Method for manufacturing conductive pillar structure for semiconductor substrate and conductive pillar structure for semiconductor substrate
A method for manufacturing a semiconductor structure includes the following operations. A base and a dielectric layer arranged on the base are provided. A first conductive pillar, a second conductive pillar and a third conductive pillar arranged in the dielectric layer are formed. A mask layer is formed. A portion of a thickness of the third conductive pillar is etched by using the third mask layer as a mask to form a third lower conductive pillar and a third upper conductive pillar stacked on one another, in which the third upper conductive pillar, the third lower conductive pillar and the dielectric layer are configured to form at least one groove. A cover layer filling the at least one groove is formed, in which the cover layer exposes the top surface of the third upper conductive pillar.
1 . A method for manufacturing a semiconductor structure having an array area, a peripheral area and a core area, the method for manufacturing the semiconductor structure comprising:
providing a base and a dielectric layer arranged on the base;
forming a first conductive pillar, a second conductive pillar and a third conductive pillar arranged in the dielectric layer, wherein the first conductive pillar is arranged in the array area, the second conductive pillar is arranged in the peripheral area, and the third conductive pillar is arranged in the core area;
forming a mask layer, wherein the mask layer covers the dielectric layer, the first conductive pillar, the second conductive pillar and a portion of the third conductive pillar, and exposes a top surface of a portion of the third conductive pillar;
etching a portion of a thickness of the third conductive pillar by using the mask layer as a mask to form a third lower conductive pillar and a third upper conductive pillar stacked on one another, wherein an area of a top surface of the third lower conductive pillar is greater than an area of a top surface of the third upper conductive pillar, and wherein the third upper conductive pillar, the third lower conductive pillar and the dielectric layer are configured to form at least one groove; and
forming a cover layer filling the at least one groove, wherein the cover layer exposes the top surface of the third upper conductive pillar;
wherein before the forming the first conductive pillar, the second conductive pillar and the third conductive pillar, using a mask to etch the dielectric layer to form a first through hole, a second through hole, and a third through hole, the first through hole is arranged in the array area, the second through hole is arranged in the peripheral area, and the third through hole is arranged in the core area, the first through hole, the second through hole, and the third through hole are formed in the same operation;
filling the first through hole, the second through hole, and the third through hole to forming the first conductive pillar, the second conductive pillar and the third conductive pillar respectively.
2 . The method for manufacturing the semiconductor structure of claim 1 , wherein the third upper conductive pillar is configured to form one groove.
3 . The method for manufacturing the semiconductor structure of claim 2 , wherein all sidewalls of the third upper conductive pillar are configured to form the groove, and the groove surrounds the third upper conductive pillar.
4 . The method for manufacturing the semiconductor structure of claim 2 , wherein three sidewalls of the third upper conductive pillar are configured to form the groove, or two connected sidewalls of the third upper conductive pillar are configured to form the groove, or one sidewall of the third upper conductive pillar is configured to form the groove.
5 . The method for manufacturing the semiconductor structure of claim 1 , wherein the third upper conductive pillar is configured to form two grooves, and two respective opposite sidewalls of the third upper conductive pillar are respectively configured to form the two grooves.
6 . The method for manufacturing the semiconductor structure of claim 1 , wherein a ratio of the area of the top surface of the third upper conductive pillar to the area of the top surface of the third lower conductive pillar is less than 4/5.
7 . The method for manufacturing the semiconductor structure of claim 1 , wherein a ratio of an etching depth of the at least one groove to the thickness of the third conductive pillar is greater than 1/5.
8 . The method for manufacturing the semiconductor structure of claim 1 , wherein the base is provided with a plurality of active areas, and the plurality of active areas are electrically connected to the first conductive pillar, the second conductive pillar and the third conductive pillar.
9 . The method for manufacturing the semiconductor structure of claim 1 , wherein forming the cover layer comprises: forming an initial cover layer covering the dielectric layer, the first conductive pillar, the second conductive pillar, the third upper conductive pillar, and the third lower conductive pillar, and removing a portion of the initial cover layer to expose a top surface of the first conductive pillar, a top surface of the second conductive pillar and the top surface of the third upper conductive pillar, wherein a remaining portion of the initial cover layer forms the cover layer.