Method of manufacturing semiconductor device
In manufacturing a trench type MOSFET, reliability of a semiconductor device is prevented from being degraded due to a short circuit or lowering of withstand voltage between a trench gate electrode and a source region. To achieve the above, poly-silicon films are formed inside a trench in a main surface of a semiconductor substrate and over the semiconductor substrate. Further, phosphorus is thermally diffused into each poly-silicon film from a phosphorous film over an upper surface of the poly-silicon film. Still further, a silicon oxide film formed in a surface layer of the poly-silicon film by the thermal diffusion process is removed by a first dry etching process using a fluorocarbon gas or a hydroxy-fluorocarbon gas. Then, by performing a second dry etching process using a Cl2 gas etc., an insulating film is exposed and, thereby, a trench gate electrode including the poly-silicon film is formed.
1. A method of manufacturing a semiconductor device, the method comprising:
(a) providing a semiconductor substrate;
(b) forming a trench in a main surface of the semiconductor substrate;
(c) by sequentially forming an insulating film, a poly-silicon film, and a first film including first conductivity type impurities over the semiconductor substrate, embedding the poly-silicon film in the trench on the insulating film;
(d) diffusing the impurities into the poly-silicon film from the first film by applying heat treatment to the semiconductor substrate;
(e) allowing an upper surface of the poly-silicon film to retreat by a first dry etching process;
(f) after the (e) allowing the upper surface of the poly-silicon film to retreat by the first dry etching process, allowing the upper surface of the poly-silicon film to further retreat by a second dry etching process, until exposing the insulating film and forming a gate electrode comprising the poly-silicon film as embedded in the trench,
wherein a selection ratio to silicon oxide in the first dry etching process is smaller than a selection ratio to silicon oxide in the second dry etching process.
2. The method of manufacturing a semiconductor device according to claim 1 , wherein a fluorocarbon gas or a hydroxy-fluorocarbon gas is used as an etching gas in the first dry etching process.
3. The method of manufacturing a semiconductor device according to claim 2 , wherein there is used a C X F Y (X, Y: positive integers) being the fluorocarbon gas or a C X H Y F Z (X, Y, Z: positive integers) being the hydroxy-fluorocarbon gas as an etching gas in the first etching process.
4. The method of manufacturing a semiconductor device according to claim 2 , wherein there is used a CF 4 gas being the fluorocarbon gas, a C 4 F 8 gas, a C 5 F 8 gas, or a CHF 3 gas being the hydroxy-fluorocarbon gas as an etching gas in the first dry etching process.
5. The method of manufacturing a semiconductor device according to claim 3 , wherein a Cl 2 gas, an HBr gas, or an SF 6 gas is used as an etching gas in the second dry etching process.
6. The method of manufacturing a semiconductor device according to claim 1 ,
wherein, in the (d) diffusing the impurities into the poly-silicon film, a first silicon oxide film is formed in the poly-silicon film by applying heat treatment, and
wherein, in the (e) retreating of the upper surface of the poly-silicon film by the first dry etching process, by performing the first dry etching process, part of the poly-silicon film and the first silicon oxide film covered with the part of the poly-silicon film are removed.
7. The method of manufacturing a semiconductor device according to claim 6 , wherein, in the (d) diffusing the impurities into the poly-silicon film, a second silicon oxide film between the upper surface of the poly-silicon film and the first film as well as the first silicon film are formed by applying heat treatment, further comprising:
(d1) before the (e) retreating of the upper surface of the poly-silicon film by the first dry etching process, removing the first silicon oxide film.
8. The method of manufacturing a semiconductor device according to claim 7 , wherein, in the (d1) removing of the first silicon oxide film, the first silicon oxide film is removed by wet etching.
9. The method of manufacturing a semiconductor device according to claim 1 , wherein a selection ratio of the first dry etching process to silicon oxide is 0.8 to 1.0.
10. The method of manufacturing a semiconductor device according to claim 1 , wherein the impurities are phosphorus.
11. The method of manufacturing a semiconductor device according to claim 1 , wherein, immediately after the (f) exposing the insulating film and forming the gate electrode including the poly-silicon film in the trench, the main surface of the semiconductor substrate adjacent to the trench is covered with the insulating film.
12. The method of manufacturing a semiconductor device according to claim 1 , wherein, after the (e) retreating of the upper surface of the poly-silicon film by the first dry etching process but before the (f) exposing the insulating film and forming the gate electrode including the poly-silicon film in the trench, an upper surface of the insulating film beside the trench is covered with the poly-silicon film.
13. The method of manufacturing a semiconductor device according to claim 1 , further comprising:
(g) after the (f) exposing the insulating film and forming the gate electrode including the poly-silicon film in the trench, forming a source region over the main surface of the semiconductor substrate adjacent to the trench;
(h) after the (g) forming of the source region adjacent to the trench, forming an interlayer insulating film over the semiconductor substrate and the gate electrode;
(i) forming a contact plug penetrating the interlayer insulating film and coupled to an upper surface of the source region beside the trench; and
(j) forming a drain region over a back surface on the opposite side of the main surface of the semiconductor substrate,
wherein the gate electrode, the source region, and the drain region form a field-effect transistor.
14. The method of manufacturing a semiconductor device according to claim 13 , wherein the source region and the drain region are the first conductivity type semiconductor regions.
15. The method of manufacturing a semiconductor device according to claim 1 , wherein the (c) sequentially forming of the insulating film, the poly-silicon film, and the first film including first conductivity type impurities over the semiconductor substrate comprises:
depositing the insulating film on an upper surface of the semiconductor substrate with the trench formed in its main surface, using a thermal oxidation such that the deposited insulating film covers a bottom and sidewalls of the trench but does not completely fill the trench;
depositing the poly-silicon film deposited on the insulating film, using a chemical vapor deposition (CVD) method, so as to completely fill the trench; and
depositing the first film including first conductivity type impurities on top of the poly-silicon film.
16. A semiconductor device manufactured by the method of claim 1 .
17. A method of fabricating a semiconductor device, the method comprising:
providing a semiconductor substrate;
forming a trench in a main surface of the semiconductor substrate;
depositing a layer of insulating film on an upper surface of the semiconductor substrate with the trench formed in its main surface, using a thermal oxidation such that the deposited insulating film covers a bottom and sidewalls of the trench but does not completely fill the trench;
depositing a poly-silicon film on the insulating film, using a chemical vapor deposition (CVD) method, so as to completely fill the trench; and
depositing a first film including first conductivity type impurities on top of the poly-silicon film;
diffusing the impurities into the poly-silicon film from the first film by applying heat treatment to the semiconductor substrate;
forming a gate electrode as embedded in the trench by first allowing an upper surface of the poly-silicon film to retreat by a first dry etching process followed by a second dry etching process that exposes a top surface of the insulating film, thereby forming a gate electrode comprising the poly-silicon film as embedded in the trench,
wherein a selection ratio to silicon oxide in the first dry etching process is smaller than a selection ratio to silicon oxide in the second dry etching process.
18. The method of fabricating the semiconductor device according to claim 17 , wherein a fluorocarbon gas or a hydroxy-fluorocarbon gas is used as an etching gas in the first dry etching process and a Cl 2 gas, an HBr gas, or an SF 6 gas is used as an etching gas in the second dry etching process.
19. A method of fabricating a semiconductor device, the method comprising:
providing a semiconductor substrate;
forming a trench in a main surface of the semiconductor substrate; and
forming a gate electrode as embedded in the trench by:
depositing a layer of insulating film on an upper surface of the semiconductor substrate with the trench formed in its main surface, using a thermal oxidation such that the deposited insulating film covers a bottom and sidewalls of the trench but does not completely fill the trench;
depositing a poly-silicon film on the insulating film, using a chemical vapor deposition (CVD) method, so as to completely fill the trench; and
depositing a first film including first conductivity type impurities on top of the poly-silicon film;
diffusing the impurities into the poly-silicon film from the first film by applying heat treatment to the semiconductor substrate;
forming the gate electrode as embedded in the trench by first allowing an upper surface of the poly-silicon film to retreat by a first dry etching process followed by a second dry etching process that exposes a top surface of the insulating film, thereby forming a gate electrode comprising the poly-silicon film as embedded in the trench,
wherein a selection ratio to silicon oxide in the first dry etching process is smaller than a selection ratio to silicon oxide in the second dry etching process.
20. The method of fabricating the semiconductor device according to claim 19 , wherein a fluorocarbon gas or a hydroxy-fluorocarbon gas is used as an etching gas in the first dry etching process and a Cl 2 gas, an HBr gas, or an SF 6 gas is used as an etching gas in the second dry etching process.