Electronic image capture device
An electronic image capture device includes a first portion and a second portion. The first portion is formed by a substrate wafer provided on one side with electronic circuits and a dielectric layer with a network of electrical connections and external electrical contacts on an outer surface. The second portion includes a pixel wafer capable of generating electrical signals under the effect of light, a substrate wafer mounted to the pixel wafer and provided with electronic circuits and a dielectric layer with a network of electrical connections and external electrical contacts on an outer surface. The outer surfaces and external electrical contacts are bonded to each other so as to mount the first portion to the second portion. A connection pad extends through a hole in the pixel wafer to make electrical connection to the network of electrical connections of the second portion.
1. An electronic image capture device, comprising:
a first portion comprising:
a first semiconductor substrate wafer including a first surface provided with integrated electronic circuits; and
a first dielectric layer mounted at the first surface of the first semiconductor substrate wafer and including a network of electrical connections, wherein an outer surface of the first dielectric layer includes first electrical contacts; and
a second portion comprising:
a membrane layer including pixels configured to generate electrical signals in response to light;
a second semiconductor substrate wafer including a first surface provided with integrated electronic circuits, a second surface of the second semiconductor substrate wafer mounted directly to the membrane layer; and
a second dielectric layer mounted at the first surface of the second semiconductor substrate wafer and including a network of electrical connections, wherein an outer surface of the second dielectric layer includes second electrical contacts;
wherein said first portion is mounted to said second portion in a position such that the outer surface of the first dielectric layer and the outer surface of the second dielectric layer provided with first and second electrical contacts, and the first electrical contacts are directly bonded to the second electrical contacts; and
wherein a pad for external electrical connection extends through a hole in the membrane layer, said pad being electrically linked to said network of electrical connections included within the second dielectric layer of said second portion.
2. The device according to claim 1 , wherein said first portion and said second portion are assembled together by means of molecular adhesion of said outer surface of the first dielectric layer and the outer surface of the second dielectric layer and of said first and second electrical contacts.
3. The device according to claim 1 , wherein the second semiconductor substrate wafer and the membrane layer are assembled together by means of molecular adhesion.
4. The device according to claim 1 , wherein said hole is located in a region of said second portion that is free from electronic circuits and pixels.
5. The device according to claim 1 , wherein the second semiconductor substrate wafer comprises: a first second and a second section, wherein the first and second sections are insulated from each other, wherein the first section provides an electrical connection between the pad and the network of electrical connections included within the second dielectric layer; and wherein the integrated electronic circuits are located with the second section.
6. The device according to claim 5 , wherein the first section does not include any integrated electronic circuits.
7. The device according to claim 5 , further including a trench isolation for insulating the first and second sections from each other.
8. An electronic image capture device, comprising:
a first portion comprising:
a first semiconductor substrate wafer including a first surface provided with integrated electronic circuits; and
a first dielectric layer mounted at the first surface of the first semiconductor substrate wafer and including a network of electrical connections, wherein an outer surface of the first dielectric layer includes first electrical contacts; and
a second portion comprising:
a membrane layer including pixels configured to generate electrical signals in response to light;
a second semiconductor substrate wafer including a first surface provided with integrated electronic circuits, a second surface of the second semiconductor substrate wafer mounted to the membrane layer; and
a second dielectric layer mounted at the first surface of the second semiconductor substrate wafer and including a network of electrical connections, wherein an outer surface of the second dielectric layer includes second electrical contacts;
wherein said first portion is mounted to said second portion in a position such that the outer surface of the first dielectric layer and the outer surface of the second dielectric layer provided with first and second electrical contacts, and the first electrical contacts are bonded to the second electrical contacts;
wherein a pad for external electrical connection extends through a hole in the membrane layer, said pad being electrically linked to said network of electrical connections included within the second dielectric layer of said second portion;
wherein the second semiconductor substrate wafer comprises: a first second and a second section, wherein the first and second sections are insulated from each other, wherein the first section provides an electrical connection between the pad and the network of electrical connections included within the second dielectric layer; and wherein the integrated electronic circuits are located with the second section; and
wherein the first section is electrically conductive and is aligned with a location of said hole and the pad.
9. The device according to claim 8 , wherein the first section does not include any integrated electronic circuits.
10. The device according to claim 8 , further including a trench isolation for insulating the first and second sections from each other.
11. The device according to claim 8 , wherein said first portion and said second portion are assembled together by means of molecular adhesion of said outer surface of the first dielectric layer and the outer surface of the second dielectric layer surfaces and of said first and second electrical contacts.
12. The device according to claim 8 , wherein the second semiconductor substrate wafer and the membrane layer are assembled together by means of molecular adhesion.
13. The device according to claim 8 , wherein said hole is located in a region of said second portion that is free from electronic circuits and pixels.
14. An electronic image capture device, comprising:
a first portion comprising:
a first semiconductor substrate wafer including a first surface provided with integrated electronic circuits; and
a first dielectric layer mounted at the first surface of the first semiconductor substrate wafer and including a network of electrical connections, wherein an outer surface of the first dielectric layer includes first electrical contacts; and
a second portion comprising:
a membrane layer including pixels configured to generate electrical signals in response to light;
a second semiconductor substrate wafer including a first surface provided with integrated electronic circuits, a second surface of the second semiconductor substrate wafer mounted to the membrane layer; and
a second dielectric layer mounted at the first surface of the second semiconductor substrate wafer and including a network of electrical connections, wherein an outer surface of the second dielectric layer includes second electrical contacts;
wherein said first portion is mounted to said second portion in a position such that the outer surface of the first dielectric layer and the outer surface of the second dielectric layer provided with first and second electrical contacts, and the first electrical contacts are bonded to the second electrical contacts;
wherein a pad for external electrical connection extends through a hole in the membrane layer, said pad being electrically linked to said network of electrical connections included within the second dielectric layer of said second portion;
wherein the second semiconductor substrate wafer comprises: a first second and a second section, wherein the first and second sections are insulated from each other, wherein the first section provides an electrical connection between the pad and the network of electrical connections included within the second dielectric layer; and wherein the integrated electronic circuits are located with the second section; and
wherein the first section includes at least a portion that comprises a metal silicide formed from the second semiconductor substrate wafer.
15. The device according to claim 14 , wherein the first section does not include any integrated electronic circuits.
16. The device according to claim 14 , further including a trench isolation for insulating the first and second sections from each other.
17. The device according to claim 14 , wherein said first portion and said second portion are assembled together by means of molecular adhesion of said outer surface of the first dielectric layer and the outer surface of the second dielectric layer surfaces and of said first and second electrical contacts.
18. The device according to claim 14 , wherein the second semiconductor substrate wafer and the membrane layer are assembled together by means of molecular adhesion.
19. The device according to claim 14 , wherein said hole is located in a region of said second portion that is free from electronic circuits and pixels.