Display device and method for manufacturing the same
A display device and a method for manufacturing the same capable of preventing a defective drive of a gate-in-panel (GIP) driver by dissipating high heat generated in a large-sized thin film transistor of the GIP driver are disclosed. The display device includes a flexible substrate, a GIP driver and a display unit disposed on the flexible substrate, a protective member disposed under the flexible substrate, and a heat pad disposed between the flexible substrate and the protective member and overlapping the GIP driver.
1. A display device comprising:
a flexible substrate;
a gate-in-panel (GIP) driver and display area disposed at the flexible substrate;
a protective member disposed below the flexible substrate; and
a heat pad embedded in a side of the flexible substrate opposite to the GIP driver,
wherein the heat pad is disposed under and overlaps at least a portion of the GIP driver to dissipate heat generated from the GIP driver and does not overlap the display area to prevent a parasitic capacitance caused by electrical interference.
2. The display device of claim 1 , wherein the GIP driver includes a first thin film transistor (TFT) portion, a second TFT portion, and a clock line portion, wherein the first TFT portion has a size greater than that of the second TFT portion.
3. The display device of claim 2 , wherein the first TFT portion is disposed between the second TFT portion and the display unit.
4. The display device of claim 2 , wherein the at least a portion of the GIP driver is the first TFT portion.
5. The display device of claim 4 , wherein the flexible substrate includes at least one groove in a surface of the flexible substrate facing opposite to the GIP driver, and
wherein the heat pad is disposed in the at least one groove.
6. The display device of claim 4 , further comprising:
a metal protective member disposed over the display unit; and
a conductive member connected to the metal protective member,
wherein the heat pad is grounded to the metal protective member through the conductive member.
7. The display device of claim 2 , wherein the heat pad overlaps the first and second TFT portions.
8. The display device of claim 7 , wherein the flexible substrate includes at least one groove in a surface of the flexible substrate facing opposite to the GIP driver, and
wherein the heat pad is disposed in the at least one groove.
9. The display device of claim 7 , further comprising:
a metal protective member disposed at the display unit; and
a conductive member connected to the metal protective member,
wherein the heat pad is grounded to the metal protective member through the conductive member.
10. The display device of claim 2 , wherein the heat pad overlaps the first TFT portion, the second TFT portion, and the clock line portion.
11. The display device of claim 10 , wherein the flexible substrate includes at least one groove in a surface of the flexible substrate facing opposite to the GIP driver, and
wherein the heat pad is disposed in the at least one groove.
12. The display device of claim 10 , further comprising:
a metal protective member disposed on the display unit; and
a conductive member connected to the metal protective member,
wherein the heat pad is grounded to the metal protective member through the conductive member.
13. The display device of claim 1 , wherein the heat pad has a shape of one of a plurality of lines, a mesh, and as rectangle.
14. The display device of claim 1 , wherein the heat pad is formed of metal or metal oxide.
15. The display device of claim 1 , wherein the heat pad has a thickness in a range of 10 nm to 1,000 nm.
16. A display device, comprising:
a flexible substrate;
a display area disposed at the flexible substrate;
a gate-in-panel driver disposed over the flexible substrate and including a first thin film transistor portion, a second thin film transistor portion, and a clock line portion; and
a heat pad embedded in a side of the flexible substrate opposite to the gate-in-panel driver,
wherein the heat pad is disposed under the gate-in-panel driver to dissipate heat generated from the gate-in-panel driver, and overlaps at least one of the first thin film transistor portion, the second thin film transistor portion and the clock line portion, and does not overlap the display area to prevent a parasitic capacitance caused by electrical interference.
17. The display device of claim 16 , further comprising:
a first protective member disposed over the flexible substrate; and
a conductive member electrically connected to the first protective member,
wherein the heat pad is grounded to the first protective member through the conductive member.
18. The display device of claim 16 , wherein the flexible substrate has at least one groove in a surface of the flexible substrate facing opposite to the gate-in-panel driver,
wherein the heat pad is disposed in the at least one groove.
19. The display device of claim 18 , further comprising a second protective member on the surface of the flexible substrate facing opposite to the gate-in-panel driver.