Substrate holding apparatus and substrate processing apparatus
A substrate holding apparatus that holds a substrate is provided. The apparatus comprises a rotary shaft which rotates about a vertical axis and includes a suction path leading from an upper end of the rotary shaft, and a holding unit which includes a suction hole formed in a rotation center, is fixed at the upper end of the rotary shaft such that the suction hole communicates with the suction path, and holds the substrate by sucking the substrate, wherein a plurality of vent holes for introducing an external gas into a space between the holding unit and the substrate are formed at positions rotationally symmetric with respect to the rotation center of the holding unit with an angle to face a back surface of the substrate placed on the holding unit.
1. A substrate holding apparatus that holds a substrate, comprising:
a rotary shaft which rotates about a vertical axis and includes a suction path leading from an upper end of the rotary shaft; and
a holding unit which includes a suction hole formed in a rotation center, is fixed at the upper end of the rotary shaft such that the suction hole communicates with the suction path, and holds the substrate by sucking the substrate,
wherein a plurality of vent holes for introducing an external gas into a space between the holding unit and the substrate are formed with an angle to face a back surface of the substrate placed on the holding unit, and
wherein a size of each of the plurality of vent holes is smaller than a size of the suction hole.
2. The apparatus according to claim 1 , wherein the holding unit comprises:
a bottom wall portion in which the suction hole is formed and connected to the upper end of the rotary shaft;
an outer peripheral wall portion which arises from an edge of the bottom wall portion and supports the substrate; and
a plurality of support pins which protrude from the bottom wall portion and support the substrate.
3. The apparatus according to claim 2 , wherein the plurality of vent holes are formed in the vicinity of the edge of the bottom wall portion.
4. The apparatus according to claim 1 , further comprising an opening/closing valve which opens and closes a gas flow path between the suction path and a vacuum source for sucking a gas,
wherein the apparatus holds the substrate by setting the opening/closing valve in an open state to suck a gas in the space by the vacuum source and introducing the external gas into the space from the plurality of vent holes, and releases a held state of the substrate by setting the opening/closing valve in a closed state and introducing the external gas into the space from the plurality of vent holes.
5. The apparatus according to claim 1 , further comprising:
a control valve which is provided in a gas flow path between the suction path and a vacuum source for sucking a gas, and is capable of switching between a suction state, in which suction by the vacuum source is performed, and an atmospheric air open state; and
a check valve which is provided in the suction path and prevents inflow of a gas into the space,
wherein the apparatus holds the substrate by setting the control valve in the suction state to suck a gas in the space by the vacuum source and introducing the external gas into the space from the plurality of vent holes, and releases a held state of the substrate by setting the control valve in the atmospheric air open state to make a portion from the vacuum source to the check valve open to atmospheric air and introducing the external gas into the space from the plurality of vent holes.
6. The apparatus according to claim 1 , wherein a conductance of the plurality of vent holes is not more than 10% of a conductance of the suction hole.
7. The apparatus according to claim 1 , wherein the substrate holding apparatus comprises an apparatus which obtains an eccentric component of rotation of the substrate by rotating the substrate by the rotary shaft.
8. A substrate processing apparatus that processes a substrate, comprising a substrate holding apparatus that holds the substrate, wherein the substrate holding apparatus comprises:
a rotary shaft which rotates about a vertical axis and includes a suction path leading from an upper end of the rotary shaft; and
a holding unit which includes a suction hole formed in a rotation center, is fixed at the upper end of the rotary shaft such that the suction hole communicates with the suction path, and holds the substrate by sucking the substrate,
wherein a plurality of vent holes for introducing an external gas into a space between the holding unit and the substrate are formed with an angle to face a back surface of the substrate placed on the holding unit, and
wherein a size of each of the plurality of vent holes is smaller than a size of the suction hole.
9. The apparatus according to claim 1 , wherein the plurality of vent holes are formed at positions rotationally symmetric with respect to the rotation center of the holding unit.