Solid-state imaging device with light shielding films, method of manufacturing the same, and electronic apparatus
Provided is a solid-state imaging device that includes: a semiconductor substrate having photodiodes formed for respective pixels, the photodiodes performing photoelectric conversion; color filters that pass light in the colors corresponding to the respective pixels, the color filters being stacked on the light incident surface side of the semiconductor substrate; and a light shielding film provided between the color filters of the respective pixels, the light shielding film being formed by stacking a first light shielding film and a second light shielding film, the first light shielding film and the second light shielding film being formed with two different materials from each other. The first light shielding film is formed with a metal having a light shielding effect, and the second light shielding film is formed with a resin having photosensitivity. The present technology can be applied to back-illuminated CMOS image sensors, for example.
1. A solid-state imaging device, comprising:
a semiconductor substrate comprising photodiodes for respective pixels of a plurality of pixels, wherein the photodiodes are configured to photoelectrically convert incident light into electrical charges;
a plurality of color filters that comprises at least one red color filter, wherein
the plurality of color filters is configured to pass the incident light in colors corresponding to the respective pixels,
the plurality of color filters is on a light incident surface side of the semiconductor substrate; and
a light shielding film comprising a first light shielding film and a second light shielding film, wherein
the first light shielding film and the second light shielding film are of two different materials,
the first light shielding film and the second light shielding film are between color filters of the plurality of color filters of the respective pixels,
the second light shielding film comprises a first portion between the plurality of color filters and a second portion on an entire top surface of the at least one red color filter,
the entire top surface of the at least one red color filter is at the light incident surface side of the semiconductor substrate,
a combination of a first thickness of the first light shielding film and a second thickness of the first portion of the second light shielding film above the semiconductor substrate is substantially same as a third thickness of each of the plurality of color filters above the semiconductor substrate,
a fourth thickness of the second portion of the second light shielding film is smaller than the second thickness of the first portion of the second light shielding film,
the first light shielding film is closer to the semiconductor substrate than the second light shielding film,
the first light shielding film comprises a metal comprising a light shielding effect, and the second light shielding film comprises a resin comprising photosensitivity.
2. The solid-state imaging device according to claim 1 , wherein
at least one pixel of the plurality of pixels is autofocus pixel,
the at least one pixel is configured to control autofocus based on a phase difference in an imaging surface of the solid-state imaging device,
the first light shielding film and the second light shielding film are on the autofocus pixel, and
the first light shielding film and the second light shielding film are configured to shield the at least one pixel from light for execution of pupil splitting process.
3. The solid-state imaging device according to claim 2 , wherein
a first portion of the at least one pixel is filled with a transparent material, and
the first portion of the at least one pixel is equivalent to a second portion of the plurality of color filters in the plurality of pixels other than the autofocus pixel.
4. The solid-state imaging device according to claim 1 , wherein the plurality of color filters for the respective pixels further comprises at least one color among blue, green, cyan, magenta, yellow, transparence, or gray.
5. The solid-state imaging device according to claim 1 , wherein
the semiconductor substrate comprises a pixel separating portion comprising insulation properties, and
the pixel separating portion is configured to separate the photodiodes of adjacent pixels of the plurality of pixels from one another.
6. The solid-state imaging device according to claim 1 , wherein the first light shielding film and the first portion of the second light shielding film are stacked between the plurality of color filters of the respective pixels.
7. A method of manufacturing a solid-state imaging device, comprising:
forming photodiodes for respective pixels of a plurality of pixels in a semiconductor substrate, wherein the photodiodes are configured to photoelectrically convert incident light into electrical charges;
stacking a plurality of color filters on a light incident surface side of the semiconductor substrate, wherein
the plurality of the color filters comprises at least one red color filter, and
the plurality of color filters is configured to pass the incident light in colors corresponding to the respective pixels; and
providing a first light shielding film and a second light shielding film between the plurality of color filters of the respective pixels, wherein
the first light shielding film and the second light shielding film are of two different materials,
the second light shielding film comprises a first portion between the plurality of color filters and a second portion on an entire top surface of the at least one red color filter,
the entire top surface of the at least one red color filter is at the light incident surface side of the semiconductor substrate,
a combination of a first thickness of the first light shielding film and a second thickness of the first portion of the second light shielding film above the semiconductor substrate is substantially same as a third thickness of each of the plurality of color filters above the semiconductor substrate,
a fourth thickness of the second portion of the second light shielding film is smaller than the second thickness of the first portion of the second light shielding film,
the first light shielding film is closer to the semiconductor substrate than the second light shielding film,
the first light shielding film comprises a metal comprising a light shielding effect, and
the second light shielding film comprises a resin comprising photosensitivity.
8. An electronic apparatus, comprising:
a solid-state imaging device, wherein the solid-state imaging device comprises:
a semiconductor substrate comprising photodiodes for respective pixels of a plurality of pixels wherein the photodiodes are configured to photoelectrically convert incident light into electrical charges;
a plurality of color filters that comprises at least one red color filter, wherein
the plurality of color filters is configured to pass the incident light in colors corresponding to the respective pixels, and
the plurality of color filters is on a light incident surface side of the semiconductor substrate; and
a light shielding film comprising a first light shielding film and a second light shielding film, wherein
the first light shielding film and the second light shielding film are of two different materials,
the first light shielding film and the second light shielding film are between color filters of the plurality of color filters of the respective pixels,
the second light shielding film comprises a first portion between the plurality of color filters and a second portion on an entire top surface of the at least one red color filter,
the entire top surface of the at least one red color filter is at the light incident surface side of the semiconductor substrate,
a combination of a first thickness of the first light shielding film and a second thickness of the first portion of the second light shielding film above the semiconductor substrate is substantially same as a third thickness of each of the plurality of color filters above the semiconductor substrate,
a fourth thickness of the second portion of the second light shielding film is smaller than the second thickness of the first portion of the second light shielding film, and
the first light shielding film is closer to the semiconductor substrate than the second light shielding film,
the first light shielding film comprises a metal comprising a light shielding effect, and
the second light shielding film comprises a resin comprising photosensitivity.