Semiconductor devices including contacts and conductive line interfaces with contacting sidewalls
Disclosed is a semiconductor device comprising a substrate, a first dielectric layer and a second dielectric layer that are sequentially stacked on the substrate, a contact that penetrates the first dielectric layer and extends toward the substrate, and a conductive line that is provided in the second dielectric layer and electrically connected to the contact, The conductive line extends in a first direction. The contact comprises a lower segment in the first dielectric layer and an upper segment in the second dielectric layer. A width in a second direction of the conductive line decreases with decreasing distance from the substrate. The second direction intersects the first direction. A sidewall of the upper segment of the contact is in contact with the conductive line.
1. A semiconductor device, comprising:
a substrate;
a first dielectric layer and a second dielectric layer that are sequentially stacked on the substrate;
a contact that penetrates the first dielectric layer and extends toward the substrate, the contact including a lower segment in the first dielectric layer and an upper segment in the second dielectric layer; and
a conductive line extending in a first direction in the second dielectric layer and electrically connected to the contact,
wherein a sidewall of the upper segment of the contact is in contact with the conductive line,
wherein a width of the upper segment of the contact in a second direction increases with decreasing distance from the substrate, the second direction intersecting the first direction,
wherein a width of the conductive line in the second direction decreases with decreasing distance from the substrate, and
wherein a minimum width in the second direction of the conductive line is less than a maximum width in the second direction of the upper segment of the contact.
2. The semiconductor device of claim 1 , wherein the sidewall of the upper segment of the contact comprises a first part in contact with the conductive line and a second part in contact with the second dielectric layer.
3. The semiconductor device of claim 1 , wherein the conductive line completely covers the sidewall of the upper segment of the contact.
4. The semiconductor device of claim 1 , wherein, when viewed in plan, a top surface of the upper segment of the contact is surrounded by the sidewall of the upper segment of the contact.
5. The semiconductor device of claim 1 , wherein a width of the lower segment of the contact in the second direction decreases with decreasing distance from the substrate.
6. The semiconductor device of claim 1 , further comprising a barrier layer between the first dielectric layer and the lower segment of the contact.
7. The semiconductor device of claim 1 , wherein the sidewall of the upper segment of the contact comprises a first part in contact with the conductive line and a second part in contact with the second dielectric layer.
8. The semiconductor device of claim 1 , wherein a maximum width in the second direction of the conductive line is greater than the maximum width in the second direction of the upper segment of the contact.
9. The semiconductor device of claim 1 , wherein, when viewed in plan, a top surface of the upper segment of the contact is surrounded by the sidewall of the upper segment of the contact.
10. The semiconductor device of claim 1 , wherein a width of the lower segment of the contact in the second direction decreases with decreasing distance from the substrate.