Sintering device
Sintering device for sintering at least one electronic assembly, having a lower die and an upper die which is slidable towards the lower die, or a lower die which is slidable towards the upper die. The lower die forms a support for the assembly to be sintered and the upper die includes a receptacle for a pressure pad for exerting pressure directed towards the lower die, and a delimitation wall which laterally surrounds the pressure pad. The delimitation wall having an outer delimitation wall and an inner delimitation wall surrounded by the outer delimitation wall, the inner delimitation wall mounted so as to be slidable towards the outer delimitation wall and so as to be slid in the direction of the lower die such that, following the placing of the inner delimitation wall on the lower die, the pressure pad is displaceable in the direction of the lower die.
1. A sintering device for sintering at least one electronic assembly, having a lower die and an upper die which is slidable towards the lower die, or a lower die which is slidable towards the upper die, wherein the lower die forms a support for the assembly to be sintered and the upper die comprises a receptacle which receives a pressure pad for exerting pressure directed towards the lower die and which comprises a delimitation wall which laterally surrounds the pressure pad, and wherein the delimitation wall has an outer delimitation wall and an inner delimitation wall which is surrounded in an adjacent manner by the outer delimitation wall, and wherein the inner delimitation wall is mounted so as to be slidable towards the outer delimitation wall and, when pressure in the direction of the upper die is exerted on the pressure pad, is mounted so as to be slid in the direction of the lower die, whereby, following the placing of the inner delimitation wall on the lower die, the pressure pad is displaceable in the direction of the lower die.
2. The sintering device according to claim 1 , wherein the pressure pad, in the event of movement of the inner delimitation wall in the direction of the upper die, is adapted as a counter bearing for the inner delimitation wall.
3. The sintering device according to claim 1 , wherein the inner delimitation wall protrudes in the direction of the lower die, beyond the outer delimitation wall.
4. The sintering device according to claim 1 , wherein the inner delimitation wall is formed from an oxidic, polymer or metallic material.
5. The sintering device according to claim 1 , wherein the outer and the inner delimitation walls are configured so as to be annular.
6. The sintering device according to claim 1 , wherein the pressure pad is a silicone pad or a rubber pad.
7. The sintering device according to claim 1 , wherein the lower die comprises a depression for receiving the assembly to be sintered or a workpiece carrier for a plurality of assemblies.
8. The sintering device according to claim 1 , wherein a protective film is disposed between the assembly and the upper die.
9. The sintering device according to claim 2 , wherein the inner delimitation wall protrudes in the direction of the lower die, beyond the outer delimitation wall.
10. The sintering device according to claim 2 , wherein the inner delimitation wall is formed from an oxidic, polymer or metallic material.
11. The sintering device according to claim 3 , wherein the inner delimitation wall is formed from an oxidic, polymer or metallic material.
12. The sintering device according to claim 2 , wherein the outer and the inner delimitation walls are configured so as to be annular.
13. The sintering device according to claim 3 , wherein the outer and the inner delimitation walls are configured so as to be annular.
14. The sintering device according to claim 4 , wherein the outer and the inner delimitation walls are configured so as to be annular.
15. The sintering device according to claim 2 , wherein the pressure pad is a silicone pad or a rubber pad.
16. The sintering device according to claim 3 , wherein the pressure pad is a silicone pad or a rubber pad.
17. The sintering device according to claim 4 , wherein the pressure pad is a silicone pad or a rubber pad.
18. The sintering device according to claim 5 , wherein the pressure pad is a silicone pad or a rubber pad.
19. The sintering device according to claim 2 , wherein the lower die comprises a depression for receiving the assembly to be sintered or a workpiece carrier for a plurality of assemblies.
20. The sintering device according to claim 3 , wherein the lower die comprises a depression for receiving the assembly to be sintered or a workpiece carrier for a plurality of assemblies.