
at least one nipping unit, different from the absorption unit and the removing unit, configured to nip the liquid absorbing sheet,
wherein the nipping pressure of the removing unit is set higher than a nipping pressure of the nipping unit.
16. A control method for a liquid absorbing apparatus including a liquid absorbing unit configured to absorb a liquid component from a formed ink image,
the liquid absorbing unit including
an endless liquid absorbing sheet,
a driving unit configured to move the liquid absorbing sheet cyclically,
an absorption unit configured to absorb the liquid component from the ink image by making the liquid absorbing sheet contact the ink image,
a removing unit configured to squeeze and remove a liquid with a nipping pressure by nipping the liquid absorbing sheet, and
at least one nipping unit, different from the absorption unit and the removing unit, configured to nip the liquid absorbing sheet,
the method comprising controlling at least one of the removing unit and the nipping unit so that the nipping pressure of the removing unit becomes higher than a nipping pressure of the nipping unit.
17. The method according to claim 16 , wherein the nipping unit includes a cleaning unit configured to clean the liquid absorbing sheet.
18. The method according to claim 16 , wherein the nipping unit includes an application unit configured to apply a recovery liquid lower in viscosity than the liquid component.
19. The method according to claim 16 , wherein the nipping pressure of the removing unit is not lower than 0.15 MPa.
20. The method according to claim 16 , wherein the nipping pressure of the nipping unit is not higher than 0.15 MPa.