Method for forming thermally stable organosilicon polymer film
A method of forming a thermally stable organosilicon polymer includes: (i) depositing an organosilicon polymer whose backbone is composed of silicon atoms on a substrate using a silicon-containing precursor in a reaction space; and (ii) exposing the organosilicon polymer deposited in step (i) to a hydrogen plasma in the absence of the precursor in the reaction space in a manner increasing Si—H bonds and decreasing C—H bonds in the organosilicon polymer without depositing an organosilicon polymer.
1. A method of forming a thermally stable organosilicon polymer, comprising:
(i) depositing an organosilicon polymer whose backbone is primarily or partly composed of silicon atoms on a substrate using a silicon-containing precursor in a reaction space; and
(ii) exposing the organosilicon polymer deposited in step (i) to a hydrogen plasma in the absence of the precursor in the reaction space in a manner increasing Si—H bonds and decreasing C—H bonds in the organosilicon polymer without depositing an organosilicon polymer.
2. The method according to claim 1 , wherein step (i) comprises conducting one or more cycles of atomic layer deposition (ALD), and steps (i) and (ii) are repeated as step (iii) until a desired thickness of the organosilicon polymer is obtained.
3. The method according to claim 1 , wherein step (i) comprises conducting chemical vapor deposition (CVD), and steps (i) and (ii) are repeated as step (iii) until a desired thickness of the organosilicon polymer is obtained.
4. The method according to claim 2 , wherein the ALD is plasma-enhanced ALD (PEALD), and step (ii) is conducted 2 to 10 times after conducting each cycle of PEALD.
5. The method according to claim 3 , wherein the CVD is thermal or plasma-enhanced CVD, and step (ii) is conducted after every deposition of the organosilicon polymer having a thickness of 1 to 50 nm in step (i).
6. The method according to claim 1 , wherein step (ii) comprises applying RF power to the reaction space in a range of 0.07 W/cm 2 to 1.4 W/cm 2 to generate the hydrogen plasma.
7. The method according to claim 1 , wherein step (ii) is conducted for 10 seconds to 60 seconds.
8. The method according to claim 1 , wherein step (ii) comprises supplying hydrogen gas and noble gas to the reaction space at a ratio of hydrogen gas flow to total flow of gases including hydrogen gas and noble gas, which is 0.1 to 0.8.
9. The method according to claim 1 , wherein step (ii) comprises supplying only hydrogen gas to the reaction space to generate the hydrogen plasma.
10. The method according to claim 2 , further comprising, after step (iii), annealing the organosilicon polymer wherein the organosilicon polymer manifests substantially no shrinkage.
11. The method according to claim 1 , wherein the organosilicon polymer is constituted by polysilane, polycarbosilane, polysilazane, or polysiloxane.
12. The method according to claim 1 , wherein in step (ii), the hydrogen plasma is a pulsed plasma generated by applying RF power to the reaction space in pulses.
13. The method according to claim 1 , wherein step (i) and step (ii) are conducted continuously in a same reaction chamber.