IP Library Granted Patent US 10,516,007
Granted Patent B2
US 10,516,007 · App. 16/036,360 · Granted Dec 24, 2019

Display device and method for manufacturing display device

Inventors: Shunpei Yamazaki (Tokyo, JP); Yoshiharu Hirakata (Kanagawa, JP); Kensuke Yoshizumi (Kanagawa, JP)
Assignee: Semiconductor Energy Laboratory Co., Ltd.
H01L27/323G02F1/13338G06F3/044G06F3/0412H01L21/6835H01L21/82H01L27/1218H01L27/15H01L27/322H01L27/3227H01L27/3244H01L29/7869H01L51/003H01L51/5246G02F1/1368G02F2001/13606G02F2001/133325G02F2202/28G06F2203/04103H01L27/1225H01L2221/68363H01L2221/68386H01L2251/5338H01L2251/558
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Quick Facts
Patent No.
US 10,516,007
App. No.
16/036,360
Granted
Dec 24, 2019
Kind
B2
Abstract

The thickness of a display device including a touch sensor is reduced. Alternatively, the thickness of a display device having high display quality is reduced. Alternatively, a method for manufacturing a display device with high mass productivity is provided. Alternatively, a display device having high reliability is provided. Stacked substrates in each of which a sufficiently thin substrate and a relatively thick support substrate are stacked are used as substrates. One surface of the thin substrate of one of the stacked substrates is provided with a layer including a touch sensor, and one surface of the thin substrate of the other stacked substrate is provided with a layer including a display element. After the two stacked substrates are attached to each other so that the touch sensor and the display element face each other, the support substrate and the thin substrate of each stacked substrate are separated from each other.

Claims (33)

1. A method for manufacturing a display device, comprising the steps of:

attaching a first substrate fixed to a first support substrate and provided with an element layer including a light-emitting element over a surface not facing the first support substrate and a third substrate fixed to a third support substrate and provided with a color filter layer over a surface not facing the third support substrate to each other with a first adhesive layer so that the element layer and the color filter layer face each other, and then separating the third substrate and the third support substrate from each other; and

attaching the third substrate and a second substrate fixed to a second support substrate and provided with a sensor layer over a surface not facing the second support substrate to each other with a second adhesive layer so that the element layer and the sensor layer face each other, and then separating the second substrate and the second support substrate from each other and separating the first substrate and the first support substrate from each other,

wherein a glass substrate having a thickness of 10 μm to 200 μm is used as each of the first to third substrates, and

wherein a base substrate thicker than the glass substrate is used as each of the first to third support substrates.

2. The method for manufacturing a display device according to claim 1 ,

wherein the glass substrate is fixed to the base substrate by being in close contact with each other, and

wherein an attachment surface of each of the glass substrate and the base substrate has a surface roughness of 2 nm or less.

3. The method for manufacturing a display device according to claim 1 ,

wherein the base substrate is provided with a resin containing an organic compound or a silicon compound, and

wherein the glass substrate is fixed to the base substrate by close contact between the resin and the glass substrate.

4. A method for manufacturing a display device, comprising the steps of:

attaching a first substrate fixed to a first support substrate and provided with an element layer including a light-emitting element over a surface not facing the first support substrate and a third substrate fixed to a third support substrate and provided with a color filter layer over a surface not facing the third support substrate to each other with a first adhesive layer so that the element layer and the color filter layer face each other, and then separating the first substrate and the first support substrate from each other; and

attaching the first substrate and a second substrate fixed to a second support substrate and provided with a sensor layer over a surface not facing the second support substrate to each other with a second adhesive layer so that the color filter layer and the sensor layer face each other, and then separating the second substrate and the second support substrate from each other and separating the third substrate and the third support substrate from each other,

wherein a glass substrate having a thickness of 10 μm to 200 μm is used as each of the first to third substrates, and

wherein a base substrate thicker than the glass substrate is used as each of the first to third support substrates.

5. The method for manufacturing a display device according to claim 4 ,

wherein the glass substrate is fixed to the base substrate by being in close contact with each other, and

wherein an attachment surface of each of the glass substrate and the base substrate has a surface roughness of 2 nm or less.

6. The method for manufacturing a display device according to claim 4 ,

wherein the base substrate is provided with a resin containing an organic compound or a silicon compound, and

wherein the glass substrate is fixed to the base substrate by close contact between the resin and the glass substrate.

7. A method for manufacturing a display device, comprising the steps of:

attaching a first substrate fixed to a first support substrate and provided with an element layer including a light-emitting element over a surface not facing the first support substrate and a second substrate fixed to a second support substrate and provided with a stack of a sensor layer and a color filter layer over a surface not facing the second support substrate to each other with an adhesive layer so that the element layer and the color filter layer face each other; and

separating the first substrate and the first support substrate from each other and separating the second substrate and the second support substrate from each other after attaching the first substrate and the second substrate to each other,

wherein a glass substrate having a thickness of 10 μm to 200 μm is used as each of the first and second substrates, and

wherein a base substrate thicker than the glass substrate is used as each of the first and second support substrates.

8. The method for manufacturing a display device according to claim 7 ,

wherein the glass substrate is fixed to the base substrate by being in close contact with each other, and

wherein an attachment surface of each of the glass substrate and the base substrate has a surface roughness of 2 nm or less.

9. The method for manufacturing a display device according to claim 7 ,

wherein the base substrate is provided with a resin containing an organic compound or a silicon compound, and

wherein the glass substrate is fixed to the base substrate by close contact between the resin and the glass substrate.

Priority Claims (1)
JP 2012-156357 · Jul 12, 2012 · national
Continuity (4)
Continuation 15222563 · Jul 28, 2016
Continuation 14794197 · Jul 8, 2015
Continuation 13938532 · Jul 10, 2013
Related Publication 20180342561A1 · Nov 29, 2018
Cited By (2)
US 12,271,233 US 12,677,518