Support structure including conductive paths and electronic device having the same
An electronic device is provided. The electronic device includes a housing comprising a first plate, a second plate apart from the first plate while facing the first plate, and a side member which surrounds a space between the first plate and the second plate, a touchscreen display exposed through the first plate, a printed circuit board (PCB) disposed between the touchscreen display and the second plate, a mid-plate disposed between the touchscreen display and the PCB, and extending from the side member, and at least one integrated circuit (IC) mounted on the PCB and relating to power, wherein the mid-plate can include at least one conductive path formed on a surface facing the PCB and electrically connected to the at least one IC, and the at least one conductive path can be formed with the same metallic material as the mid-plate.
1. An electronic device comprising:
a housing comprising a first plate, a second plate apart from the first plate and facing the first plate, and a side member which surrounds a space between the first plate and the second plate;
a touchscreen display exposed through the first plate;
a printed circuit board (PCB) disposed between the touchscreen display and the second plate;
a mid-plate disposed between the touchscreen display and the PCB, and extending from the side member, wherein the mid-plate includes a conductive area made of a metallic material and a nonconductive area;
at least one power related component disposed between the second plate and the mid-plate;
at least one integrated circuit (IC) mounted on the PCB and relating to power; and
at least one conductive path formed on the mid-plate,
wherein the non-conductive area electrically isolates the at least one conductive path from the conductive area,
wherein the at least one conductive path electrically connects the at least one power related component and the at least one IC,
wherein the at least one IC includes a power management integrated circuit (PMIC) or a charge IC,
wherein the at least one power related component comprises a battery, or a connector which is mounted on the PCB and electrically connected with an external power device,
wherein the at least one conductive path is electrically connected to the at least one IC through the flexible conductive member, and
wherein the flexible conductive member is in contact with the battery or with an extending portion of the battery.
2. The electronic device of claim 1 , further comprising:
a flexible conductive member disposed between part of the at least one conductive path and the PCB.
3. The electronic device of claim 2 , wherein the flexible conductive member comprises at least one of a C clip, a pogo pin, a spring, conductive poron and rubber, a conductive tape, or a copper connector.
4. The electronic device of claim 2 ,
wherein the PCB further comprises a contact electrically connected to the at least one IC, and
wherein the flexible conductive member is disposed between part of the at least one conductive path and the contact.
5. The electronic device of claim 4 , wherein the contact is disposed within 10 mm from the at least one IC.
6. The electronic device of claim 1 , further comprising:
a flexible conductive member disposed between part of the at least one conductive path and the PCB,
wherein the at least one power related component is electrically connected to the at least one conductive path through the flexible conductive member.
7. The electronic device of claim 6 ,
wherein the PCB further comprises a contact electrically connected to the at least one power related component, and
wherein the flexible conductive member is disposed between part of the at least one conductive path and the contact.
8. The electronic device of claim 1 , wherein the PCB comprises a first PCB for mounting the at least one IC, and a second PCB for mounting the at least one power related component.
9. The electronic device of claim 1 , wherein the metallic material comprises at least one of copper, aluminum, tungsten, zinc, nickel, or magnesium.
10. The electronic device of claim 1 , further comprising:
an electrical shielding member disposed between the at least one conductive path and the PCB and covering at least part of the at least one conductive path.
11. The electronic device of claim 1 , wherein the side member is attached to the second plate or integrally formed with the second plate.
12. An electronic device comprising:
a first cover forming a first surface which faces a first direction;
a second cover forming a second surface which faces a second direction opposite to the first direction;
a support structure comprising a bezel surrounding a space between the first cover and the second cover, and a mid-plate extending from the bezel to the space, wherein the mid-plate includes a conductive area and a nonconductive area;
a first component and a second component disposed between the support structure and the second cover;
at least one conductive path formed on the mid-plate and including a first contact, a second contact, and a line which electrically connects the first contact and the second contact; and
a flexible conductive member for electrically connecting the first contact and the first component, or the second contact and the second component,
wherein the non-conductive area electrically isolates the at least one conductive path from the conductive area,
wherein the at least one conductive path electrically connects the first component and the second component,
wherein the first component includes a power management integrated circuit (PMIC) or a charge IC, and
wherein the second component includes a battery, or a connector which is mounted on the PCB and electrically connected with an external power device.
13. The electronic device of claim 12 ,
wherein the first contact is electrically connected to the first component, and wherein the second contact is electrically connected to the second component.