Anodized electroplated aluminum structures
Anodized electroplated aluminum structures and methods for making the same are disclosed. Cosmetic structures according to embodiments of the invention are provided by electroplating a non-cosmetic structure with aluminum and then anodizing the electroplated aluminum. This produces cosmetic structures that may possess desired structural and cosmetic properties and that may be suitable for use as housing or support members of electronic devices.
1. An electronic device, comprising:
a housing comprising:
a base structure having a first surface,
a qualification layer having a second surface, the qualification layer overlaying and bonded to the base structure at the first surface,
a first electroplated aluminum layer having a first grain structure and overlaying the qualification layer at a first portion of the second surface, and
a second electroplated aluminum layer having a second grain structure different than the first grain structure and overlaying the qualification layer at a second portion of the second surface.
2. The electronic device of claim 1 , wherein the first electroplated aluminum layer includes a first dopant associated with providing the first grain structure and the second electroplated aluminum layer includes a second dopant associated with providing the second grain structure, and the first dopant is different than the second dopant.
3. The electronic device of claim 1 , wherein the first grain structure is associated with a first grain size and the second grain structure is associated with a second grain size, and the first grain size is different than the second grain size.
4. The electronic device of claim 1 , wherein the qualification layer is without pores.
5. The electronic device of claim 1 , wherein the housing further comprises:
an aluminum oxide layer that overlays at least one of the first electroplated aluminum layer or the second electroplated aluminum layer.
6. The electronic device of claim 5 , wherein the aluminum oxide layer includes (i) a first aluminum oxide layer that overlays the first electroplated aluminum layer, and (ii) a second aluminum oxide layer that overlays the second electroplated aluminum layer.
7. The electronic device of claim 6 , wherein the first electroplated aluminum layer has a first thickness, and the second electroplated aluminum layer has a second thickness different than the first thickness.
8. The electronic device of claim 6 , wherein the first and second electroplated aluminum layers are separated by a boundary.
9. The electronic device of claim 1 , wherein the qualification layer comprises a copper sub-layer or a nickel sub-layer.
10. The electronic device of claim 5 , wherein the aluminum oxide layer is formed from at least one of the first or second electroplated aluminum layers.
11. The electronic device of claim 1 , wherein the base structure includes at least two or more of a metal, a polymer, a glass embedded plastic, a ceramic, nylon, or carbon fiber.
12. An electronic device, comprising:
a housing comprising a base and a coating that overlays the base, wherein the coating comprises:
a qualification layer,
a first electroplated aluminum layer disposed on a first surface portion of the qualification layer, the first electroplated aluminum layer characterized as having a first grain structure, and
a second electroplated aluminum layer adjacent to the first electroplated aluminum layer and disposed on a second surface portion of the qualification layer, the second electroplated aluminum layer characterized as having a second grain structure different than the first grain structure.
13. The electronic device of claim 12 , wherein the qualification layer includes a copper sub-layer or a nickel sub-layer.
14. The electronic device of claim 12 , wherein the first electroplated aluminum layer has a first thickness, and the second electroplated aluminum layer has a second thickness different than the first thickness.
15. The electronic device of claim 12 , wherein the first electroplated aluminum layer is doped with a first dopant and the second electroplated aluminum layer is doped with a second dopant different than the first dopant.
16. The electronic device of claim 12 , wherein the qualification layer is without pores.
17. A multi-layered coating disposed on a support structure of an electronic device, the multi-layered coating comprising:
a qualification layer having an external surface,
a first electroplated aluminum layer that is bonded to a first portion of the external surface and includes a first grain structure, and
a second electroplated aluminum layer that is bonded to a second portion of the external surface and adjacent to the first electroplated aluminum layer, wherein the second electroplated aluminum layer includes a second grain structure different than the first grain structure.
18. The multi-layered coating of claim 17 , further comprising:
an aluminum oxide layer that overlays at least one of the first electroplated aluminum layer or the second electroplated aluminum layer.
19. The multi-layered coating of claim 18 , wherein the aluminum oxide layer includes first and second aluminum oxide layers that are other than co-planar to each other.
20. The multi-layered coating of claim 17 , wherein the qualification layer includes a copper sub-layer.