IP Library Granted Patent US 10,512,154
Granted Patent B2
US 10,512,154 · App. 14/432,701 · Granted Dec 17, 2019

Grounding structure for circuit board

Inventors: Manabu Kinoshita (Shiga, JP); Nobuo Shirokawa (Shiga, JP); Haruo Suenaga (Shiga, JP); Hisashi Morikawa (Shiga, JP); Hideaki Moriya (Shiga, JP)
Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
H05K1/0215H01R4/34H01R2101/00H05K2201/1034H05K2201/10295H05K2201/10409
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Quick Facts
Patent No.
US 10,512,154
App. No.
14/432,701
Granted
Dec 17, 2019
Kind
B2
Abstract

Since a protruding portion preventing a rotation during screw fastening of a connection member is disposed to engage with a printed circuit board, and a protruded length of the protruding portion is smaller than a thickness of the printed circuit board, a configuration can be achieved such that the protruding portion does not interfere with an earth member, a bracket, etc., disposed on the back side of the printed circuit board, and the earth member and the bracket can freely be designed.

Claims (12)

1. A grounding structure for a circuit board comprising:

a circuit board having a reference potential terminal on a lower surface thereof and a plurality of through-holes therein;

a plate-shaped connection member on an upper surface of the circuit board and having a through-hole therein, the connection member electrically connected to the reference potential terminal of the circuit board;

an earth member below a lower surface of the circuit board; and

a screw engaging with the earth member and penetrating the through-holes in the connection member and the circuit board so as to fix the connection member and the circuit board to the earth member, the screw electrically connecting the connection member with the earth member,

the connection member having first and second protruding portions protruding toward the lower surface of the circuit board and engaging with the circuit board, the first protruding portion preventing rotation of the connection member due to rotation of the screw, and

wherein a protruded length of the first protruding portion is smaller than a thickness of the circuit board, and the first protruding portion is provided adjacent to an end surface of the circuit board, and

the connection member is directly connected to the reference potential terminal of the circuit board only by a solder connection to the second protruding portion.

2. The grounding structure according to claim 1 , wherein the through-hole of the connection member is an elongate hole having a width smaller than a diameter of the screw.

3. The grounding structure according to claim 1 , wherein a diameter of the through-hole of the circuit board is larger than a diameter of the screw.

4. The grounding structure according to claim 1 , wherein the first protruding portion and the second protruding portion are at respective outer end portions of the connecting member.

5. The grounding structure according to claim 1 , wherein the first protruding portion and the second protruding portion are at positions distantly spaced away from a region between a head of the screw and the connecting member.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 4, 2015
From: KINOSHITA, MANABU; SHIROKAWA, NOBUO; SUENAGA, HARUO; MORIKAWA, HISASHI; MORIYA, HIDEAKI
To: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Reel/Frame 035782/0115 →
Priority Claims (1)
JP 2012-220892 · Oct 3, 2012 · national
Continuity (1)
Related Publication 20150271910A1 · Sep 24, 2015
Cited By (1)
US 12,627,083