IP Library › Granted Patent US 10,502,638
Granted Patent B2
US 10,502,638 · App. 15/409,691 · Granted Dec 10, 2019

Temperature detecting device and electronic device

Inventors: Tadamasa Miura (Nagaokakyo, JP); Kazuto Miyagawa (Nagaokakyo, JP); Akihito Naito (Nagaokakyo, JP)
Assignee: MURATA MANUFACTURING CO., LTD.
G01K7/22G01K7/16G01K13/00
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Quick Facts
Patent No.
US 10,502,638
App. No.
15/409,691
Granted
Dec 10, 2019
Kind
B2
Abstract

A temperature detector is configured to detect the temperature of a housing while in contact with the housing, and a spring pin is in contact with the temperature detector in a separable manner. Thus, at mounting of the temperature detecting device on an electronic device, it is possible to fix the temperature detector to the housing, and the spring pin to a circuit board of the electronic device. At disassembly of the electronic device, it is easy to separate the spring pin from the temperature detector by removing, from the housing, the spring pin together with the circuit board. At assembly of the electronic device, it is easy for the spring pin to contact the temperature detector by attaching, to the housing, the spring pin together with the circuit board.

Claims (39)

1. A temperature detecting device configured to detect a temperature of a housing of an electronic device, the temperature detecting device comprising:

a temperature detector that detects the temperature of the housing while in contact with the housing of the electronic device;

a spring pin electrically connected with the temperature detector while in contact with the temperature detector in a separable manner; wherein

the temperature detecting device is to be disposed inside of the housing of the electronic device;

the temperature detector includes a substrate including a wire, and a thermistor attached to the substrate and electrically connected with the wire;

the spring pin includes a tube body, a pin portion attached in the tube body in a movable manner, and a spring that presses the pin portion to protrude out of the tube body; and

the pin portion is electrically connected with the wire of the substrate while in contact with the wire of the substrate in a separable manner.

2. The temperature detecting device according to claim 1 , further comprising an additional spring pin.

3. The temperature detecting device according to claim 2 , wherein the spring pin and the additional spring pin elastically press the temperature detector to cause the temperature detector to contact with the housing elastically.

4. The temperature detecting device according to claim 1 , wherein the substrate includes a base material, the wire and an additional wire, and two covers that cover a portion of the wire and the additional wire.

5. The temperature detecting device according to claim 1 , wherein the thermistor is a multilayer chip thermistor.

6. The temperature detecting device according to claim 1 , wherein the thermistor includes a thermistor body, a first external electrode, and a second external electrode.

7. The temperature detecting device according to claim 6 , wherein the thermistor body includes a plurality of ceramic layers laminated on top of another and an internal electrode between adjacent ones of the plurality of ceramic layers.

8. The temperature detecting device according to claim 1 , wherein the thermistor is an NTC thermistor and has a resistance value that decreases as the temperature increases.

9. The temperature detecting device according to claim 1 , wherein the spring pin is a pogo pin.

10. The temperature detecting device according to claim 1 , wherein the substrate includes a base material, and the temperature detecting device further comprises a bonding member that attaches a surface of the base material, which is opposite to the thermistor, to the housing.

11. The temperature detecting device according to claim 10 , wherein the bonding member is a double-sided adhesive tape and is thermally conductive.

12. The temperature detecting device according to claim 10 , wherein the bonding member overlaps with the thermistor when viewed in a direction orthogonal to the base material.

13. An electronic device comprising:

a housing;

a circuit board disposed in the housing; and

a temperature detecting device disposed in the housing to detect the temperature of the housing; wherein

the temperature detecting device includes:

a temperature detector that detects the temperature of the housing while in contact with the housing; and

a spring pin electrically connected with the temperature detector while in contact with the temperature detector in a separable manner;

the temperature detector includes a substrate including a wire, and a thermistor attached to the substrate and electrically connected with the wire;

the spring pin includes a tube body, a pin portion attached in the tube body in a movable manner, and a spring that presses the pin portion to protrude out of the tube body; and

the pin portion is electrically connected with the wire of the substrate while in contact with the wire of the substrate in a separable manner.

14. The electronic device according to claim 13 , wherein

the temperature detector of the temperature detecting device is fixed to the housing; and

the spring pin of the temperature detecting device is fixed to the circuit board.

15. The electronic device according to claim 13 , wherein the electronic device is one of a phone and a computer.

16. The electronic device according to claim 13 , wherein the housing has a rectangular parallelepiped or substantially rectangular parallelepiped shape.

17. The electronic device according to claim 13 , further comprising a liquid crystal display attached to the housing.

18. The electronic device according to claim 13 , further comprising a heat-generating electric component mounted on the circuit board.

19. The electronic device according to claim 18 , wherein the heat-generating electric component is one of a CPU and a power amplifier.

20. The electronic device according to claim 13 , further comprising:

a heat-generating electric component; and

a controller that cools the housing and the heat-generating component by operating a fan based on a result of the detection by the temperature detecting device.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 19, 2017
From: MIURA, TADAMASA; MIYAGAWA, KAZUTO; NAITO, AKIHITO
To: MURATA MANUFACTURING CO., LTD.
Reel/Frame 041014/0718 →
Priority Claims (1)
JP 2014-155959 · Jul 31, 2014 · national
Continuity (2)
Continuation PCTJP2015066505 · Jun 8, 2015
Related Publication 20170131156A1 · May 11, 2017
Cited By (2)
US 12,494,607 US 12,691,293