Backside coupling with superconducting partial TSV for transmon qubits
A capacitive coupling device (superconducting C-coupler) includes a trench formed through a substrate, from a backside of the substrate, reaching a depth in the substrate, substantially orthogonal to a plane of fabrication on a frontside of the substrate, the depth being less than a thickness of the substrate. A superconducting material is deposited as a continuous conducting via layer in the trench with a space between surfaces of the via layer in the trench remaining accessible from the backside. A superconducting pad is formed on the frontside, the superconducting pad coupling with a quantum logic circuit element fabricated on the frontside. An extension of the via layer is formed on the backside. The extension couples to a quantum readout circuit element fabricated on the backside.
1. A method, when executed by a superconductor fabrication system, causing operations comprising:
forming, in a capacitive coupling device (superconducting C-coupler), a trench through a substrate, from a backside of the substrate, reaching a depth in the substrate, substantially orthogonal to a plane of fabrication on a frontside of the substrate, the depth being less than a thickness of the substrate;
depositing a superconducting material as a via layer in the trench with a space between surfaces of the via layer in the trench remaining accessible from the backside;
forming a superconducting pad on the frontside, the superconducting pad coupling with a quantum logic circuit element fabricated on the frontside; and
forming an extension of the via layer on the backside, wherein the extension couples to a quantum readout circuit element fabricated on the backside.
2. The method of claim 1 , further comprising:
filling a dielectric material, from the backside, in the space between the surfaces of the via layer.
3. The method of claim 2 , wherein the dielectric material is Silicon oxide (SiO 2 ).
4. The method of claim 2 ,
wherein the dielectric material is etched such that the dielectric material is removed and the space is occupied by air.
5. The method of claim 1 , further comprising:
depositing a layer of a second superconducting material on the frontside; and
masking and etching the layer of the second superconducting material to form the superconducting pad on the frontside.
6. The method of claim 5 , further comprising:
depositing the layer of the second superconducting material prior to forming the trench; and
protecting, using a sacrificial layer, the layer of the second superconducting material.
7. The method of claim 1 , further comprising:
electrically coupling the extension of the via layer with the quantum readout circuit element.
8. The method of claim 1 , further comprising:
directly electrically coupling the extension of the via layer with the quantum readout circuit element.
9. The method of claim 1 , further comprising:
electrically coupling the extension of the via layer to a second superconducting pad on the backside, wherein the second superconducting pad couples with the quantum readout circuit element.
10. The method of claim 1 , wherein the quantum readout circuit element comprises a ground-plane of a circuit, and wherein the C-coupler additionally functions as a grounding shield for other C-couplers coupling with the circuit.