Test device, remote measurement module and test method

1. A test device for testing an electronic device under test, the test device comprising a remote measurement module and a processing unit implemented in circuitry, the processing unit comprising an analysis device, wherein:

the remote measurement module is configured to capture signals originating from the electronic device under test and output the captured signals directly to the analysis device, wherein the remote measurement module is positioned near the electronic device under test and electrically coupled to the electronic device under test,

the analysis device configured to receive the captured signals and to calibrate the test device based on test signals provided by the analysis device and the captured signals, wherein to calibrate the test device, the analysis device is configured to calculate corrected error parameters by comparing the test signals provided by the analysis device and the captured signals wherein the signals are treated separately in the analysis device, and

wherein the remote measurement device comprises a switch, the switch is configured to send a part of the test signal that is reflected at or in the electronic device under test to either the analysis device, to a resistor or to a power measurement device.

2. The test device according to claim 1 , wherein the remote measurement module comprises a directional element to separate reflected signals originating from the electronic device under test from signals provided to the electronic device under test by the analysis device.

3. The test device according to claim 2 , wherein the directional element comprises an octave coupler.

4. The test device according to claim 1 , wherein the analysis device comprises a signal measurement element and a bypass port to bypass a directional coupler in the analysis device and provide the captured signals directly to the signal measurement element.

5. The test device according to claim 1 , wherein the analysis device is configured to calculate S-parameters for the electronic device under test by comparing the test signals provided by the analysis device and the captured signals.

6. The test device according to claim 1 , wherein the remote measurement module comprises a power detector configured to measure the power levels of the signals originating from the electronic device under test and/or the test signals provided by the analysis device.

7. The test device according to claim 6 , wherein the analysis device is configured to monitor the test device based on the measured power levels of the signals originating from the electronic device under test and the test signals provided by the analysis device.

8. A remote measurement module for testing an electronic device under test, the remote measurement module comprising a signal capturing unit and a signal output port and a switch, wherein:

the signal capturing unit is configured capture signals originating from the electronic device under test, wherein the signal capturing unit comprises a directional element to separate reflected signals originating from the electronic device under test from signals provided to the electronic device under test by the analysis device,

the signal output port is configured to output the captured signals directly to the analysis device,

the remote measurement module is positioned near the electronic device under test and is electrically coupled to the electronic device under test, and

the switch is configured to send a part of the test signal that is reflected at or in the electronic device under test to either the analysis device, to a resistor or to a power measurement device.

9. The remote measurement module to claim 8 , wherein the directional element comprises an octave coupler.

10. The remote measurement module according to claim 8 , comprising a power detector configured to measure the power of the signals originating from the electronic device under test and/or the test signals provided by the analysis device.

11. A test method for testing an electronic device under test with a test device, the test method comprising:

remotely capturing, by a remote measurement module, signals originating from the electronic device under test, wherein remotely capturing is performed near the electronic device under test,

outputting, by the remote measurement module, the captured signals directly to an analysis device,

sending a part of the test signal that is reflected at or in the electronic device under test to either the analysis device, to a resistor or to a power measurement device of the remote measurement module, and

calibrating, by the analysis device, the test device based on provided test signals and the captured signals,

wherein calibrating comprises calculating corrected error parameters by comparing the test signals provided to the electronic device under test and the captured signals, wherein the signals are treated separately in the analyzing device.

12. The test method according to claim 11 , wherein remotely capturing comprises separating reflected signals originating from the electronic device under test from the test signals provided to the electronic device under test.

13. The test method according to claim 12 , wherein separating reflected signals is performed with an octave coupler.

14. The test method according to claim 11 , wherein calibrating comprises calculating corrected error parameters by comparing the test signals provided to the electronic device under test and the captured signals and/or by comparing the test signals provided to the electronic device under test and reference calibration variables.

15. The test method according to claim 11 , further comprising calculating S-parameters for the electronic device under test by comparing the test signals provided to the electronic device under test and the captured signals.

16. The test method according to claim 11 , further comprising remotely measuring the power levels of the signals originating from the electronic device under test and/or the test signals provided to the electronic device under test.

17. The test method according to claim 16 , further comprising monitoring the test device based on the measured power levels of the signals originating from the electronic device under test and the test signals provided to the electronic device under test.