IP Library Granted Patent US 10,535,841
Granted Patent B2
US 10,535,841 · App. 15/816,896 · Granted Jan 14, 2020

Organic light emitting diode device, display device and manufacturing method of the organic light emitting diode device

Inventors: Chang Yen Wu (Beijing, CN); Wei Quan (Beijing, CN); Chengyuan Luo (Beijing, CN); Juanjuan You (Beijing, CN)
Assignee: BOE TECHNOLOGY GROUP CO., LTD.
H01L51/5271H01L51/56H01L51/5234H01L51/5275
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Quick Facts
Patent No.
US 10,535,841
App. No.
15/816,896
Granted
Jan 14, 2020
Kind
B2
Abstract

An organic light emitting diode device, includes a substrate, and a first electrode, an organic layer and a second electrode successively arranged on the substrate, wherein the first electrode and the second electrode are both transparent electrodes; the organic light emitting diode device further includes a metal packaging layer, wherein the metal packaging layer is located on a side of the second electrode back to the first electrode, and a surface of the metal packaging layer facing the second electrode is a rough surface.

Claims (17)

1. A manufacturing method of an organic light emitting diode device, comprising:

forming a substrate;

forming a first electrode, an organic layer and a second electrode on the substrate successively; and

forming a metal packaging layer on a side of the second electrode away from the first electrode, wherein a surface of the metal packaging layer facing the second electrode is a rough surface,

wherein, the step of forming a metal packaging layer on a side of the second electrode away from the first electrode comprises:

forming a metal film on a carrier substrate; and

separating the metal film from the carrier substrate, and attaching the metal film to a side of the second electrode away from the first electrode,

and wherein, after the step of forming a metal film on a carrier substrate, and before the step of separating the metal film from the carrier substrate and attaching the metal film to a side of the second electrode away from the first electrode, the manufacturing method of the organic light emitting diode device further comprises:

roughening a surface of the metal film away from the carrier substrate.

2. The manufacturing method of the organic light emitting diode device according to claim 1 , wherein, after the step of forming a first electrode, an organic layer and a second electrode on the substrate successively, and before the step of forming a metal packaging layer on a side of the second electrode away from the first electrode, the manufacturing method of the organic light emitting diode device further comprises:

forming a light matching layer on a surface of the second electrode away from the first electrode.

3. The manufacturing method of the organic light emitting diode device according to claim 2 , wherein, the step of forming a light matching layer on a surface of the second electrode away from the first electrode comprises:

forming a solid film; and

attaching the solid film to the surface of the second electrode away from the first electrode.

4. The manufacturing method of the organic light emitting diode device according to claim 2 , wherein, the step of forming a light matching layer on a surface of the second electrode away from the first electrode comprises:

forming a light matching film on the surface of the second electrode away from the first electrode by coating or printing; and

curing the light matching film by UV irradiation or thermal curing.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 17, 2017
From: WU, CHANG YEN; QUAN, WEI; LUO, CHENGYUAN; YOU, JUANJUAN
To: BOE TECHNOLOGY GROUP CO., LTD.
Reel/Frame 044165/0521 →
Priority Claims (1)
CN 2017 1 0295471 · Apr 28, 2017 · national
Continuity (1)
Related Publication 20180315958A1 · Nov 1, 2018