Manufacturing method of semiconductor device and semiconductor device
A manufacturing method of a semiconductor device according to the present embodiment includes forming a modified layer with distortion in semiconductor crystals in a first and a second semiconductor wafers by radiating laser to a dicing region of the first and second semiconductor wafers, each of the first and second semiconductor wafers including a plurality of semiconductor chips. The method also includes stacking the second semiconductor wafer on the first semiconductor wafer to be shifted in a first direction. The first direction is a direction from a first side of a first semiconductor chip of the first semiconductor wafer towards an opposite side to the first side of the first semiconductor chip. The method further includes cleaving the first and second semiconductor wafers.
1. A manufacturing method of a semiconductor device, the method comprising:
forming a modified layer with distortion in semiconductor crystals in a first and a second semiconductor wafers by radiating laser to a dicing region of the first and second semiconductor wafers, each of the first and second semiconductor wafers including a plurality of semiconductor chips;
stacking the second semiconductor wafer on the first semiconductor wafer to be shifted in a first direction, the first direction being a direction from a first side of a first semiconductor chip of the first semiconductor wafer towards an opposite side to the first side of the first semiconductor chip; and
cleaving the first and second semiconductor wafers after stacking the second semiconductor wafer on the first semiconductor wafer.
2. The method of claim 1 , further comprising
forming a first adhesive on front surfaces of the first semiconductor chip included in the first semiconductor wafer to cover a region from the opposite side to the first side of the first semiconductor chip to a first boundary in front of bonding pads provided on the first semiconductor chip and not to cover a region from the first boundary to the first side of the first semiconductor chip, wherein
the second semiconductor wafer is stacked on the first semiconductor wafer such that a side of a second semiconductor chip of the second semiconductor wafer is shifted from the first side of the first semiconductor chip of the first semiconductor wafer to the first boundary of the first semiconductor chip.
3. The method of claim 1 , further comprising:
stacking third to n-th semiconductor wafers (n is an integer equal to or more than 3) having substantially same configurations as the first and second semiconductor wafers on the second semiconductor wafer; and
cleaving the stacked first to n-th semiconductor wafers, wherein
the second to n-th semiconductor wafers are stacked to be shifted in the first direction with respect to corresponding semiconductor wafers directly below, respectively.
4. The method of claim 2 , further comprising:
stacking third to n-th semiconductor wafers (n is an integer equal to or more than 3) having substantially same configurations as the first and second semiconductor wafers on the second semiconductor wafer; and
cleaving the stacked first to n-th semiconductor wafers, wherein
the second to n-th semiconductor wafers are stacked to be shifted in the first direction with respect to corresponding semiconductor wafers directly below, respectively.
5. The method of claim 2 , wherein
the first adhesive is a photosensitive adhesive, and
in the forming the first adhesive, the first adhesive is provided on the first semiconductor wafer and is thereafter processed by a lithography technology to cover the region from the opposite side to the first side of the first semiconductor chip to the first boundary in front of the bonding pads provided on the first semiconductor chip and not to cover the region from the first boundary to the first side of the first semiconductor chip.
6. The method of claim 3 , wherein
the first adhesive is a photosensitive adhesive, and
in the forming the first adhesive, the first adhesive is provided on the first semiconductor wafer and is thereafter processed by a lithography technology to cover the region from the opposite side to the first side of the first semiconductor chip to the first boundary in front of the bonding pads provided on the first semiconductor chip and not to cover the region from the first boundary to the first side of the first semiconductor chip.
7. The method of claim 1 , wherein the stacking includes:
pressing the first and second semiconductor wafers by a first pressure; and
pressing the first and second semiconductor wafers by a second pressure higher than the first pressure, after pressing by the first pressure.
8. The method of claim 2 , wherein the stacking includes:
pressing the first and second semiconductor wafers by a first pressure; and
pressing the first and second semiconductor wafers by a second pressure higher than the first pressure, after pressing by the first pressure.
9. The method of claim 3 , wherein
the stacking includes:
pressing the first and second semiconductor wafers by a first pressure; and
pressing the first and second semiconductor wafers by a second pressure higher than the first pressure, after pressing by the first pressure.
10. The method of claim 1 , wherein the semiconductor chips of the first and second semiconductor wafers respectively have substantially same configurations.
11. The method of claim 1 , further comprising:
after cleaving the first and second semiconductor wafers,
mounting stacked semiconductor chips on a mounting board;
bonding a plurality of bonding pads provided on the semiconductor chips to the mounting board with wires; and
covering the semiconductor chips and the wires with a resin.