Method of fabricating vertical memory devices having a plurality of vertical channels on a channel layer
According to example embodiments, a vertical memory device includes a low resistance layer on a lower insulation layer, a channel layer on the low resistance layer, a plurality of vertical channels on the channel layer, and a plurality of gate lines. The vertical channels extend in a first direction that is perpendicular with respect to a top surface of the channel layer. The gate lines surround outer sidewalls of the vertical channels, and are stacked in the first direction and are spaced apart from each other.
1. A method of manufacturing a vertical memory device, the method comprising:
forming a lower insulation layer on a substrate;
forming a low resistance layer on the lower insulation layer;
forming a channel layer on the low resistance layer;
forming a plurality of vertical channels on the channel layer, the vertical channels extending in a first direction that is perpendicular with respect to a top surface of the channel layer, the vertical channels including outer sidewalls, the vertical channels being over the low resistance layer in the first direction; and
forming a plurality of gate lines surrounding the outer sidewalls of the vertical channels, the gate lines being stacked in the first direction and spaced apart from each other.
2. The method of the vertical memory device of claim 1 , further comprising:
forming an ohmic contact layer between the low resistance layer and the channel layer.
3. The method of the vertical memory device of claim 2 , wherein
the ohmic contact layer and the channel layer include polysilicon doped with p-type impurities, and
an impurity concentration of the ohmic contact layer is greater than an impurity concentration of the channel layer.
4. The method of the vertical memory device of claim 1 , further comprising:
forming a hole extending in the first direction through the plurality of gate lines, a bottom of the hole exposing the channel layer;
forming an insulation pattern on a sidewall of the hole; and
forming a common source line contact filling the hole, wherein the common source line formed on the channel layer.
5. The method of the vertical memory device of claim 4 , further comprising:
forming an impurity region an upper portion of the channel layer exposed by the hole.
6. The method of the vertical memory device of claim 1 , wherein
the low resistance layer includes at least one of a metal, a metal nitride and a metal silicide, and
an electrical resistance of the low resistance layer is less than an electrical resistance of the channel layer.
7. The method of the vertical memory device of claim 1 , wherein the low resistance layer covers an upper surface of the lower insulation layer.
8. The method of the vertical memory device of claim 1 , wherein forming the low resistance layer on the lower insulation layer comprises:
etching an upper portion of the lower insulation layer to form an opening; and
filling a conductive layer in the opening to form the low resistance layer.
9. The method of the vertical memory device of claim 1 , further comprising:
forming a peripheral circuit on the substrate, wherein the lower insulation layer covers the peripheral circuit.
10. A method of manufacturing a vertical memory device, the method comprising:
forming a lower insulation layer on a substrate;
forming a first channel layer on the lower insulation layer;
forming a second channel layer on the first channel layer, the second channel layer and the first channel layer being spaced apart from each other in a first direction that is perpendicular with respect to a top surface of the second channel layer;
forming a plurality of vertical channels on the first channel layer, the vertical channels extending in the first direction; and
forming a plurality of gate lines, the gate lines surrounding outer sidewalls of the vertical channels, the gate lines being stacked in the first direction and spaced apart from each other in the first direction on the lower insulation layer.
11. The method of the vertical memory device of claim 10 , wherein forming the first channel layer on the lower insulation layer includes:
forming a channel layer on the lower insulation layer; and
patterning the channel layer to form a first channel pattern including a plurality of line patterns.
12. The method of the vertical memory device of claim 11 , wherein each one of the line patterns overlaps at least one channel row including a plurality of the vertical channels.
13. The method of the vertical memory device of claim 10 , further comprises:
forming a hole extending in the first direction through the plurality of gate lines, the hole exposing the second channel layer;
forming an insulation pattern on the sidewall of the hole; and
forming a common source line contact filling the hole, wherein the common source line formed on the second channel layer.
14. The method of the vertical memory device of claim 13 , further comprises:
forming an impurity region an upper portion of the second channel layer exposed by the hole.
15. The method of the vertical memory device of claim 10 , wherein
the first channel layer and the second channel layer include polysilicon doped with p-type impurities, and
an impurity concentration of the first channel layer is greater than an impurity concentration of the second channel layer.
16. The method of the vertical memory device of claim 10 , wherein a thickness of the first channel layer is greater than a thickness of the second channel layer.
17. The method of the vertical memory device of claim 10 , further comprising:
forming a semiconductor pattern on the second channel layer, wherein the semiconductor pattern passing through the second channel layer and a lower most gate line,
wherein the vertical channels are formed on the semiconductor pattern.
18. The method of the vertical memory device of claim 10 , further comprises:
forming a peripheral circuit on the substrate, wherein the lower insulation layer covers the peripheral circuit.
19. A method of manufacturing a vertical memory device, the method comprising:
forming a peripheral circuit on a substrate;
forming a lower insulation layer on a substrate, the lower insulation layer covering the peripheral circuit;
forming a low resistance layer on the lower insulation layer;
forming a channel layer on the low resistance layer;
forming a plurality of vertical channels on the channel layer, the vertical channels extending in a first direction that is perpendicular with respect to a top surface of the channel layer, the vertical channels including outer sidewalls, the vertical channels being over the low resistance layer in the first direction; and
forming a plurality of gate lines surrounding the outer sidewalls of the vertical channels, the gate lines being stacked in the first direction and spaced apart from each other.
20. The method of the vertical memory device of claim 19 , wherein the low resistance layer is spaced apart from the channel layer in the first direction.