Microwave or millimeter wave RF part realized by die-forming
A method and apparatus for producing an RF part of an antenna system is disclosed, as well as thereby producible RF parts. The RF part has at least one surface provided with a plurality of protruding elements. In particular, the RF part may be a gap waveguide. The protruding elements are monolithically formed and fixed on a conducting layer, and all protruding elements are connected electrically to each other at their bases via the conductive layer. The RF part is produced by providing a die having a plurality of recessions forming the negative of the protruding elements of the RF part. The die may be a multilayer die, having several layers, at least some having through-holes to form the recessions. A formable piece of material is arranged on the die, and pressure is applied, thereby compressing the formable piece of material to conform with the recessions of the die.
1. A radio frequency (RF) part of an antenna system, comprising at least two conducting layers arranged with a gap there between, and a set of periodically or quasi-periodically arranged protruding elements fixedly connected to at least one of said conducting layers, thereby forming a texture to stop wave propagation in a frequency band of operation in other directions than along intended waveguiding paths, wherein said protruding elements are monolithically formed on said at least one conducting layer, whereby each protruding element is monolithically fixed to the at least one conducting layer, all protruding elements being connected electrically to each other at their bases via said at least one conductive layer on which they are fixedly connected,
further comprising at least one integrated circuit module arranged between said at least two conducting layers, the texture to stop wave propagation thereby functioning as a means of removing resonances within a package for said at least one integrated circuit module.
2. The RF part of claim 1 , wherein the protruding elements being monolithically formed on said at least one conducting layer are formed by coining.
3. The RF part of claim 1 , wherein the RF part is a waveguide, and wherein the protruding elements are further in contact with also another conducting layer of the at least two conducting layers, and wherein the protruding elements are arranged to at least partly surround a cavity between said at least two conducting layers, said cavity thereby functioning as the waveguide.
4. The RF part of claim 1 , wherein the RF part is a gap waveguide, and further comprising at least one groove, ridge or microstrip line along which waves are to propagate.
5. The RF part of claim 1 , wherein the RF part is a gap waveguide, and further comprising at least one ridge along which waves are to propagate, said at least one ridge being arranged on the same conducting layer as the protruding elements, and also being monolithically formed on said at least one conducting layer.
6. The RF part of claim 1 , wherein each of the protruding elements have maximum cross-sectional dimensions of less than half a wavelength in air at the operating frequency, and/or wherein each of the protruding elements in the texture stopping wave propagation are spaced apart by a spacing being smaller than half a wavelength in air at the operating frequency.
7. The RF part of claim 1 , wherein the protruding elements forming said texture to stop wave propagation are only in contact with one of the at least two conducting layers.
8. The RF part of claim 1 , wherein one of the at least two conducting layers is provided with at least one opening, said at least one opening allowing radiation to be transmitted to and/or received from said RF part.
9. The RF part of claim 1 , wherein one of the at least two conducting layers is a conducting layer not being provided with said protruding elements,
wherein the at least one integrated circuit module is arranged on the conducting layer not being provided with said protruding elements, and wherein protruding elements overlying the at least one integrated circuit module are shorter than protruding elements not overlying said at least one integrated circuit module.
10. A flat array antenna comprising a corporate distribution network realized by the RF part in accordance with claim 1 .