Dynamic random access memory structure and method for preparing the same
The present disclosure provides a DRAM cell structure. The DRAM cell structure includes a substrate, a gate structure disposed in the substrate, a first source/drain region and a second source/drain region disposed in the substrate respectively at two sides of the gate structure, a landing pad disposed over the second source/drain region, a plurality of conductive pillars disposed on the landing pad, a conductive layer disposed over the plurality of conductive pillars, and a dielectric layer disposed between the conductive layer and the plurality of conductive pillars. The plurality of conductive pillars have at least a first width and a second width, and the first width and the second width are different from each other.
1. A method for preparing a DRAM cell structure, comprising:
providing a substrate comprising at least an active region, at least a gate structure disposed in the active region, and a first source/drain region and a second source/drain region disposed in the active region at two sides of the gate structure;
forming a first conductive layer over the substrate;
removing portions of the first conductive layer to form a landing pad before forming a second conductive layer;
forming the second conductive layer and a hard mask layer on the first conductive layer, sequentially;
forming a hemispherical-grained (HSG) layer on the hard mask layer;
patterning the hard mask layer through the HSG layer to form a hard mask pattern on the second conductive layer;
etching the second conductive layer through the hard mask pattern to form a plurality of conductive pillars over the substrate.
2. The method of claim 1 , further comprising removing portions of the HSG layer before the patterning of the hard mask layer.
3. The method of claim 1 , wherein the plurality of conductive pillars have at least a first width and a second width, and the first width and the second width are different from each other.
4. The method of claim 1 , wherein the plurality of conductive pillars are separated from each other by at least a first spacing distance and a second spacing distance, and the first spacing distance and the second spacing distance are different from each other.
5. The method of claim 1 , wherein the plurality of conductive pillars have at least a first shape and a second shape, and the first shape and the second shape are different from each other.
6. The method of claim 1 , further comprising:
forming a dielectric structure over the substrate; and
forming a contact plug in the dielectric structure,
wherein the contact plug electrically connects the second source/drain region and the first conductive layer.
7. A method for preparing a DRAM cell structure, comprising:
providing a substrate comprising at least an active region, at least a gate structure disposed in the active region, and a first source/drain region and a second source/drain region disposed in the active region at two sides of the gate structure;
forming a first conductive layer over the substrate;
forming a second conductive layer and a hard mask layer on the first conductive layer, sequentially;
forming a hemispherical-grained (HSG) layer on the hard mask layer;
patterning the hard mask layer through the HSG layer to form a hard mask pattern on the second conductive layer;
etching the second conductive layer through the hard mask pattern to form a plurality of conductive pillars over the substrate;
removing several of the plurality of conductive pillars; and
removing portions of the first conductive layer to form a landing pad simultaneously with the removing of the several of the plurality of conductive pillars.
8. A method for preparing a DRAM cell structure, comprising:
providing a substrate comprising at least an active region, at least a gate structure disposed in the active region, and a first source/drain region and a second source/drain region disposed in the active region at two sides of the gate structure;
forming a first conductive layer over the substrate;
forming a second conductive layer and a hard mask layer on the first conductive layer, sequentially;
forming a hemispherical-grained (HSG) layer on the hard mask layer;
patterning the hard mask layer through the HSG layer to form a hard mask pattern on the second conductive layer;
etching the second conductive layer through the hard mask pattern to form a plurality of conductive pillars over the substrate; and
forming a dielectric layer over the plurality of conductive pillars,
wherein sidewalls of the plurality of conductive pillars are in contact with the dielectric layer, and top surfaces of the plurality of conductive pillars are separated from the dielectric layer by the hard mask pattern.
9. The method of claim 8 , further comprising removing the hard mask pattern before the forming of the dielectric layer.
10. The method of claim 9 , wherein top surfaces and sidewalls of the plurality of conductive pillars are in contact with the dielectric layer.
11. The method of claim 8 , further comprising forming a third conductive layer on the dielectric layer.