Optimizing cooling energy

1. A system comprising:

a reconfigurable computing system, comprising:

a first pool of collocated high heat density computing components;

a second pool of collocated low heat density computing components, of a different type than said first pool of collocated high heat density computing components, and spaced apart from said first pool of collocated high heat density computing components; and

a reconfigurable switching fabric electrically interconnecting said first pool of collocated high heat density computing components and said second pool of collocated low heat density computing components;

a first cooling structure in thermal communication with said first pool of collocated high heat density computing components;

a second cooling structure in thermal communication with said second pool of collocated low heat density computing components;

a first heat rejection unit in thermal communication with said first cooling structure and at least one heat sink for moving heat from said first cooling structure to said at least one heat sink, and selectively thermally connectable with said second cooling structure for moving heat from said second cooling structure to said at least one heat sink, wherein said first heat rejection unit is in thermal communication with said first cooling structure via a first heat exchanger with a first pump driving fluid from said first cooling structure through a hot side of said first heat exchanger and with a second pump driving fluid from said first heat rejection unit through a cool side of said first heat exchanger;

a second heat rejection unit in thermal communication with said second cooling structure and said at least one heat sink for moving heat from said second cooling structure to said at least one heat sink, and selectively thermally connectable with said first cooling structure for moving heat from said first cooling structure to said at least one heat sink, wherein said second heat rejection unit is in thermal communication with said second cooling structure via a second heat exchanger with a third pump driving fluid from said second cooling structure through a hot side of said second heat exchanger and with a fourth pump driving fluid from said second heat rejection unit through a cool side of said second heat exchanger; and

a controller coupled to said reconfigurable computing system, said first and second cooling structures, and said first and second heat rejection units, wherein said controller is configured to:

obtain a specification of a computing workload;

electrically configure at least a portion of said first pool of collocated high heat density computing components and at least a portion of said second pool of collocated low heat density computing components to handle said computing workload, by reconfiguring said switching fabric;

select operating parameters for said first and second cooling structures and said first and second heat rejection units to handle said computing workload; and

selectively cease/activate said selective thermal connection of said first cooling structure to said second heat rejection unit independent of said thermal communication between said first cooling structure and said first heat rejection unit, and selectively cease/activate said selective thermal connection of said second cooling structure to said first heat rejection unit independent of said thermal communication between said second cooling structure and said second heat rejection unit.

2. The system of claim 1 , wherein:

said controller electrically configures said at least a portion of said first pool of collocated high heat density computing components and said at least a portion of said second pool of collocated low heat density computing components by activating additional resources from at least one of said first pool of collocated high heat density computing components and said second pool of collocated low heat density computing components; and

said controller selects said operating parameters for said first and second cooling structures to provide cooling to said additional resources, prior to said activating of said additional resources.

3. The system of claim 1 , wherein:

said controller electrically configures said at least a portion of said first pool of collocated high heat density computing components and said at least a portion of said second pool of collocated low heat density computing components by deactivating excess resources from at least one of said first pool of collocated high heat density computing components and said second pool of collocated low heat density computing components; and

said controller selects said operating parameters for said first and second cooling structures by removing cooling from said excess resources, after said deactivating of said excess resources.

4. The system of claim 1 , wherein said controller is further configured to:

sense temperature of said at least one heat sink; and

responsive to an abnormally low temperature of said at least one heat sink, reduce cooling to at least one of said first and second cooling structures.

5. The system of claim 4 , wherein:

said controller is configured to reduce cooling to said at least one of said first and second cooling structures by at least one of:

ceasing said selective thermal connection between said first cooling structure and said second heat rejection unit, if said first cooling structure is to receive said reduced cooling; and

ceasing said selective thermal connection between said second cooling structure and said first heat rejection unit, if said second cooling structure is to receive said reduced cooling.

6. The system of claim 4 , wherein said controller is further configured to cause increased power dissipation to at least one of said first and second cooling structures, if said reduced cooling is insufficient to prevent at least one of condensation and freezing.

7. The system of claim 1 , wherein said controller is further configured to:

sense temperature of said at least one heat sink; and

responsive to an abnormally high temperature of said at least one heat sink, increase cooling to at least one of said first and second cooling structures.

8. The system of claim 7 , wherein:

said controller is configured to increase cooling to said at least one of said first and second cooling structures by at least one of:

activating said selective thermal connection between said first cooling structure and said second heat rejection unit, if said first cooling structure is to receive said increased cooling; and

activating said selective thermal connection between said second cooling structure and said first heat rejection unit, if said second cooling structure is to receive said increased cooling.

9. A non-transitory computer readable medium comprising computer executable instructions which when executed by a computer cause the computer to perform a method of thermally controlling a reconfigurable computing system having a first pool of collocated high heat density computing components, a second pool of collocated low heat density computing components, of a different type than said first pool of collocated high heat density computing components, and spaced apart from said first pool of collocated high heat density computing components, and a reconfigurable switching fabric electrically interconnecting said first pool of collocated high heat density computing components and said second pool of collocated low heat density computing components, said method comprising the steps of:

obtaining a specification of a computing workload;

electrically configuring at least a portion of said first pool of collocated high heat density computing components and at least a portion of said second pool of collocated low heat density computing components to handle said computing workload, by reconfiguring said switching fabric;

selecting operating parameters for

a first cooling structure in thermal communication with said first pool of collocated high heat density computing components;

a second cooling structure in thermal communication with said second pool of collocated low heat density computing components;

a first heat rejection unit in thermal communication with said first cooling structure and selectively thermally connectable with said second cooling structure, wherein said first heat rejection unit is in thermal communication with said first cooling structure via a first heat exchanger with a first pump driving fluid from said first cooling structure through a hot side of said first heat exchanger and with a second pump driving fluid from said first heat rejection unit through a cool side of said first heat exchanger;

a second heat rejection unit in thermal communication with said second cooling structure and selectively thermally connectable with said first cooling structure, wherein said second heat rejection unit is in thermal communication with said second cooling structure via a second heat exchanger with a third pump driving fluid from said second cooling structure through a hot side of said second heat exchanger and with a fourth pump driving fluid from said second heat rejection unit through a cool side of said second heat exchanger; and

at least one heat sink in thermal communication with said first and second heat rejection units; and

selectively ceasing/activating said selective thermal connection of said first cooling structure to said second heat rejection unit and/or selectively ceasing/activating said selective thermal connection of said second cooling structure to said first heat rejection unit, independent of said thermal communication of said first cooling structure with said first heat rejection unit and independent of said thermal communication of said second cooling structure with said second heat rejection unit;

to handle said computing workload.