Cooling arrangement for computer system
A cooling arrangement for a computer system includes a printed circuit board with first and second heat-generating components; a first heat sink thermally coupled to the first heat-generating component, and a second heat sink thermally coupled to the second heat-generating component; and a first fan that generates an airflow in a direction of the first heat sink, wherein the second heat sink is arranged behind the first heat sink in a direction of airflow generated by the first fan; and an airscoop is arranged between the first heat sink and a blow-out opening of the first fan such that a first part of generated airflow is directly supplied through the airscoop to the first heat sink and a second part of the generated airflow flows around the airscoop and the first heat sink such that the second part of the generated airflow flows to the second heat sink.
1. A cooling arrangement for a computer system comprising:
a main printed circuit board with a first heat-generating component and a second heat-generating component;
a first heat sink thermally coupled to the first heat-generating component, and a second heat sink thermally coupled to the second heat-generating component; and
a first fan that generates an airflow in a direction of the first heat sink,
wherein
the second heat sink is arranged behind the first heat sink in a direction of flow of the airflow generated by the first fan; and
an air duct arranged between the first heat sink and a blow-out opening of the first fan, wherein
the air duct is a hollow body with a first opening and a second opening opposite the first opening,
the first opening faces the blow-out opening of the first fan and the second opening faces the first heat sink;
an area of the blow-out opening of the first fan, which area of the blow-out opening faces the first heat sink, is greater than an area of the first heat sink, which area of the first heat sink faces the blow-out opening and is projected in a plane parallel to the blow-out opening; and
the air duct has a flow cross section corresponding to the area of the first heat sink, which area of the first heat sink faces the blow-out opening and is projected into a plane parallel to the blow-out opening;
such that a first part of generated airflow is exclusively supplied through the air duct to the first heat sink and a second part of the generated airflow flows laterally around the air duct and the first heat sink such that the second part of the generated airflow flows to the second heat sink.
2. The cooling arrangement according to claim 1 , wherein an area of the blow-out opening overlaps an area of the first heat sink, which area faces the blow-out opening and is projected into a plane parallel to the blow-out opening.
3. The cooling arrangement according to claim 1 , wherein the air duct is arranged on the first fan such that the first opening is arranged on a side of the first fan, which side has the blow-out opening.
4. The cooling arrangement according to claim 1 , wherein the air duct is arranged with the second opening on the first heat sink or, by the second opening, encloses the first heat sink at least partially in the direction of a flow direction of the generated airflow of the first fan.
5. The cooling arrangement according to claim 1 , further comprising a second fan that generates an airflow onto the second heat sink and is arranged in a region of the second heat sink.
6. The cooling arrangement according to claim 1 , wherein the first heat sink and/or the second heat sink are cooling bodies with lamellae.
7. A cooling arrangement for a computer system comprising:
a main printed circuit board with a first heat-generating component and a second heat-generating component;
a first heat sink thermally coupled to the first heat-generating component, and a second heat sink thermally coupled to the second heat-generating component; and
a first fan that generates an airflow in a direction of the first heat sink,
wherein
the second heat sink is arranged behind the first heat sink in a direction of flow of the airflow generated by the first fan; and
an air duct is arranged between the first heat sink and a blow-out opening of the first fan such that a first part of generated airflow is exclusively supplied through the air duct to the first heat sink and a second part of the generated airflow flows laterally around the air duct and the first heat sink such that the second part of the generated airflow flows to the second heat sink,
wherein a flow cross section of the air duct, which flow cross section of the air duct is delimited by the first opening, is smaller than an area of the blow-out opening of the first fan.
8. The cooling arrangement according to claim 7 , wherein an area of the blow-out opening overlaps an area of the first heat sink, which area faces the blow-out opening and is projected into a plane parallel to the blow-out opening.
9. The cooling arrangement according to claim 7 , wherein the flow cross section of the air duct corresponds to an area of the first heat sink, which area faces the blow-out opening and is projected into a plane parallel to the blow-out opening.
10. The cooling arrangement according to claim 7 , wherein the air duct is a hollow body with a first opening and with a second opening opposite the first opening, wherein the first opening faces the blow-out opening of the first fan and the second opening faces the first heat sink.
11. The cooling arrangement according to claim 10 , wherein the air duct is arranged on the first fan such that the first opening is arranged on a side of the first fan, which side has the blow-out opening.
12. The cooling arrangement according to claim 10 , wherein the air duct is arranged with the second opening on the first heat sink or, by the second opening, encloses the first heat sink at least partially in the direction of a flow direction of the generated airflow of the first fan.
13. The cooling arrangement according to claim 7 , further comprising a second fan that generates an airflow onto the second heat sink and is arranged in a region of the second heat sink.
14. The cooling arrangement according to claim 7 , wherein the first heat sink and/or the second heat sink are cooling bodies with lamellae.
15. A cooling arrangement for a computer system comprising:
a main printed circuit board with a first heat-generating component and a second heat-generating component;
a first heat sink thermally coupled to the first heat-generating component, and a second heat sink thermally coupled to the second heat-generating component; and
a first fan that generates an airflow in a direction of the first heat sink,
wherein
the second heat sink is arranged behind the first heat sink in a direction of flow of the airflow generated by the first fan; and
an air duct is arranged between the first heat sink and a blow-out opening of the first fan such that a first part of generated airflow is exclusively supplied through the air duct to the first heat sink and a second part of the generated airflow flows laterally around the air duct and the first heat sink such that the second part of the generated airflow flows to the second heat sink,
wherein the air duct is arranged such that the second part of the generated airflow directly flows to the second heat sink without a further air guiding element or air duct.
16. The cooling arrangement according to claim 15 , wherein an area of the blow-out opening overlaps an area of the first heat sink, which area faces the blow-out opening and is projected into a plane parallel to the blow-out opening.
17. The cooling arrangement according to claim 15 , wherein the air duct has a flow cross section corresponding to an area of the first heat sink, which area faces the blow-out opening and is projected into a plane parallel to the blow-out opening.
18. The cooling arrangement according to claim 15 , wherein the air duct is a hollow body with a first opening and with a second opening opposite the first opening, wherein the first opening faces the blow-out opening of the first fan and the second opening faces the first heat sink.