IP Library Granted Patent US 10,506,743
Granted Patent B2
US 10,506,743 · App. 15/618,885 · Granted Dec 10, 2019

Systems and methods of automated open-loop thermal control

Inventors: Dominick Lovicott (Jarrell, TX); Hasnain Shabbir (Round Rock, TX)
Assignee: Dell Products, L.P.
H05K7/20727
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Quick Facts
Patent No.
US 10,506,743
App. No.
15/618,885
Filed
Jun 9, 2017
Granted
Dec 10, 2019
Kind
B2
Art Unit
2115
USPC
700/300
Abstract

Method, systems are provided for providing automated open-loop control of an airflow cooling system in an IHS (Information Handling System), where the open-loop control is automatically adjusted based on changes to the components installed by the IHS. An airflow impedance, providing an amount a component physically impedes airflow, is retrieved for a new component. An estimated airflow delivery to the installed location of the new component is determined and scaled based on the airflow impedance of the new component and based on the ability to bypass the new component with ventilated airflow. An airflow delivery target for the new component is determined based on the ambient air temperature available at the installed new component. The airflow delivery target is scaled based on the installed location of the new component. The airflow cooling system is operated to equalize the estimated airflow delivery to the new component with the airflow delivery target for new component.

Claims (36)

1. A system for providing airflow cooling in an IHS (Information Handling System), the system comprising:

one or more cooling fans configured to generate airflow that ventilates heated air from within the IHS, wherein the generated airflow provides cooling to one or more storage devices installed in the IHS by ventilating airflow around the storage devices;

a fan controller configured to operate the one or more cooling fans to provide cooling to a first storage device of the one or more storage devices, wherein the fan controller is further configured to:

retrieve an airflow impedance for the first storage device, wherein the airflow impedance indicates an ability to ventilate airflow around the first storage device;

determine an estimated airflow delivery by the one or more cooling fans to the first storage device, wherein the estimated airflow delivery for the first storage device is scaled based on the airflow impedance for the first storage device;

determine an airflow delivery target for the first storage device based on an ambient air temperature available at an installed location of the first storage device within the IHS; wherein the airflow delivery target for the first storage device is scaled based on the installed location of the first storage device within the IHS; and

operate the one or more cooling fans in order to equalize the estimated airflow delivery to the first storage device with the airflow delivery target for the first storage device.

2. The airflow cooling system of claim 1 , wherein the estimated airflow delivery for the first storage device is further scaled based on a measure of the ability to ventilate heated air by bypassing the heated air around the first storage device.

3. The airflow cooling system of claim 2 , wherein the measure of the ability to ventilate heated air by bypassing the first storage device is determined based on characteristics of a first drive bay of the IHS in which the first storage device is installed.

4. The airflow cooling system of claim 3 , wherein the measure of the ability to ventilate heated air by bypassing the first storage device is further determined based on characteristics of one or more drive bays of the IHS that are adjacent to the first drive bay.

5. The airflow cooling system of claim 1 , wherein the airflow delivery target for the first storage device is further scaled based on the ambient air temperature available at the installed location of the first storage device within the IHS.

6. The airflow cooling system of claim 3 , wherein the airflow impedance further indicates an ability to ventilate airflow around the first storage device and through the gaps between the first storage device and the first drive bay.

7. The airflow cooling system of claim 1 , wherein the scaling of the airflow delivery target for the first storage device is further based on a reliability parameter for the first storage drive and an accessibility of the installed location of the first storage device within the IHS.

8. A method for utilizing one or more cooling fans to provide airflow cooling to a component of an IHS (Information Handling System), the method comprising:

retrieving an airflow impedance for the component;

determining an estimated airflow delivery by the one or more cooling fans to the component, wherein the estimated airflow delivery for the component is scaled based on the airflow impedance for the component, wherein the airflow impedance indicates an ability to ventilate airflow around the first storage device;

determining an airflow delivery target for the component based on an ambient air temperature available at an installed location of the component within the IHS; wherein the airflow delivery target is scaled based on the installed location of the component within the IHS; and

operating the one or more cooling fans in order to equalize the estimated airflow delivery to the first component with the airflow delivery target for the component.

9. The method of claim 8 , wherein the estimated airflow delivery for the component is further scaled based on a measure of the ability to ventilate heated air from within the IHS by bypassing the heater air around the component.

10. The method of claim 9 , wherein the measure of the ability to ventilate heated air by bypassing the component is determined based on characteristics of the installed location of the component within the IHS.

11. The method of claim 10 , wherein the measure of the ability to ventilate heated air by bypassing the component is further determined based on characteristics of one or more components installed adjacent to the installed location of the component within the IHS.

12. The method of claim 8 , wherein the airflow impedance further indicates an ability to ventilate airflow around the first storage device and through the gaps between the first storage device and the installed location.

13. The method of claim 8 , wherein the available ambient temperature is determined based on the installed location of the component relative to an air inlet of the IHS.

14. The method of claim 8 , wherein the scaling of the airflow delivery target for the component is further based on a reliability parameter for the component and an accessibility of the installed location of the component within the IHS.

15. An IHS (Information Handling System) comprising:

one or more cooling fans configured to generate airflow that ventilates heated air from within the IHS, wherein the generated airflow provides cooling to one or more storage devices installed within the IHS by ventilating airflow around the storage devices;

a fan controller configured to operate the one or more cooling fans to provide cooling to a first storage device of the one or more storage devices, wherein the fan controller is further configured to:

retrieve an airflow impedance for the first storage device, wherein the airflow impedance indicates an ability to ventilate airflow around the first storage device;

determine an estimated airflow delivery by the one or more cooling fans to the first storage device, wherein the estimated airflow delivery for the first storage device is scaled based on the airflow impedance for the first storage device;

determine an airflow delivery target for the first storage device based on an ambient air temperature available at an installed location of the first storage device within the IHS; wherein the airflow delivery target for the first storage device is scaled based on the installed location of the first storage device within the IHS; and

operate the one or more cooling fans in order to equalize the estimated airflow delivery to the first storage device with the airflow delivery target for the first storage device.

16. The IHS of claim 15 , wherein the estimated airflow delivery for the first storage device is further scaled based on a measure of the ability to ventilate heated air by bypassing the heated air around the first storage device.

17. The IHS of claim 16 , wherein the measure of the ability to ventilate heated air by bypassing the first storage device is determined based on characteristics of a first drive bay of the IHS in which the first storage device is installed.

18. The IHS of claim 17 , wherein the measure of the ability to ventilate heated air by bypassing the first storage device is further determined based on characteristics of one or more drive bays of the IHS that are adjacent to the first drive bay.

19. The IHS of claim 17 , wherein the airflow impedance further indicates an ability to ventilate airflow around the first storage device and through the gaps between the first storage device and the first drive bay.

20. The IHS of claim 15 , wherein the scaling of the airflow delivery target for the first storage device is further based on a reliability parameter for the first storage device and on an accessibility of the installed location of the first storage device within the IHS.

Assignments (8)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (043775/0082) Recorded May 20, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
Reel/Frame 060958/0468 →
RELEASE OF SECURITY INTEREST AT REEL 043772 FRAME 0750 Recorded Nov 2, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
Reel/Frame 058298/0606 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
SECURITY AGREEMENT Recorded Mar 21, 2019
From: CREDANT TECHNOLOGIES, INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049452/0223 →
PATENT SECURITY AGREEMENT (CREDIT) Recorded Sep 6, 2017
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
Reel/Frame 043772/0750 →
PATENT SECURITY AGREEMENT (NOTES) Recorded Sep 6, 2017
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 043775/0082 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 9, 2017
From: LOVICOTT, DOMINICK; SHABBIR, HASNAIN
To: DELL PRODUCTS, L.P.
Reel/Frame 042663/0601 →
Continuity (1)
Related Publication 20180359882A1 · Dec 13, 2018