Layout design system and semiconductor device fabricated using the same
A semiconductor device is provided. A semiconductor device includes a filler cell including first and second insulating structures, the first and second insulating structures extending in a first direction, the filler cell being defined by first cell boundaries; and a neighboring cell including a third insulating structure, the third insulating structure extending in the first direction, the neighboring cell being adjacent to the filler cell in the first direction and defined by second cell boundaries, wherein the first and second insulating structures are spaced apart from one another in a second direction, is the second direction being perpendicular to the first direction.
1. A semiconductor device, comprising:
a filler cell including first and second insulating structures, the first and second insulating structures extending in a first direction, the filler cell being defined by first cell boundaries; and
a standard cell neighboring the filler cell, the standard cell including a third insulating structure, the third insulating structure extending in the first direction, the neighboring standard cell being adjacent to the filler cell in the first direction and defined by second cell boundaries,
wherein the first and second insulating structures are spaced apart from one another in a second direction, the second direction being perpendicular to the first direction,
the first insulating structure is connected to the third insulating structure, and
the second insulating structure is not connected to the third insulating structure.
2. The semiconductor device of claim 1 , wherein at least one of the first and second insulating structures is spaced apart from the first cell boundaries in the second direction.
3. The semiconductor device of claim 1 , wherein
the first insulating structure is spaced a first distance apart from a first cell boundary on a first side of the filler cell in the second direction, and
the second insulating structure is spaced a second distance apart from the first cell boundary on the first side of the filler cell in the second direction, and
the second distance is different from the first distance.
4. The semiconductor device of claim 1 , wherein the first and second insulating structures do not overlap with each other in the second direction.
5. The semiconductor device of claim 1 , wherein
the filler cell further includes fourth and fifth insulating structures, extending in the first direction,
the first and second insulating structures are with a first gap therebetween in the second direction; and
the fourth and fifth insulating structures are with the first gap therebetween in the second direction.
6. The semiconductor device of claim 5 , wherein the fourth and fifth insulating structures do not overlap with each other in the second direction.
7. The semiconductor device of claim 1 , wherein the standard cell includes an active region having at least one of a switch region of a power gating cell or a buffer region of the power gating cell.
8. The semiconductor device of claim 7 , wherein the active region is a PMOS switch region of the power gating cell.
9. A semiconductor device, comprising:
a first filler cell including first and second insulating structures, the first and second insulating structures extending in a first direction, the first filler cell being defined by first cell boundaries; and
a first standard cell neighboring the first filler cell, the first standard cell including a third insulating structure, the third insulating structure extending in the first direction, the first standard cell being adjacent to the first filler cell in the first direction and defined by second cell boundaries,
wherein the first and second insulating structures are spaced apart from each other in a second direction that is perpendicular to the first direction,
wherein the first insulating structure is connected to the third insulating structure and the second insulating structure is not connected to the third insulating structure,
wherein the first and second insulating structures do not overlap with each other in the second direction.
10. The semiconductor device of claim 9 , wherein at least one of the first and second insulating structures is spaced apart from the first cell boundaries in the second direction.
11. The semiconductor device of claim 9 , wherein
the first insulating structure is spaced a first distance apart from a first cell boundary on a first side of the first filler cell in the second direction, and
the second insulating structure is spaced a second distance apart from the first filler cell boundary on the first side of the first filler cell in the second direction, the second distance being different from the first distance.
12. The semiconductor device of claim 9 , wherein
the first and second insulating structures extend in the first filler cell.
13. The semiconductor device of claim 9 , wherein
the first filler cell further includes third and fourth insulating structures, the third and fourth insulating structures extending in the first direction,
the first and second insulating structures include a first gap therebetween in the second direction, and
the third and fourth insulating structures include the first gap therebetween in the second direction.
14. The semiconductor device of claim 13 , wherein the third and fourth insulating structures do not overlap with one another in the second direction.
15. A method of fabricating a semiconductor device comprising:
executing machine readable instructions on a processor to generate at least one filler cell for placement between a first standard cell and a second standard cell for a layout of the semiconductor device, the at least one filler cell including first and second insulating structures extending in a first direction, the first insulating structure inline with a third insulating structure in the first standard cell, the second insulating structure not inline with an insulating structure in the second standard cell, the first and second insulating structures being spaced apart from one another in a second direction, the second direction being perpendicular to the first direction; and
fabricating the semiconductor device according to the layout.
16. The method of claim 15 , further comprising:
storing a plurality of candidate filler cells, wherein
the processor is configured to execute the machine readable instructions to store the at least one filler cell in the plurality of candidate filler cells.
17. The method of claim 16 , further comprising:
storing a plurality of intermediate cells, and wherein
the processor is configured to execute the machine readable instructions to exchange at least one of the plurality of intermediate cells for at least one of the plurality of candidate filler cells.
18. The method of claim 16 , further comprising:
storing a plurality of chip design requirements and a plurality of standard cell designs, and wherein
the processor is configured to execute the machine readable instructions to arrange the plurality of standard cell designs and the plurality of candidate filler cells according to the plurality of chip design requirements.
19. The method of claim 17 , wherein
the processor is configured to execute the machine readable instructions to generate the plurality of intermediate cells by arranging standard cell designs according to a chip design requirement.