Optical sensor, scanner unit, and image forming apparatus
An optical sensor includes a bare chip mounted on a circuit board, a protection member configured to protect the bare chip, a pad connected to the bare chip via a wire, and a pattern connecting the pad and a terminal portion at an edge of the circuit board to each other. The pattern is connected to the terminal portion on a same surface as a surface on which the bare chip is mounted, and a portion of the pattern between the protection member and the terminal portion is covered with solder resist.
1. An optical sensor comprising:
a circuit board;
a bare chip mounted on the circuit board;
a protection member configured to protect the bare chip;
a pad connected to the bare chip via a wire; and
a pattern connecting the pad and a terminal portion at an edge of the circuit board to each other,
wherein the pattern is connected to the terminal portion on a same surface as a surface on which the bare chip is mounted, and a portion of the pattern between the protection member and the terminal portion is covered with solder resist.
2. The optical sensor according to claim 1 , wherein the protection member is a transparent acrylic resin and is configured to cover the bare chip therewith.
3. A scanner unit comprising:
a light emission element;
a mirror configured to reflect light emitted from the light emission element; and
an optical sensor configured to detect the light reflected by the mirror,
the optical sensor including
a circuit board,
a bare chip mounted on the circuit board,
a protection member configured to protect the bare chip,
a pad connected to the bare chip via a wire, and
a pattern connecting the pad and a terminal portion at an edge of the circuit board to each other,
wherein the pattern is connected to the terminal portion on a same surface as a surface on which the bare chip is mounted, and a portion of the pattern between the protection member and the terminal portion is covered with solder resist.
4. The scanner unit according to claim 3 , wherein the light emission element is a semiconductor laser element.
5. An image forming apparatus comprising:
an image bearing member configured to allow an image to be formed thereon;
a scanner unit configured to irradiate the image bearing member with light to form a latent image on the image bearing member,
the scanner unit including
a light emission element,
a mirror configured to reflect the light emitted from the light emission element, and
an optical sensor configured to detect the light reflected by the mirror,
the optical sensor including
a circuit board,
a bare chip mounted on the circuit board,
a protection member configured to protect the bare chip,
a pad connected to the bare chip via a wire, and
a pattern connecting the pad and a terminal portion at an edge of the circuit board to each other,
wherein the pattern is connected to the terminal portion on a same surface as a surface on which the bare chip is mounted, and a portion of the pattern between the protection member and the terminal portion is covered with solder resist;
a development unit configured to develop the latent image formed on the image bearing member; and
a transfer unit configured to transfer an image developed by the development unit onto a sheet.
6. The image forming apparatus according to claim 5 , wherein the light emission element is a semiconductor laser element.