IP Library › Granted Patent US 10,510,286
Granted Patent B2
US 10,510,286 · App. 15/128,438 · Granted Dec 17, 2019

Mounting substrate and electronic apparatus

Inventors: Akiyoshi Aoyagi (Kanagawa, JP); Ken Kikuchi (Tokyo, JP); Katsuhiro Tomoda (Kanagawa, JP)
Assignee: Sony Semiconductor Solutions Corporation
G09G3/32G09G3/2085G09G3/2088G09G2300/026G09G2300/0408G09G2300/0426G09G2310/0294G09G2310/08G09G2360/142H01L27/3293
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Quick Facts
Patent No.
US 10,510,286
App. No.
15/128,438
Granted
Dec 17, 2019
Kind
B2
Abstract

There is provided a mounting substrate that makes a seam more inconspicuous when a plurality of mounting substrates are tiled, and an electronic apparatus including the mounting substrate. The mounting substrate includes a wiring substrate, a plurality of pixels ( 11 ) arranged in a matrix in a pixel region of the wiring substrate, and a plurality of drivers ( 14 A) that are disposed in the pixel region and select the pixels in units of two or more pixels. Each of the pixels includes an optical element that emits or receives light, and a pixel circuit that controls light emission or light reception of the optical element. One or more of the plurality of drivers are assigned to each pixel row or every plurality of pixel rows.

Claims (37)

1. A mounting substrate comprising:

a wiring substrate;

a plurality of pixels arranged in a matrix in a pixel region of the wiring substrate; and

a plurality of drivers that are disposed between pixels of the plurality of pixels in the pixel region and select the plurality of pixels in units of two or more pixels,

wherein each of the pixels includes an optical element and a pixel circuit, wherein the optical element emits or receives light, and the pixel circuit controls light emission or light reception of the optical element,

wherein each of the plurality of drivers is assigned to two or more pixel rows, and

wherein the optical elements, the pixel circuits and the drivers are mounted directly on a same surface of a layer of the mounting substrate.

2. The mounting substrate according to claim 1 , wherein

the wiring substrate includes a plurality of selection lines extending along a row direction and a plurality of signal lines extending along a column direction,

each of the pixel circuits performs sampling of a data signal inputted through the signal line on the basis of a selection signal inputted through the selection line, and

each of the drivers outputs the selection signal to the selection lines on the basis of a shift signal and a clock signal to control a timing of sampling of the data signal in the pixel circuit and to output the shift signal to the following driver in synchronization with an output timing of the selection signal.

3. The mounting substrate according to claim 2 , wherein

the wiring substrate includes a plurality of electrode pads that are electrically coupled to the drivers and are exposed on a rear surface of the wiring substrate, one or more of the electrode pads being provided for each of the drivers, and

the clock signal is inputted through one or more of the electrode pads.

4. The mounting substrate according to claim 3 , wherein

one or more of the signal lines are assigned to each pixel column,

one of the selection lines is assigned to each pixel row, and

one of the drivers is assigned to each pixel row.

5. The mounting substrate according to claim 3 , wherein one or more of the signal lines are assigned to two or more pixel columns.

6. The mounting substrate according to claim 5 , wherein first selection lines are assigned to odd-numbered pixel columns and second selection lines are assigned to even-numbered columns.

7. The mounting substrate according to claim 5 , wherein each of the plurality of drivers is assigned to two or more columns.

8. An electronic apparatus comprising:

a plurality of mounting substrates; and

a control circuit that controls the plurality of mounting substrates,

each of the mounting substrates including:

a wiring substrate,

a plurality of pixels arranged in a matrix in a pixel region of the wiring substrate, and

a plurality of drivers that are disposed between pixels of the plurality of pixels in the pixel region and select the plurality of pixels in units of two or more pixels,

wherein each of the pixels includes an optical element and a pixel circuit, wherein the optical element emits or receives light, and the pixel circuit controls light emission or light reception of the optical element,

wherein each of the plurality of drivers is assigned to two or more pixel rows, and

wherein the optical elements, the pixel circuits and the drivers are mounted directly on a same surface of a layer of the mounting substrate.

9. The electronic apparatus according to claim 8 , further comprising:

a supporting substrate that supports the plurality of mounting substrates; and

a control substrate,

wherein the plurality of mounting substrates are tiled on the supporting substrate,

each of the wiring substrates includes a plurality of electrode pads that are electrically coupled to the drivers and are exposed on a rear surface of the wiring substrate, one or more of the electrode pads being provided for each of the drivers, and

one or both of the supporting substrate and the control substrate are electrically coupled to the wiring substrates through the electrode pads.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 11, 2017
From: SONY CORPORATION
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 043546/0060 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 5, 2016
From: AOYAGI, AKIYOSHI; KIKUCHI, KEN; TOMODA, KATSUHIRO
To: SONY CORPORATION
Reel/Frame 040232/0828 →
Priority Claims (1)
JP 2014-074842 · Mar 31, 2014 · national
Continuity (1)
Related Publication 20180218668A1 · Aug 2, 2018
Cited By (1)
US 12,626,641