System and method for forced air cooling of electrical device
View Patent ↗An invention relates to a field of electrical engineering, in particular to various cabinet-type electronic devices of a general purpose with an equipment airflow cooling, conducted by virtue of a forced ventilation, and can be used in construction of various electrical devices, particularly of electric motor control stations. A claimed invention essence lies in a fact that the forced air cooling system of the power and low-current components of the electrical device contains an air heat exchanger, the power electronic components, as well as coolers, being in a thermal contact with the low-current electronic components, configured to be cooled with the single flow of previously cleaned extraneous air directed from a top of the enclosure to its bottom part. The coolers are spaced along a length of an air channel of the electronic device, forming a mixing zone of heated and cool air.
1. A system of a forced air cooling of power components and low-current components of an electrical device, comprising:
a single enclosure comprising:
a first independent cooling circuit,
a second independent cooling circuit placed adjacent to the first independent cooling circuit,
the first independent circuit being positioned in a sealed compartment, the sealed compartment being protected from contact with any outside element,
the first independent cooling circuits comprising a first air channel and at least one heat exchanger,
the second independent cooling circuit comprising a second air channel, the power electronic components, and at least two coolers arranged within the second air channel in a direction of airflow,
wherein the at least two coolers are in thermal contact with the low-current electronic components, the low-current electronic components being located in the first independent cooling circuit,
wherein the two independent cooling circuits are configured to be cooled with a single flow of previously cleaned extraneous air directed from a top of the single enclosure to a bottom part of the single enclosure,
wherein the second air channel and the at least two coolers form a mixing zone of heated air and cool air,
wherein a bypass air channel, supplying cool air into the mixing zone, is placed above at least one of the at least two coolers,
wherein the power electronic components comprise at least one inductance coil with a closed core, said inductance coil comprising a solenoid which is cooled by the airflow, said airflow being concentrated in the air channels, said air channels being formed between polymer casings and coils of the solenoid.
2. The system of claim 1 , wherein the bypass air channel is arranged within the second air channel and is configured to control the airflow by a partial closing of an inlet opening with a regulating gate.
3. The system of claim 1 , wherein the mixing zone is arranged within a space located between the at least two coolers, said space further comprising a part of each cooler's internal volume.
4. The system of claim 1 , further comprising:
at least one thermoelectric device for moisture removal from the single enclosure,
wherein the at least one thermoelectric device comprises cooled and heated surfaces, wherein the heated surface is in thermal contact with one of the at least two coolers.
5. A method for forced air cooling of power electronic components and low-current electronic components of an electronic device, comprising:
providing a single enclosure comprising:
a first independent cooling circuit,
a second independent cooling circuit placed adjacent to the first independent cooling circuit,
positioning the first independent circuit in a sealed compartment, the sealed compartment being protected from contact with any outside element,
wherein the first independent cooling circuit comprises a first air channel and at least one heat exchanger,
wherein the second independent cooling circuit comprises a second air channel, the power electronic components, and at least two coolers arranged within the second air channel in a direction of airflow,
positioning the coolers in thermal contact with the low-current electronic components, the low-current electronic components being located in the first independent cooling circuit, the power electronic components comprising at least one inductance coil with a closed core, said inductance coil comprising a solenoid which is cooled by the airflow, the airflow being concentrated in the air channels, the air channels being formed between polymer casings and coils of the solenoid,
configuring the two independent cooling circuits to be cooled with a single flow of previously cleaned extraneous air directed from a top part of the single enclosure to a bottom part of the single enclosure,
forming a mixing zone of heated and cool air between the at least two coolers within the second air channel, and
providing a bypass air channel, the bypass channel supplying cool air into the mixing zone, the bypass channel being placed above at least one of the at least two coolers.
6. The method of claim 5 , further comprising providing at least one thermoelectric device, the thermoelectric device removing moisture from the single enclosure.
7. The method of claim 6 , wherein the at least one thermoelectric device comprises heated and cooled surfaces, wherein the heated surface is placed in thermal contact with the one of the at least two coolers.